Organic Substrate Packaging Material Market Research and Forecast Report 2022-2027

1. Global Organic Substrate Packaging Material Market Research and Forecast Report 2022-2027 Author: Elena Anderson Marketing Manager Copyright © IMARC Service Pvt Ltd. All Rights Reserved IMARC Group © 2022 IMARC All Rights Reserved

2. Report DescriptionAbout IMARC Group International Market Analysis Research and Consulting Group is a leading adviser on management strategy and market research worldwide. We partner with clients in all regions and industry verticals to identify their highest-value opportunities, address their most critical challenges, and transform their businesses. IMARC’s information products include major market, scientific, economic and technological developments for business leaders in pharmaceutical, industrial, and high technology organizations. Market forecasts and industry analysis for biotechnology, advanced materials, chemicals, food and beverage, travel and tourism, nanotechnology and novel processing methods are at the top of the company’s expertise. IMARC’s tailored approach combines unfathomable insight into the dynamics of companies and markets with close cooperation at all levels of the client organization. This ensures that our clients achieve unmatchable competitive advantage, build more proficient organizations, and secure lasting results.

3. Report Description and Highlights Report Description Global Organic Substrate Packaging Material Market Research Report 2022-2027: According to the latest report by IMARC Group, titled "Organic Substrate Packaging Material Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027," the global organic substrate packaging materials market reached a value of US$ 13.9 Billion in 2021. Organic substrate packaging materials refer to the base materials that are used in semiconductor applications and manufacturing. They are utilized on the foundation layer of printed circuit boards (PCBs) to act as a conductive interconnect between semiconductors and PCBs. They offer exceptional reliability and enhanced electrical performance while facilitating heat, signal and power distribution. They are also lightweight in nature, which enables them to reduce the weight of PCBs, thereby improving their functionality and dimensional control. They are widely composed of organic small molecules or polymers that are polycyclic aromatic compounds. Their utilization aids in reducing the overall environmental impact of PCBs effectively. Request for a PDF sample of this report: https://www.imarcgroup.com/organic-substrate- packaging-material-market/requestsample

4. Report Description and Highlights Report Description Global Organic Substrate Packaging Material Market Trends: The global market is primarily driven by the increasing uptake of portable electronic devices and an enhanced focus on sustainable development. With the increasing digitization across numerous industries and the rising penetration of affordable consumer electronics, there has been a growing requirement for organic substrate packaging materials across the globe. Moreover, continual advancements in information and communication technology (ICT) and the rising preference for miniature electronic devices across various industry sectors are also acting as major growth-inducing factors. The market is further driven by the widespread utilization of organic substrate packaging materials in the manufacturing of millimeter-wave automotive radar systems for self-driving automobiles. Some of the other factors contributing to the market include significant growth in the semiconductor industry and the rising employment of these materials in system configuration and integration across multiple sectors. Looking forward, IMARC Group expects the market to reach US$ 18.2 Billion by 2027, exhibiting at a CAGR of 4.5% during 2022-2027. View Report TOC, Figures and Tables: https://www.imarcgroup.com/organic-substrate-packaging- material-market

5. Report Description and Highlights Report Description Key Market Segmentation The research report includes the following segments: Breakup by Technology: •Small Outline (SO) Packages •Grid Array (GA) Packages •Flat no-leads Packages •Quad Flat Package (QFP) •Dual in-line Package (GIP) •Others Breakup by Application: •Consumer Electronics •Automotive •Manufacturing •Healthcare •Others

6. Report Description and Highlights Report Description Breakup by Region: •North America •Asia Pacific •Europe •Latin America •Middle East and Africa Competitive Landscape with Key Players: •Amkor Technology Inc. •ASE Kaohsiung (Advanced Semiconductor Engineering Inc.) •Compass Technology Co. Ltd. •Hitachi Chemical Company Ltd. (Hitachi andShowa Denko) •Kyocera Corporation •Mitsubishi Corporation •NGK Spark Plug Co. Ltd. •Shinko Electric Industries Co. Ltd. (Fujitsu) •STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech. Co.) •WUS Printed Circuit Co. Ltd.

7. Key Questions Answered in the Report Report Description 1. How has the global organic substrate packaging material market performed so far and how will it perform in the coming years? What has been the impact of COVID-19 on the global organic substrate packaging material market? What are the key regional markets? What is the breakup of the market based on the technology? What is the breakup of the market based on the application? What are the various stages in the value chain of the industry? What are the key driving factors and challenges in the industry? What is the structure of the global organic substrate packaging material market and who are the key players? What is the degree of competition in the industry? 2. 3. 4. 5. 6. 7. 8. 9.

8. Report DescriptionTable of Contents 1 Preface 2 Scope and Methodology 2.1 Objectives of the Study 2.2 Stakeholders 2.3 Data Sources 2.3.1 Primary Sources 2.3.2 Secondary Sources 2.4 Market Estimation 2.4.1 Bottom-Up Approach 2.4.2 Top-Down Approach 2.5 Forecasting Methodology 3 Executive Summary 4 Introduction 4.1 Overview 4.2 Key Industry Trends 5 Global Organic Substrate Packaging Material Market 5.1 Market Overview 5.2 Market Performance 5.3 Impact of COVID-19 5.4 Market Forecast

9. Report DescriptionTable of Contents 6 Market Breakup by Technology 6.1 Small Outline (SO) Packages 6.1.1 Market Trends 6.1.2 Market Forecast 6.2 Grid Array (GA) Packages 6.2.1 Market Trends 6.2.2 Market Forecast 6.3 Flat no-leads Packages 6.3.1 Market Trends 6.3.2 Market Forecast 6.4 Quad Flat Package (QFP) 6.4.1 Market Trends 6.4.2 Market Forecast 6.5 Dual in-line Package (GIP) 6.5.1 Market Trends 6.5.2 Market Forecast 6.6 Others Click here to visit the complete table of content with list of figures and tables: https://www.imarcgroup.com/organic-substrate-packaging-material-market/toc

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12. Report Description and Highlights Report Description © 2022 IMARC All Rights Reserved This Publication and all it’s contents unless otherwise mentioned are copyrighted in the name of International Market Analysis Research and Consulting (IMARC). No part of this publication may be reproduced, repackaged, redistributed or resold in whole or in any part. The publication may also not be used in any form or by and means graphic electronic or mechanical, including photocopying, recording, taping or by information storage or retrieval, or by any other form, without the express consent of International Market Analysis Research and Consulting (IMARC). Disclaimer: All contents and data of this publication, including forecasts, data analysis and opinion have been based on information and sources believed to be accurate and reliable at the time of publishing. International Market Analysis Research and Consulting makes no representation of warranty of any kind as to the accuracy or completeness of any Information provided. IMARC accepts no liability whatsoever for any loss or damage resulting from opinion, errors or inaccuracies if any found this publication. IMARC, IMARC Group and Global Therapy Insight Series are registered trademarks of International Market Analysis Research and Consulting. All other trademarks used in this publication are registered trademarks of their respective companies.

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