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PACS CRE development

PACS CRE development. Ybe Creten, Patrick Merken, Jan Putzeys, Vic Fonderie, Chris Van Hoof IMEC. Overview. CRE and FEE design and design status CRE/FEE Schedule and milestones CRE and FEE Problems and possible solutions PA/QA: AIV plan and activities PA/QA: Key Inspection Points

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PACS CRE development

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  1. PACS CRE development Ybe Creten, Patrick Merken, Jan Putzeys, Vic Fonderie, Chris Van Hoof IMEC PACS CRE

  2. Overview • CRE and FEE design and design status • CRE/FEE Schedule and milestones • CRE and FEE Problems and possible solutions • PA/QA: AIV plan and activities • PA/QA: Key Inspection Points • Conclusions PACS CRE

  3. CRE design and design status • At IIDR: • CRE input stage in spec (in terms of gain/debiasing, noise and power) • smallest Cint not functional but solution identified • linearity of output stage out of spec but solution identified on separate buffer • QM CRE design iteration • CRE122000 linearity of output stage • CRE032001 smallest Cint • CRE102001 increased dynamic range PACS CRE

  4. CRE design and design status (ctd) • Status of CRE122000/CRE032001 • meet key CRE specifications: • gain/debiasing, noise, power consumption • linearity of output buffer • do not meet • dynamic range (<2V, marginally acceptable) • starting point of integration ramp • smallest Cint linearity (“integrates”) • results of IMEC confirmed by CSL PACS CRE

  5. CRE design and design status (ctd) • Status of CRE102001: • in addition meets dynamic range requirement • shows smallest Cint approaching linearity spec (absolute value tbc) CRE102001 CRE032001 PACS CRE

  6. CRE Substrate design and design status • QM_1 without shortcircuit resistors (baseline design) • QM_2 model (featuring additional resistors) • Two production runs • with BCB (adhesion deficient) • without BCB (_NB) to deliver sufficient assemblies • QM_3 model made (to accommodate interface changes) • Available (no BCB version) PACS CRE

  7. Harness Substrate design and design status • Harness QM_1 (baseline design) • Harness QM_2 model (and QM_2NB without BCB) • Harness QM_3 model in preparation = FM model additional reference lines and reduced (3) temperature sensor connections ; FM harness substrates scheduled for April 2002 PACS CRE

  8. FEE status • Multiple FEE assemblies made • QM_1 FEE delivered 6 July 2001 • 8 CRE082000 on QM_1 substrate delivered • QM_2 FEE failed • 6 CRE032001 on QM_2 substrate shorted during bonding • QM_2 FEE recovery • 3 CRE032001 on QM_2 substrate tested and delivered to MPE in November 2001 • 3 CRE032001 on QM_2_NB substrate in stock (different R_mirror) • 13 CRE032001 on QM_2_NB assembled, tested and delivered to CSL (December 2001) • QM_3 FEE • 25 CRE102001 on QM_3 substrate (29 in process) • plan: phased assembly/test/delivery until Jan. 2002 • 29 assembled in February 2002 • Presently in test • Full delivery mid March 2002 PACS CRE

  9. Schedule and Milestones M1 met M2 met M3 met 12/2001 M4 moves to 03/2002 M5 moves to 04/2003 PACS CRE Delayed start date TBC

  10. Schedule: Implications of FM delivery date • Counting back from FM delivery date FM tapeout today 11/07/02 29/10/02 6/02/03 11/04/03 06/01/03 CRE FM design 1 month CRE pretest 2 months FEE assembly/test 2 months CRE production Answers needed to several questions ! - absolute value Cint and background - Iout and Coutput adapation/redesign - latch-up tests on 12 modules - QM test results PACS CRE

  11. (Possible+Encountered) Problems and possible solutions PACS CRE

  12. PA/QA: AIV and Test plan • A general overview of the manufacturing of the FEE and Harness substrates: document PACS-IM-PL-001. • Incoming inspection of parts and materials which are used during the manufacturing/assembly of the FEE and Harness substrates: document PACS-IM-PL-002. • The assembly of the FEE substrates: document PACS-IM-PL-004 (draft). • Verification of the performance of the FEE: document PACS-IM-PR-001. • Critical items list: input provided • FMECA: input provided PACS CRE

  13. PA/QA: AIV and Key Inspection Points • FEE: each FEE is tested at room temperature and at 4 Kelvin. This test will indicate any error in bonding, resistor value, electrical connectivity, etc. • Harness substrate: Each harness substrate will be visually inspected before packaging (‘packing’). PACS CRE

  14. Conclusions • FEE deliveries • 3 FEE on QM_2 delivered for detector tests • 13 FEE on QM_2NB delivered for module tests • 25 FEE on QM_3 delivery pending (assembled and partially tested/accepted) • ‘Forced’ delay in start of FEE FM design. No ‘idle time’ due to this delay: • design/test: • of QM FEE in sufficient detail • for correction/change of Cint • assembly/inspection: • destructive bond-strength testing on spare FEE modules • ECP for modified CRE substrate and harness substrate • verification: cryogenic radiation setup and testing • AIV and test plans available PACS CRE

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