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LHCb Summary of Project Status

LHCb Summary of Project Status. LHCb Management Board Meeting, RAL, 1/5/01. Neville Harnew. Outline of the talk. RICH Vertex Locator Magnet (v.brief) Computing Status of TDRs Collaboration issues Summary. 1) RICH. February 2001: Technical Design Report has been

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LHCb Summary of Project Status

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  1. LHCb Summary of Project Status LHCb Management Board Meeting, RAL, 1/5/01 Neville Harnew

  2. Outline of the talk • RICH • Vertex Locator • Magnet (v.brief) • Computing • Status of TDRs • Collaboration issues • Summary

  3. 1) RICH February 2001: Technical Design Report has been approved by the Research Board Status of UK work RICH-1 mechanics : G.Barber RICH-2 mexhanics : P.Soler Photodetector test facilities : F.Muheim RICH Electronics : J.Bibby

  4. Baseline option Pixel HPD 1024 pixel (500mm500mm) detector and bump bonded pixel readout electronics. Photocathode deposition and anode encapsulation at DEP. Significant concern now is: final choice of the photon detector

  5. 1mV = 50 e 1pe = 5000e pixel chip S/N = 50 v. good! Structure for bump bonding test. Chip does not run above 20 MHz: not so good! However functional and will be encapsulated by August. Revised submission in June. Situation will be reviewed in October 2001. Backup is the MAPMT : UK solely working !

  6. With: a better resolution for the track angle measurements at low p. not too important for RICH-2 Without: RICH-2 can be extended  more Cherenkov photons - Necessity of ST11 is being discussed. - Re-examination of the stations. An example: Station 11 is designed for RICH-2

  7. 2) Vertex Locator : T.Bowcock (TDR May 2001) Baseline sensor technology defined 300mm n-on-n single sided Si with double metal layer Radiation hard readout chip Two options: SCTA-VELO based on DMILL technology design fulfilling all the requirements submitted in November 2000 or: BEETLE based on 0.25mm technology development in progress

  8. VELO mechanics  closely linked to the machine Openings for feedthrough flanges (25’000 pins) Vertex detector half 25 cm RF/Vacuum thin shield 120 cm Exit window 1.5-2 mm thick Al Cooled Si sensors in secondary vacuum Regular reviews by the LHC machine group: 1st review: 3-4 April 2001 (very positive and constructive) 2nd review foreseen in February 2002

  9. Evolution of the beam pipe design Al pipe + Stainless steel flanges and bellows  Al pipe + Al flanges and bellows  Al-Be alloy pipe + Al flanges and bellows (LHCb favoured solution)

  10. Extrusion trial of the Al conductor 3) Magnet Three contracts Al conductor: Holton Machinery LTD, UK Coil construction: SigmaPhi, France Iron for yoke: Jebens, Germany wereplaced and signed.

  11. 4) Computing (N.Brook) Offline effort Framework (GAUDI) and Reconstruction (BRUNEL) in place. Simulation (GEANT4) effort has started. Event Display integrated in GAUDI + GEANT4 ALSO : Leading role in UK GRID activity

  12. 5) STATUS OF TDRsMagnet Out to tenderVELO May 2001RICH Approved Feb 2001Inner Tracker December 2001All Si solution is preferred if we can affordit. Outer Tracker September 2001Calorimeter System Approved Feb 2001Trigger January 2002Muon System May 2001

  13. 6) Collaboration Issues Withdrawal of in-active members Russia: Lebedev Institute Germany: Humboldt University, Freiburg University New Collaborators from Brazil Full member: CBPF Technical Associate: CEFET RJ (host UFRJ) Currently the LHCb collaboration consists of 47 member institutes + 3 technical associates 500 people from 14 countries. MoU signed by France, Germany (MPI), Italy, The Netherlands, Romania, Russia Switzerland (Lausanne, Zurich), UK [80% of funding] Still to be signed by Brazil, China, Germany (BMBF), Poland, Spain, Ukraine

  14. 7) Summary • LHCb good general progress in all areas • 3 TDR’s approved including : Magnet: major components have been ordered RICH: photon detector is the crucial item (MAPMT backup solution available) • VELO TDR will be submitted in May

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