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ECE 477 Final Presentation Group 5  Fall 2005

ECE 477 Final Presentation Group 5  Fall 2005. Roy. Jeffry. Wei Foong. KyeYoon. Paste a photo of team members with completed project here. Annotate this photo with names of team members. Outline. Project overview Block diagram Professional components Design components

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ECE 477 Final Presentation Group 5  Fall 2005

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  1. ECE 477 Final Presentation Group 5  Fall 2005 Roy Jeffry Wei Foong KyeYoon Paste a photo of team members with completed project here. Annotate this photo with names of team members.

  2. Outline • Project overview • Block diagram • Professional components • Design components • Success criteria demonstrations • Individual contributions • Project summary • Questions / discussion

  3. Project Overview Intelligent Mailbox System (IMS) • Fingerprint identification security system • New mail/package notification through e-mail • Embedded web server to host account management interface for the mailbox system • Targeted towards university dormitories and P.O. Boxes

  4. Block Diagram

  5. Professional Components • Overview • Constraint analysis and component selection rationale • Patent liability analysis • Reliability and safety analysis • Ethical and environmental impact analysis

  6. Constraint Analysis • Interface Requirements - Embedded web server, sufficient number of GPIO • Power supply - MCU (3.3V), Solenoid (12V), and sensors (5V) with more than 1.0A supply • Memory constraint - Sufficient flash memory for embedded web server • Budget constraint - Less than $1,000

  7. Component Selection Rationale Main Microcontroller • MC9S12NE64 (70 GPIO) • Ethernet interface • 8KB RAM, 64KB of Flash (Operating voltage: 3.3V) • Familiarity with peripherals and instructions set

  8. Component Selection Rationale • MC9S08GT32 (48 pins) • Operating voltage (1.8-3.6V) • Simple MCU (8 bit MCU) • Familiarity with peripherals and instructions set

  9. Component Selection Rationale Biometric ModuleAT77SM0101BCB02VKE • Includes enrollment, authentication software • Operating voltage (3.3 V) • SDRAM 128Mb and dataflash 32Mb (store more than 150 fingerprints) • Finger scanner included • Quick matching and identification time (< 10ms & < 1s)

  10. Patent Liability Analysis • Results of patent search (Literal infringement): • Electronic access control mail box system (US Patent #5,475,378) • Similar overall operation and functionality • Location of database • Method used for authentication

  11. Patent Liability Analysis • Results of patent search (Doctrine of equivalence): • Networked digital locker lock system (US Patent #6,791,450) • Similar implementation details and functionalities • Could use biometric identification • Processor units are Ethernet capable

  12. Patent Liability Analysis • Action recommended • Emphasize IMS’ ability to sense incoming mails and sends out e-mail notifications • If patent lawyer disagrees, then agree to a reasonable royalty fee with the patent owners

  13. Reliability/Safety Analysis • Reliability Analysis • Components which would generate more heat • Critical for the whole system operation • Five components analyzed • Linear Regulator (LP3872EMP-3.3) and Switching Regulator (LM2591HVS-5.0) • MTTF = 4.30275 x 105 hours • Power MOSFET (IRL530N) (Most likely to fail) • MTTF = 1.955 x 105 hours • Main MCU (9S12NE64) • MTTF = 2.73373 x 106 hours • External MCU (9S08GT32) • MTTF = 5.753 x 106 hours

  14. Reliability/Safety Analysis • FMECA Analysis • Power supply • Power regulator malfunction would damage MCU (high criticality) • Main MCU • MCU malfunction would disrupt the web server and mailboxes operation (High criticality) • External board MCU • Would disrupt the use of the mailbox (High criticality) • Biometric module • Would not identify the mailbox owner • Solenoid circuit • Would not open the mailbox’s door • Sensor circuit • Would not sense new mail

  15. Ethical/Environmental Analysis • Ethical Impact of IMS Challenges Security failure of IMS due to hardware and software malfunctioning Solutions • Life cycle of sensors and fingerprint scanner • Operating condition of sensors and fingerprint scanner • User education through user manual

  16. Ethical/Environmental Analysis • Environmental Impact of IMS Challenges • Lead from printed circuit board • Aluminum mailbox waste Solutions • Reclaim hazardous materials used in PCB fabrication process • Aluminum recycling

  17. Design Components • Packaging design considerations • Schematic design considerations • PCB layout design considerations • Software design considerations

  18. Packaging Design • Packaging Consideration: • Security • Mailboxes made of steel • Solenoid lock for securing the mailbox • Easy access • Controller box located near the mailboxes.

  19. Packaging Design Back view Mail slit Authorized LED Package LED Mail LED New package Pushbutton Front view Mailbox module

  20. Packaging Design Solenoid circuit RJ-45 jack Power jack Finger scan pushbutton Controller box Finger scanner Phototransistor Distance sensor

  21. Schematic Design (Main Board)

  22. Schematic Design External Board

  23. Schematic Design Power supply circuit (External Board) Power supply circuit (Main Board)

  24. Schematic Design Sensors and solenoid (External Board)

  25. PCB Layout Design Main Board • Female headers for biometric module • Ethernet jack • Power regulator (5V to 3.3V) External Board • Headers for door sensor, mail sensor, and package sensor • Power regulators (12V to 5.0V, 5.0V to 3.3V)

  26. PCB Layout of Main Control Module

  27. PCB Layout of Mailbox Module

  28. Final Circuits Main controller board and biometric module 3 identical circuits mounted under each mailbox

  29. Software Design • Main board • HTTP Server • SMTP Server • Account Management Website • External board interface • Biometric module interface

  30. Software Design • External boards • Distance sensors • Door sensors • Solenoid controls • Main board interface

  31. Software Design • Atmel Biometric Module • BioEngine Enroll • BioEngine Identify • Main board interface

  32. Software Design IMS login page

  33. Software Design IMS main page

  34. Success Criteria Demonstrations • Ability to detect presence of mail in box using optical sensors - demo • Ability to securely lock and unlock mailbox using solenoid - demo • Ability to send e-mail notification of changes in mailbox status - demo • Ability to sense door opened/closed status using phototransistor sensor - demo • Ability to configure mailbox system remotely via an embedded web server - demo

  35. Individual Contributions • Team Member 1 – Wei Foong Thoo • Team Member 2 – Sia Jeffry Saputra • Team Member 3 – Kye Yoon Park • Team Member 4 – Roy Chung

  36. Member 1 – Wei Foong Thoo • IMS Account Management web site • SMTP code development • I2C code development • PCB layout and population • Hardware debugging • Assembly of main controller box • Team website development • Parts ordering and organization • Patent Liability Analysis • Software Design Considerations

  37. Member 2 – Sia Jeffry Saputra • Packaging design • Reliability analysis • IIC code development • Web server and SMTP code development • PCB population • Hardware integration • Component selection • IMS account management website • Web site development • Software module integration

  38. Member 3 – KyeYoon Park • Constraint Analysis • Parts selection • Schematic Design • PCB Layout and Population • Software/Hardware Debugging • Packaging • Biometric module (FingerChip) software Development

  39. Member 4 – Roy Chung • PCB layout analysis • Ethical and Environmental analysis • External board software module • PCB population • Packaging for main controller box and external boards • Hardware debugging • Hardware integration • Custom library for schematics and PCB

  40. Project Summary • Important lessons learned • Importance of time management • Check for sample availability before ordering parts • Surface mount components vs. Thru-hole components

  41. Project Summary Second iteration enhancements • Implement IIC communication protocol • Enhance the account management web site • Improve packaging (circuit enclosures) • Make the system more reliable by reducing noise in signals

  42. Questions / Discussion

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