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HDP User Group International, Inc. Optical Interconnect

HDP User Group International, Inc. Optical Interconnect. Date of Presentation Project in the Definition Stage. © HDP User Group International, Inc. Optical Backplane Interconnect. 2. © HDP User Group International, Inc. Purpose. Chances for optical interconnect

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HDP User Group International, Inc. Optical Interconnect

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  1. HDP User Group International, Inc.Optical Interconnect • Date of Presentation • Project in the Definition Stage © HDP User Group International, Inc.

  2. Optical Backplane Interconnect 2 © HDP User Group International, Inc.

  3. Purpose Chances for optical interconnect • To meet the ever increasing bandwidth demands, we need higher data rate, higher channel density and longer interconnect link length in telecom and datacom systems. • For electronic interconnect, there are some fundamental obstacles (such as loss, crosstalk, reflection and parasitics) to block it meeting the increasing bandwidth demands • In the near future, the cost of electronic interconnect will exceed the cost of optical interconnect, and optical interconnect will be the preferred solution for short-range interconnect (rack-to-rack, backplane, inter-board, and even inter-chip). • Optical PCB technology has been researched for many years, and some groups have already built some optical backplane prototypes. Optical backplanes will be very likely to be applied in high speed systems in the future 5~10 years. © HDP User Group International, Inc.

  4. Challenges for optical interconnect Although optical PCB technology has been researched for many years, some related technologies are still not mature • Waveguide fabrication at production scale • Optical PCB fabrication • Optical coupling (such as device-board and board-to-backplane) • Assembly • Optoelectronic devicesin standard ”IC-like” packages used in optical PCB • Reliability (waveguide, connector, OE device, packaging materials, and system-level qualification) • Test vehicles… • Testing methods, equipments and applied standards These obstacles need to be removed before optical PCB technology can be Applied in industry. 4 © HDP User Group International, Inc.

  5. The key objectives of the project is to: • Survey the technologies bottleneck in optical interconnect . • Compare key technologies with experimental qualification or proof-of-concept demos. • Define an optical backplane Interconnect prototype. • Assemble an optical backplane Interconnect demonstrator and test. • Establish optical backplane Interconnect practice application guidelines. • Pave the way for deployment of optical backplane interconnect technologies into applications where it is superior to electronic signal transmission. 5 © HDP User Group International, Inc.

  6. Project Goals 1. Complete survey on existing and emerging short-range (backplane level and board level) optical interconnect technologies for technology benchmark and roadmap including Technical status and available components for • Devices and O/E-packages (inc. OE-devices, driving electronics, OE-packages) • Coupling interfaces (incl. device-board, board-to-BP, board-to-board, off-board/BP) • Substrates and integration technologies (inc. OE boards, OE-Backplanes, materials) • Current technical status in each building block • Design practice • Qualification & Standards Technology Roadmap • Applications and product examples • Benefits, challenges, limitations • Technical problems or roadblocks • Competing technologies or alternatives • Significant IPs & Patents © HDP User Group International, Inc.

  7. 2. Design, manufacture and qualify optical interconnect model design/ test vehicle to analyze the feasibility, reliability and cost effectiveness of O/E technology • Target application/ product case (electrical benchmark if possible) • Definition & specifications • Design, modelling & simulation • Selection of devices, couplers & connectors, materials, package types & methods • Fabrication of test vehicles • Qualification & reliability testing • Cost model & analysis 3. Publish report on Technology benchmark & roadmap, project results and design guidelines. 7 © HDP User Group International, Inc.

  8. Technical Discussion 6 1 5 2 2 3 4 7 6 5 1 3 Structure of one optical backplane system • Legend: • Couping interface(device-Board) • Waveguide in board • Board to Backplane Connection • Waveguide in Backplane • Transceiver module (VCSEL/PD, laser driver, TIA) • Board • Backplane 8 © HDP User Group International, Inc.

  9. Some requirements for optical backplane • Optical interconnect need to co-exist with electrical interconnect on a substrate; • The methods used for manufacturing optical backplane and the tolerance involved should be compliant with those of electrical backplane ; • Assembly should be simple; • Optical alignment (optical device to connector, connector to board, board to backplane) should be passive; • Optical Connectors need to be pluggable and co-exist with electronic Connectors on a board, and have reasonable alignment tolerance; • Thermal, mechanical, chemical stability； • Cost of optical solution should be comparable to that of electrical solution。 9 © HDP User Group International, Inc.

  10. Key technologies and challenges involved in optical • Backplane: • Waveguide and optical PCB manufacturing • Optoelectronic device • Optical coupling device and optical connector • Assembly • Testing and reliability assessment of optical PCB assembly 10 © HDP User Group International, Inc.

  11. 1. Waveguide and optical PCB manufacturing • Waveguide material • polymer (Acrylate , Epoxy, Polysiloxane, Siloxane …) • glass • Waveguide fabrication techniques • Photolithography • Injection molding • Direct laser writing • Laser ablation… • Requirements for waveguide and optical PCB fabrication technology • Low intrinsic loss and waveguide propagation loss • Thermal, mechanical, chemical stability • Low waveguide aging loss (during at least 10 years) • Compatibility for processes and materials 11 © HDP User Group International, Inc.

  12. Routing capability (straight, bends, crossings, tapering, splitting) • Large area waveguide processing capability • High density waveguide processing capability (single layer and multilayer) • Lamination compatibility (adhere to various materials, particularly FR4) • Temperature compatibility with standard PCB lamination and soldering process • High accurancy of waveguide fabrication and PCB lamination process • Testing and quality control during process • Maturity of the technology 12 © HDP User Group International, Inc.

  13. 2. Optoelectronic device • Key indexes for OE device: • Power consumption (mW/Gpbs) • Channel data rate • Number of channels per module (parallel, not WDM) • Dimension • Optical port density • Transmitter output power • Receiver sensitivity • Operating wavelength • Reliability • Package and interface • Electrical interface: BGA, LGA… • Optical interface：MT, free space… • Cost 13 © HDP User Group International, Inc.

  14. The optical interface of OE device is a pivotal aspect, and it is very dependent on the coupling structure between OE device and board. a assembled 12-channel transmitter module [1] a optical sub-unit [2] [1] IBM’s research, “Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications”, IEEE. [2] Project “FutureBoard”, “Electro-optical circuit boards using thin-glass sheets with integrated optical waveguides”, SPIE. 14 © HDP User Group International, Inc.

  15. 3. Optical coupling device and optical connector • Optical coupling (transmitter-to-waveguide, board-to-backplane, waveguide-to-receiver) is one of the key challenges of optical PCB Technology. The coupling loss should as low as possible. • There are two typical coupling scheme for optical coupling between waveguides and OE devices: • Butt-coupling • Using beam 90°deflecting optics Better choice Beam 90°deflection Butt-coupling 15 © HDP User Group International, Inc.

  16. Reflection mirror for beam 90°deflection can be on waveguide or on coupling device. Better scalability for multilayer application reflection mirror on waveguide reflection mirror on coupling device 16 © HDP User Group International, Inc.

  17. Requirements for coupling device and connector • Low coupling loss; • High precision alignment structure ; • Small geometric dimensions, require small board space, allow small slot pitch; • Simple assembly method, passive alignment; • Co-exist with electrical backplane connectors in the same slot. • Pluggable, reworkable • The tolerance involved is compliant with current PCB manufacturing tolerance • Reliable high precision connection with immunity to movements between board and backplane 17 © HDP User Group International, Inc.

  18. 4. Assembly • Simply assembly method, compatible with electronic PCB manufacturing. • Small misalignment guaranteeing low coupling loss • transmitter-to-board (waveguide) • Board (waveguide)-to-Backplane (waveguide) • Board-to-Receiver • Mechanical robustness of the overall interconnection system 18 © HDP User Group International, Inc.

  19. 5. Testing and reliability assessments • Waveguide, O-PCB, OE-Module and O-PCB-A testing procedures, equipment, standards and methods • Short- and long-term reliability assessment • Failure modes and mechanisms under changing environmental conditions (ATS, HTS, DHH,…) • Pb-free compliance, Telcordia compliance,… • Reliability challenges in the overall O/E interconnection system • Test vehicle for reliability assessment 19 © HDP User Group International, Inc.

  20. Project Execution Plan • Project will be divided into four phases: • Phase1: Benchmark survey and specification definition • Phase2: Piece-part technologies research • Phase3: Demonstrator integration and test • Phase4: Project report 20 © HDP User Group International, Inc.

  21. Phase 1: Benchmark survey and specification definition • Tasks list: • Benchmark survey of available technologies • Choose feasible candidates of piece-part technologies • Specification definition of demonstrator and sub-units • Definition of test vehicles, standards and methods 21 © HDP User Group International, Inc.

  22. Phase 2: Piece-part technologiesresearch • Tasks List • Optical interface • Selection of optical Interface configurations for Optoelectronic device, optical coupling device and connector, waveguide and optical PCB • Parameters definition of each optical interface • Waveguide material and components • Selection of waveguide material • Selection of waveguide fabrication technology • Waveguide component fabrication and test • Opto-electric PCB • O/E board design & simulation (optical, thermo-mechanical,..) • Selection of optical layer integration technology • Opto-electric PCB fabrication and test 22 © HDP User Group International, Inc.

  23. Phase 2: Piece-part technologiesresearch (continued) • Tasks list (continued): • Optoelectronic devices and transceiver (Tx/Rx) modules • Design • Fabrication and test • Optical modeling & simulation • Performance estimations for coupling concepts • Ray trace simulation of coupling efficiency & alignment tolerance • Optical coupling device and optical connector • Design • Fabrication, assembly and test Each piece-part technology of this phase maybe needs some runs of optimization. 23 © HDP User Group International, Inc.

  24. Phase 3: Demonstrator integration and test • Tasks List • Demonstrator redefinition • Subassemblies fabrication and test • Optoelectronic transceiver modules • Waveguides and O/E PCBs • Optical coupling device and optical connector • Demonstrator integration and test 24 © HDP User Group International, Inc.

  25. Phase 4: Project report • Tasks List • Establish optical backplane Interconnect practice application guidelines • Complete project report • Issue project report 25 © HDP User Group International, Inc.

  26. Project Execution Timetable 26 © HDP User Group International, Inc.

  27. 27 © HDP User Group International, Inc.

  28. Resources 28 © HDP User Group International, Inc.

  29. Team Members Potential Participants: • 3M, Denny G. Aeschliman, daeschliman1@mmm.com • Alcatel-Lucent, Joe Smetana, joseph.smetana@alcatel-lucent.com • Albemarle, Guillaume Artois, guillaume.artois@albemarle.com • Celestica, Thilo Sack, tsack@celestica.com • Cisco, Wei Xie, weixie@cisco.com • Cisco, Li Li, lili2@cisco.com • Cisco, John Duffy, joduffy@cisco.com • Cisco, Jie Xue, jixue@cisco.com • Conpart, Helge Kristiansen, helge@conpart.no • Ericsson, Alessandro Alquati,alessandro.alquati@ericsson.com • Fujitsu, Tetsuro Yamada,  tyamada@jp.fujitsu.com • Huawei, Danny Tu, tuyunhua@huawei.com • Huawei, Sang Liu, sangliu@huawei.com • Huawei, Xi Jin, zixiking@huawei.com • Huawei, Shaoyong Xiang, xiangshaoyong@huawei.com • Juniper Networks, Mark Marino, mmarino@juniper.net • Meadville, Chris Katzko, chris.katzko@meadvillegroup.com • Meadville, Marika Immonen, Marika.Immonen@meadvillegroup.com • Meadville, Tarja Rapala, tarja.rapala@meadvillegroup.com • Molex • NSN, Dietmar Breisacher, Dietmar.breisacher@nsn.com • National Semiconductor, Hau Nguyen, hau.nguyen@nsc.com • Optical Interlinks, Bruce Booth, lblbooth@opticalinterlinks.com • Promex, Dick Otte, otte@promex-ind.com • Rogers Corporation, Diana Williams, diana.williams@rogerscorporation.com • Reflex Photonics, David Rolston, drolston@reflexphotonics.com • Xyratex 29 © HDP User Group International, Inc.

  30. Participating companies and contact persons: TBD Project leader: TBD HDP User Group Staff Facilitator: Jack Fisher © HDP User Group International, Inc.

  31. Active Optical cable (AOC) 31 © HDP User Group International, Inc.

  32. Advantages and disadvantages of AOC compared to electrical cable: • Advantages • High Bandwidth • High density • Small size and light weight • Low power consumption • Disadvantages • Costly • Low reliability 32 © HDP User Group International, Inc.

  33. Finisar’s QSFP MSA product: Quadwire CXP MSA There are mainly two kinds of standard AOC, QSFP and CXP. 33 © HDP User Group International, Inc.

  34. Huawei’s proposal on AOC project based on Huawei’s requirements in recent years (with CXP AOC as reference): • Lower power consumption: < 10mW/Gbps per Tx-Rx channel pair (@12.5Gbps) • Higher density: < ¾ size of CXP • Higher data rate: > 12.5Gbps • Fiber length up to 100m 34 © HDP User Group International, Inc.

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