1 / 16

DDR3 Total Solution of Amphenol

DDR3 Total Solution of Amphenol. DDR3 Architecture Roadmap. DDR3 will become the widely adopted memory architecture for computing Architecture in 2008. DDR vs DDR2 vs DDR3. DDR is in line with the computing architecture with the demand for HIGH SPEED

breena
Download Presentation

DDR3 Total Solution of Amphenol

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. DDR3 Total Solution of Amphenol

  2. DDR3 Architecture Roadmap DDR3 will become the widely adopted memory architecture for computing Architecture in 2008.

  3. DDR vs DDR2 vs DDR3 DDR is in line with the computing architecture with the demand for HIGH SPEED and LOWER POWER COMSUMPTION memory solution.

  4. DDR3 Advantage : High Bandwidth • DDR3 memory will provide at least twice the bandwidth of DDR2, with data transfer rates at up to 1.6Gb/s and eventually beyond. Twice the Bandwidth

  5. DDR3 Advantage : Power Saving DDR2 memory is specified for a 1.8V operating voltage while DDR3 memory operates at 1.5V (and maybe 1.35V in future low-power DDR3L devices). Because operating power is proportional to the square of the operating voltage, appreciable drop in operating power—about 30%less! Really Power Saving

  6. Amphenol DDR3 2010 Product Roadmap DDR3 1.35V DIP type Avaible on 2010 Q2 DDR3 240P Very Low Profile DIP ---VP SDRAM module Avaible on 2010 Q2 DDR3 240P SMT type Halgen-free ready DDR3 240P Stand/narrow DIP type New Process & Competitve Version is under way!!!!

  7. AMTA DDR II/III Connectors Overview G637 Series G63724A4XXXEU G63724C4XXXEU Vertical DDR II DIMM 1.0 Pitch 240P T/H Type with metal board lock Fully Buffer DIMM 1.0 Pitch 240P T/H Type with metal board lock G63724B4XXX1EU G63724B4XXXEU Vertical DDR III DIMM With Narrow Latch T/H Type with metal board lock Vertical DDR III DIMM 1.0 Pitch 240P T/H Type with metal board lock G63724B4XXXEU G63724D4XX41EU Available in Q2 2010 Vertical DDR III DIMM SMT Type with metal board lock Very Low Profile DDR III DIMM

  8. Vertical DDR3 Connector with Narrow Latch • Application: • Workstations. • Server. • Storage. • Switches. • Routers. PN: G63724B4XXX1EU T/H Type with metal board lock Product Features: Socket outline and footprint comply with JEDEC SO-007. Accept Module Card conforming to JEDEC MO-269. Solder tail options for PCB thickness from 1.57mm to 2.36mm. Latch color options: Black or White. Housing color options: Black, White or Blue 2935U or 284C. Contact area plating: Gold Flash, 15u” or 30u” gold plating. RoHS compliant, Lead free version available.

  9. Why need the Narrow Latch ? Extractor Fan Air Flow Direction Air Vents Source: SUN The server is ventilated by means of extractor fan and the air vents. The heat will be carried away through heat convection. The DDRX module and connector is close to each other due to the limited space. The heat flow was blocked by the connector housing and latch in the direction of heat flow. The narrow latch can increase the gap between connectors and it will be a great benefit to heat dissipation.

  10. 4.50mm Narrow Latch vs Standard Latch 6.30mm Smooth Surface Smooth Surface Narrow Latch but no smooth surface Narrow Latch The latch with the smooth surface and the rounded edge can increase the velocity of air flow and this will be a great benefit to heat dissipation.

  11. DDR3 Connector with SMT Type • Application: • High Destiny PCB • High efficiency Automation Available Now !!!! PN: G63724B4XXX2EU T/H Type with plastic/metal board lock option Product Features: Latch color options: Black or Blue. Housing color options: Black, White or Blue 2935U or 284C. Contact area plating: Gold Flash, 15u” or 30u” gold plating. HF compliant, Lead free version available.

  12. Why need DDR3 SMT Smaller ,Faster ,Better • Good Performance in High Speed Signal 1.Reduced Labor Cost 2.Enhanced Production Speed Benefit of DDR3 SMT • Increase PCB Component Density • More flexible Routing 1.Good Quality Control

  13. Very Low Profile DDR3 Connector with Narrow Latch • Application: • Blade Server. • Sub 1U Server. • High end ATCA server. Available in Q2 2010 PN: G63724B4XXX1EU T/H Type with metal board lock Product Features: Providing an overall connector height of less than 20.60mm. Accepting VLP DIMM (18.75mm height) with a seating height of less than 2.40mm. Solder tail options for PCB thickness from 1.57mm to 2.36mm. Latch color options: Black or White. Housing color options: Black, White or Blue 2935U or 284C. Contact area plating: Gold Flash, 15u” or 30u” gold plating. RoHS compliant, Lead free version available.

  14. Why Need VL DDR3 Blade Server 1U Rackmount Server Height limit Air Flow Very Low Profile DDR3 Connector Very Low Profile DDR3 Module

  15. Why we need DDR3 1.35 V connector With Low LLCR ,we can reduce the power loss to the maximum and so that fully support DDR3 1.35V module on the ideal performance

  16. AMTA Contact Window • Wesely Huang , Product Manager (Server&Storage Connector) • E-mail: wesely.huang@amphenol.com.tw • TEL: +886-3-2647251 • FAX: +886-3-3275296 • Mobile: +886-919946062 • 5F., NO361, Fusing 1st Rd., Gueishan Township, Taoyuan County 33375, Taiwan (R.O.C)

More Related