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TMC Business Focus: IC Back-end Manufacturing Outsourcing Services & Memory Products Manufacturer

TMC is a leading IC back-end manufacturing and outsourcing services provider, specializing in memory products such as DRAM memory chips & modules, EEPROM, and flash memory cards. With a focus on quality and innovation, TMC aims to be an integral part of its customers' operations.

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TMC Business Focus: IC Back-end Manufacturing Outsourcing Services & Memory Products Manufacturer

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  1. TMC Business Focus • IC Back-end Manufacturing Outsourcing Services • Products Manufacturer and Seller • Memory • DRAM Memory Chips & Modules • EEPROM • Flash Memory Cards (MMC/RS-MMC, SD/Mini-SD) • Other • Multi-die LEDs • SAW Filters (for Digital TV Tuners)

  2. Company Profile History 1995 Dec. Incorporation Date 1997 Apr. IC Manufacturing Service Line Started Dec. Received ISO-9002 Certification 1998 Jun. DRAM Chip and Module Product Line Started 2002 Oct. EEPROM Product Line Started 2004 Dec. Flash Memory Card Product Line StartedIPO (list #8143) 2005 Feb. DDR II Modules (window BGA) Product Line Started Quick Facts Capital Reserves: 36 Million USD (1.2 Billion NT) Floor Plant/Factory: 46,400 ft2 / 207,000 ft2 Assembly Capacity: 115 Wirebonders

  3. Major Stockholders : Five Publicly Traded Companies

  4. Company Location Taipei City CKS Airport Taipei City Hsinchu Industrial Park Hsinchu Science-Based Industrial Park Taichung City Hsinchu Science-Based Park CKS Airport Taiwan Micropaq Corporation Head office in this park Distance to TMC Taipei 47 miles CKS Airport 20 miles Hsinchu Science-Based Industrial Park 7 miles Taichung 58 miles Kaohsiung 176miles Kaohsiung City

  5. TMC's mission is to become an integral part of our customers' operation, to grow together in not only in delivering quality outsourcing services, but in providing the latest memory products as well. To achieve this, TMC has developed a high performance business strategy that involves a two-pronged approach: I. Solid Outsourcing Services Platform - Provide high quality, high yield, timely, and independent assembly, packaging, and testing services (including SMT) for both single-die and multi-die devices II. Constant Product Innovation - Invest on innovation and improvement of new memory packaging technology to take advantage of trends in personal computing, consumer electronics, and communications Doing business with TMC

  6. Board of Directors Chairman Dr. Jin S. Wang President Mr. C.K. Yang Chip Sales Director Fu Outsourcing Services VP Chiang Module Sales Director Hsieh Taipei Sales Office Director Wang TMC Management Chart

  7. Factory I Director Fu Factory II Director Lin Wire-bonding Die-bonding Molding & T/F Testing 4〞Wafer Fab. Quality Control Quality Assurance Reliability Testing Product Control Material Control R&D： L/F & Substrate CAD Design Window BGA LEDs SAW Design TMC Manufacturing Chart Die Probing Chip Testing SMT Module Testing Troubleshooting R&D： Programming Compatibility Testing Platform Quality Control Quality Assurance Product Control Material Control

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