Sugon I840-G25 Server Post-sale training v1.0

1. Sugon I840-G25 Server Post-sale training v1.0 Product Center 2014.10 Computing creates future

2. 1 2 3 4 Contents Introduction of product specifications Introduction of product external interface Fault information capture judgment Introduction of product technology architecture

3. Introduction of product specifications

4. Introduction of product specifications

5. 1 2 3 4 Contents Introduction of product specifications Introduction of product external interface Fault information capture judgment Introduction of product technology architecture

6. Introduction of product technology framework ---Main Board architecture

7. Introduction of product technology architecture-- Processor number and interconnection • Each CPU has 3QPIswith CPUs connected with each other . • The fastest connection speed for each QPI is 8.0 GT/s. • Each CPU has 4SMI2 for connecting JordanCreek. • The fastest transmission speed for each SMI2 is 2.66GT/s.

8. Introduction of product technology architecture—memory control unit • Each CPUsupports 8DDR3channels • Each CPU maximum supports 24DDR3 LR-DIMMs. • IntelSMIGen2maximum broadband2.66 GT/s • Memory controller supports two modes ： • PerformanceMode(High I/O, B/W) • Lockstep Mode (Highest DDR3 Speed)

9. Introduction of product technology architecture---- memory configuration and working frequency • The actual memory working frequency is related with parameters below. • Memory Rankquantity • Memory working voltage • Memorylocationon • the memory board • Terms explanation： • SR：SingleRank • DR：DualRank • QR：QuadRank • SG：StretchGoals Note：The memory working voltage of current mainstream is 1.35 V.

10. Introduction of product technology architecture --- The installation of the memory board and memory. • The system can maximum support 8 memory boards and 96 DDR3DIMMs. • Memory board specifications： • Including 2 JordanCreekC104chips • Maximum supporting 12 DIMMs • 4  memory channels • Memory installation order： Blue slot is priority (DIMMA1DIMMB1DIMMC1DIMMD1)

11. Introduction of product technology architecture --- The corresponding relation of memory and CPU • Each CPUsupports 2 memory boards，4JordanCreek, 8Channeland 24DDR3DIMMs. When configuring 4 CPUs and 4 memory boards，recommend using P1M2/P2M1/P3M2/P4M1 (Maximum IO utilization) (supporting 11PCIeSlots)

12. Introduction of product technology architecture - -- The corresponding relation of PCIE Slot and CPU Note：Please pay special attention to SLot5, Slot6 and Slot7. Because the three slots have relations with the memory board quantity. For the detailed configuration, please refer to appendix A.

13. Introduction of product technology architecture- IO module backplane specifications

14. 1 2 3 4 Contents Introduction of product specifications Introduction of product external interface Fault information capture judgment Introduction of product technology architecture

15. Introduction of product external interface-----  Front panel functions Front panel 24x 2.5” SAS/SATA HDDs

16. Introduction of product external interface----Back panel functions Installation position of GPU cooling fan. When configuring GPU, it can make additional cooling fans. 1xVGA+2x10GRJ-45NICPort+1 x IPMILAN+ 1 x UID 11x PCI-E Slot, 3 external fan modules can be removed. 4PSUmodules ,available 920W/1620Wpower supply,supporting 2+2 redundancy 2 x USB Port+ 1x COM port

17. The internal structure of the chassis Memory Board CPU and Heatsink Primary Air Shroud Front Panel System Fans HDDs

18. Connection UIO slots: IO board is used to connect devices (VGA * 1 / 10Gb LAN * 2 / IPMI LAN * 1) Onboard SATA connector: SATA0 ~ 5

19. Connection Motherboard power connector ：JPW1/JPW2/JPW3/JPW4/JPW5/JPW6/JPW7

20. I840-G25 structure declaration– Removing Chassis cover Depress the two release buttons on both sides of the cover. Slide the cover toward the rear of the chassis. Lift the cover off the chassis.

21. I840-G25 structure declaration—Removing the Air Shroud Removing Primary Air Shroud 1 2 Removing the Secondary Air Shroud

22. I840-G25 structure declaration—Replace the system fan As shown in the picture, lift the fan housing up and out of the chassis and gently push the fan upwards from underneath the fan housing to remove it.

23. I840-G25 structure declaration—Replace the rear system fan As shown on the right picture, press the rear fan at the upper end of the buckle and remove the fan.

24. I840-G25 structure declaration—Replace system power supply module As shown on the right, push and hold the release tab on the back of the power supply, grasp the handle and pull the power supply out of its bay. Release Tab Handle

25. I840-G25 structure declaration—Memory Board installation Fixed lock Fixed lock As shown on the right, install the memory board into guide groove. And then locking the memory board on the Main Board.

26. 1 2 3 4 Contents Introduction of product specifications Introduction of product external interface Fault information capture judgment Introduction of product technology architecture

27. Fault information retrieve ----BMCEventLog BMCEventLogInformation format decomposition Alarm device name Eventlog order Log record time Log detailed information description Alarm equipment category

28. Component monitoring status information ----BMCSensorReading BMCSensorReadingInformation format decomposition Health status for devices Monitoring equipment failure description monitored equipment operation data Devices name Intrusion alarm reset button

29. Monitoring of power source status ----BMCPowerConsumption Power consumption monitoring ，collecting power consumption status under three conditions. last hour Last day Last week

30. Monitoring of power source status ----BMCPowerSupplies Monitoring parameters of power supplies Power Supply working status overview AC input voltage/current DC output voltage/current Power Supply module temperature monitoring Power Supply fan speed DC output power consumption AC output power consumption Power supply SN No. parameter name of power supply status data of power supply status

32. Appendix A:

33. Continued table:

34. Continued table:

35. Appendix B LED light Memory Installed ① The main board has 8 memory board. ②Each memory board supports 12 DIMMs. ③ DIMM specific installation following the right table

36. Memory work frequency corresponding table 1

37. Memory work frequency corresponding table 2

38. I840-G25 Analysis of FAQ The following information is required when the Front Panel alarm LED is on: a) Login BMC, view Sensor Event log and Sensor Reading Interface to view current alarm log and Sensor status, whether there are abnormal contents, view alarm information corresponding module LED status. b) Use ipmitool capture detailed alarm information, using command “ipmitool sel elist” to save the logs, and check the sensor value for the alarm. c) Check user manual for the recording of the front panel LEDs. d) Collecting the system logs: /var/log/messages; /var/log/McElog; dmesg System crash on the POST: a) Capture the snapshot of the screen and record the information if have. b) When there is no VGA output, you need to see 80 code LEDs on the motherboard. And record the value. c) Check the failure information with the user manual, you can try to find out the root cause. BIOS Recover Operation : a) Download the latest FW BIOS, rename it to "Super.ROM", copy it to the USB Key. b) Insert USB Key and power on the system, when the system boot up, press Ctrl+Home until you hear two short beeps c) Follow the screen prompts to finish the Recover BIOS process d) After the completion of upgrading, power off the system and remove the power cord . e) Then insert the power cord and power on, press Del key to enter the BIOS, load default settings via pressing F3 key, and finally press F4 to save settings and exit. 4. BMC FW upgrading (if can not upgrading the FW via web, you need upgrade the FW via DOS): a) Download the latest BMC FW, and extract the files to the bootable USB key. b) Insert the USB Key, power on the system and enter the DOS, run the Flashbmc.bat to upgrading the FW. c) After the completion of upgrading, waiting 3 minutes, and then power off the system (remove the power cord) d) Waiting 2 minutes, and then insert the power cord and power on the system.