1 / 49

Multilayer Polymer Film Capacitors

Multilayer Polymer Film Capacitors Key Components in Differential EMI and RFI Bypass Applications Where Short Circuit and Heat Runaway Failures Cannot be Tolerated. APEC 2003 Exhibitor Seminar February 11, 2003. ITW Paktron 1205 McConville Road, Lynchburg Virginia 24502 USA

earlene
Download Presentation

Multilayer Polymer Film Capacitors

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Multilayer Polymer Film Capacitors Key Components in Differential EMI and RFI Bypass Applications Where Short Circuit and Heat Runaway Failures Cannot be Tolerated APEC 2003 Exhibitor Seminar February 11, 2003 ITW Paktron 1205 McConville Road, Lynchburg Virginia 24502 USA TEL: 434-239-6941 · FAX: 434-239-4730 EMAIL: itwpaktron@paktron.com

  2. Seminar Outline • Comparison of MLP vs MLC Capacitor “Robustness” • MLP Attributes • Typical Circuit Applications • Performance/Reliability

  3. Family Tree of Capacitors

  4. Ceramic Capacitor Cross-Section

  5. MLP Internal Structure

  6. MLC Cracking

  7. CTE’s On Typical Components and Substrates CTE – Coefficient of Thermal Expansion a.k.a. TEC

  8. MLC Capacitors Palladium Replacement

  9. Ceramic Capacitor withBase Metal Electrode

  10. Ceramic CapacitorShort Circuit Failure

  11. Convection Reflow Profile (Typical)

  12. IR Reflow Profile (Typical)

  13. Ram with 14cm radius, Travels at 20mm/min. Capacitance Bridge 90 mm Board with Leads Attached Board Support Board Flexure Comparison between Surface Mount Multi-layer Ceramic and Film Capacitors EIA JRC3402 Board Flexure 1.0mm Deflection

  14. Results of MLC “Board Flexure” 4.0mm Deflection Typical 4.0mm Deflection 1812 Failure Typical 16.0mm Deflection 2225 Failure

  15. MLP “Board Flexure” Robustness 1812 MLP Termination after 7.0mm Deflection “Post Board Flexure” A New 1812 MLP Termination

  16. “Real World” Design Considerations to Avoid Capacitor Cracking • Avoid FR-4 boards or eliminate PCB flexure • Use only “tiny” MLCs (smaller than 1812, and less than 0.1mfd) • Employ lead frame terminations vs bare chip • Burn-in,vibrate and sonically screen 100% • Avoid temperature extremes: ramp-up, thermal shock etc. • DESIGN WITH “ROBUST” MLP CAPACITORS

  17. Paktron’s Interleaf® Technology

  18. MLP Capacitors

  19. MLP Pulse Testing (dv/dt) A type of test that shows both the reliability and performance capability of MLP capacitors is dv/dt (pulse) testing. This type of test stresses the metal interconnections of the capacitor. Typically, this type of test is done at room temperature. The test results show no adverse effects after the parts have been subjected to almost 37,000 pulses.

  20. Metallized Film Construction

  21. Wound vs. Stacked Comparison

  22. DC Source @ 75VDC DC-DC Converter Load @ 8A Async Relay Box MLP Asynchronous Dynamics Testing A standard test used by power converter manufacturers to establish robustness is through the use of asynchronous dynamics. The unit under test is connected to a DC source at 75vdc through a mercury wet relay to avoid contact bounce. The output of the converter is connected to an 8A load and to a short circuit relay. The converter is then placed in an oven at 85°C at 85% RH for twenty-four hours. The relays are switched asynchronously at time intervals of 11 seconds and seventeen seconds respectively. Under this scenario, seven thousand, five hundred cycles can be completed in the twenty-four hours. This type of 24 hour test is very severe and translates to twenty years of life with daily turn on and short circuit fault condition. Following this type of testing it is typical for the capacitance value of a MLP capacitor to drop by no more than 0.01% with no failures occurring.

  23. Capacitor Fusing

  24. MLP Clearing

  25. % Capacitance Change vs. DC Bias*

  26. % Dissipation Factor vs. Vrms*

  27. ESR vs. Temperature

  28. ESR vs. Frequency

  29. Typical Applications Automotive Computer Consumer Telecommunications

  30. Differential vs. Common Mode Noise

  31. Typical EMI Filters

  32. 24/48 Level B Single Output Filter

  33. 24 LevelA Triple Output Filter

  34. 24LevelBTripleOutputFilter

  35. Filter Module Schematic

  36. Filter Application

  37. Low Pass Filter

  38. High Voltage Input Filter

  39. AC and Quasi AC Input Filter

  40. Resonant Tank Circuit

  41. Output Filter

  42. Reliability

  43. Capacitor Level Testing

  44. % Failure Rate per 1000 Hours

  45. FIT Rate vs. %RVDC

  46. Failure Rate per 1000 Pieces

  47. Failure Rate per 1000 Pieces

  48. Capstick MLP Capacitor Advantages over Ceramics

  49. Paktron Competition Capstick® vs. the Competition No matter how you figure it, the Paktron part is just a better fit for your application!

More Related