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PH-MIC group

PH-MIC group. Activities in microelectronics and optoelectronics in 2007. MIC structure & composition (2007). Organigramme (Staff only). CERN funded resources 19.8 CERN staff 1.0 CERN fellow Sum = 20.8 FTE. Externally funded resources

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PH-MIC group

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  1. PH-MIC group Activities in microelectronics and optoelectronics in 2007 M. Letheren, 17 January 2007; MIC group activities

  2. MIC structure & composition (2007) Organigramme (Staff only) CERN funded resources 19.8 CERN staff 1.0 CERN fellow Sum = 20.8 FTE Externally funded resources 2 TT-funded staff 3 TT-funded fell/doc 5 Marie Curie ESTs 2 Iberian trainees Sum = 12 FTE M. Letheren, 17 January 2007; MIC group activities

  3. Evolution of MIC staff Announced departures plus retirements (at 65); assuming no new recruitment 2007 2008 2009 2010 M. Letheren, 17 January 2007; MIC group activities

  4. Main MIC activities • Participate in LHC integration & commissioning • Coordinate HEP community technology access • Prepare technology for SLHC • R&D + common projects • Technology transfer M. Letheren, 17 January 2007; MIC group activities

  5. MIC staff activities (2007) Production, integration, commissioningFTE ALICEPixels, TOF, HMPID, TTC, GOL, V.reg 0.1 ATLASSCT electronics, cooling control 0.9Coordination very forward RP electronics 0.5TTC, V.reg 0.1 CMS(Work package – design, produce, commission optoelec. & elec. systems for TK & ECAL)On-detector control, timing & trigger, monitoring, etc 2.0FEC hardware and firmware 1.2Optical link qualification, cabling, calibration 3.6TTC coordination 0.8 LHCbRICH Pixel HPD, Muon (Carioca) 0.1 TOTEM(Work packages – design, produce, commission electronics for RP and GEM detectors)Electronics coordination, VFAT & trigger ASICs 1.7 SUM -> 11.0 Technology development for SLHCFTE 130nm CMOS study + IP block design 0.9Common Projects (“GBT”, power compnts) 0.8Optical link technology 0.4 SUM -> 2.1(supervising 1 Fell + 2 ESTs + 2 trainees) R&DFTE EUDET (Timepix) 0.1ATLAS ABCDnext coordination & design 0.5Prestudies for CLIC 0.2P326 Gigatracker studies 0.2 SUM -> 1.0(supervising 2 ESTs + TT-funded) Technology TransferFTE Medipix 0.7BioCare (FP6), electronics for PET, CT, etc. 0.4 SUM -> 1.1(supervising 1 EST +5 external funded) Services & coordination for HEPFTE Foundry services support (MPW, design kit etc) 1.0Microelectronics working group 0.1Optoelectronics working group 0.1IC tester & radiation facilities support 0.5SUM -> 1.7 Management & internal supportFTE Group & section management/admin 1.3CAE support, UNIX administration 1.0Lab technician (open post) 0.6 SUM -> 2.9 M. Letheren, 17 January 2007; MIC group activities

  6. System integration (e.g. CMS TK) LD to DAQ Det A/D Memory APVs I V A/D PLL Temp DCU FED TTCrx Data Path FE Hybrids I2C CLK & T1 Control Path CLK - T1 TTCrx CCU FEC ctrl PCI Intfc CCU Module FEC M. Letheren, 17 January 2007; MIC group activities

  7. CMS Tracker Integration Facility M. Letheren, 17 January 2007; MIC group activities

  8. Services and Coordination Production, integration, commissioningFTE ALICEPixels, TOF, HMPID, TTC, GOL, V.reg 0.1 ATLASSCT electronics, cooling control 0.9Coordination very forward RP electronics 0.5TTC, V.reg 0.1 CMS(Work package – design, produce, commission optoelec. & elec. systems for TK & ECAL)On-detector control, timing & trigger, monitoring, etc 2.0FEC hardware and firmware 1.2Optical link qualification, cabling, calibration 3.6TTC coordination 0.8 LHCbRICH Pixel HPD, Muon (Carioca) 0.1 TOTEM(Work packages – design, produce, commission electronics for RP and GEM detectors)Electronics coordination, VFAT & trigger ASICs 1.7 SUM -> 11.0 Technology development for SLHCFTE 130nm CMOS study + IP block design 0.9Common Projects (“GBT”, power compnts) 0.8Optical link technology 0.4 SUM -> 2.1(supervising 1 Fell + 2 ESTs + 2 trainees) R&DFTE EUDET (Timepix) 0.1ATLAS ABCDnext coordination & design 0.5Prestudies for CLIC 0.2P326 Gigatracker studies 0.2 SUM -> 1.0(supervising 2 ESTs + TT-funded) Technology TransferFTE Medipix 0.7BioCare (FP6), electronics for PET, CT, etc. 0.4 SUM -> 1.1(supervising 1 EST +5 external funded) Services & coordination for HEPFTE Foundry services support (MPW, design kit etc) 1.0Microelectronics working group 0.1Optoelectronics working group 0.1IC tester & radiation facilities support 0.5SUM -> 1.7 Management & internal supportFTE Group & section management/admin 1.3CAE support, UNIX administration 1.0Lab technician (open post) 0.6 SUM -> 2.9 M. Letheren, 17 January 2007; MIC group activities

  9. Design support: Rad-tolerant libraries: Core cells, pads, memory, etc. Standardized CAE design flows: Cadence, Synopsys, Hercules, etc. Organizing training courses Foundry access (130nm + 250nm): Organize demand-driven MPWs Frame contract management Forecasting & billing, Export regulations, DRC, reticle assembly, polygon filling, fab submission & sign off, dicing & shipping to users, Fab interface for problems & “specials”. Design + foundry services support M. Letheren, 17 January 2007; MIC group activities

  10. IC Test Lab  Mixed-signal test system * 112 digital channels @ 200 MHz * VXI analog instrumentation (synchronized) * Labview environment for DAQ & analysis * Design verification + production testing * Currently being upgraded to a new tester Automatic wafer prober -> * Step and Repeat with pattern recognition * Used by ATLAS SCT,TRT,ALICE pixel,…… M. Letheren, 17 January 2007; MIC group activities

  11. X-ray irradiation facility X-ray energy: 20 – 60 keV Beam diameter: 100 um – 1 cm Dose rate: 20 – 800 rad/s 8-inch wafer probe equipped with CCD camera Thermal chuck: -25 0C – 200 0C M. Letheren, 17 January 2007; MIC group activities

  12. Technology & Common Projects Production, integration, commissioningFTE ALICEPixels, TOF, HMPID, TTC, GOL, V.reg 0.1 ATLASSCT electronics, cooling control 0.9Coordination very forward RP electronics 0.5TTC, V.reg 0.1 CMS(Work package – design, produce, commission optoelec. & elec. systems for TK & ECAL)On-detector control, timing & trigger, monitoring, etc 2.0FEC hardware and firmware 1.2Optical link qualification, cabling, calibration 3.6TTC coordination 0.8 LHCbRICH Pixel HPD, Muon (Carioca) 0.1 TOTEM(Work packages – design, produce, commission electronics for RP and GEM detectors)Electronics coordination, VFAT & trigger ASICs 1.7 SUM -> 11.0 Technology development for SLHCFTE 130nm CMOS study + IP block design 0.9Common Projects (“GBT”, power compnts) 0.8Optical link technology 0.4 SUM -> 2.1(supervising 1 Fell + 2 ESTs + 2 trainees) R&DFTE EUDET (Timepix) 0.1ATLAS ABCDnext coordination & design 0.5Prestudies for CLIC 0.2P326 Gigatracker studies 0.2 SUM -> 1.0(supervising 2 ESTs + TT-funded) Technology TransferFTE Medipix 0.7BioCare (FP6), electronics for PET, CT, etc. 0.4 SUM -> 1.1(supervising 1 EST +5 external funded) Services & coordination for HEPFTE Foundry services support (MPW, design kit etc) 1.0Microelectronics working group 0.1Optoelectronics working group 0.1IC tester & radiation facilities support 0.5SUM -> 1.7 Management & internal supportFTE Group & section management/admin 1.3CAE support, UNIX administration 1.0Lab technician (open post) 0.6 SUM -> 2.9 M. Letheren, 17 January 2007; MIC group activities

  13. Common Projects (defined with electronics coordinators and PH Management) • 130nm (Bi)CMOS • Characterization (analog parameters, radiation effects) • ASIC building blocks (bandgap ref., pre-amp, PLL,……….) • Versatile links(readout, timing, trigger, control) • Requirements, specs. • Rad-tol circuit blocks for GBT • Gigabit optoelectronics technology • On-detector power management • DC-DC converter, • Serial powering M. Letheren, 17 January 2007; MIC group activities

  14. Externally funded personnel(working on common projects, R&D, TT) • Marie Curie EST research training projects: (MITELCO and ELACCO contracts) • ATLAS ABCDnext (CP) • P326 Gigatracker (ST) • Medipix (WW) • 130nm CMOS (CM) • Power management (SM) • Biocare EU Project: • Ext. doc: PET & CT readout systems (FP) • PPARC-funded TT: • Ext. fellow: (MD) Time resolved florescence imaging & readout of MCP detectors (Uni. Leicester) + P326 • Iberian Trainees: • Radiation testing of optoelectronic components (AJP) • Optoelectronic test benches (LSA) • Medipix/EUDET-funded: • Ext. staff: Medipix ASIC design + Timepix for EUDET (XL) • Ext. staff: Medipix industry integration support (TL) • Ext. doc: Medipix pixel ASIC design (DSU-TT) (RB) M. Letheren, 17 January 2007; MIC group activities

  15. PH-MIC Staff manpower 2007 DIGITAL FRONTEND OPTO M. Letheren, 17 January 2007; MIC group activities

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