CMS Hybrids for the Tracker Upgrade

1. G. Blanchot - Endicott Meeting at CERN CMS Hybrids for the Tracker Upgrade G. Blanchot

2. Outline • Double sided strip module and hybrid topology. • 2CBC2 Prototype. • Procurement. • Samples. G. Blanchot - Endicott Meeting at CERN

3. Double Sided Strip Module Topology CBC CBC HYBRID 2x1016 STRIPS HYBRID COOLING & SUPPORTING STRUCTURE 2x1016 STRIPS Today’s estimation is: 4416 modules for the barrel. 5208 modules for the endcap. 2CBC2 Prototype • Parameters (per side) • Double sided, 50mm strip detector, 1016 strips (127x8), 90u pitch. • 8*254 inputs CBC ASICs on top side of hybrid. • Collects 1016 inputs from top, 1016 inputs from bottom. • 1 Concentrator ASIC • Common blocks • 1 DC-DC converter to power the hybrids. • 1 Charge Pump to power the optical link. • 1 GBT interface. • 1 Optical Link module. G. Blanchot - Endicott Meeting at CERN

4. 2CBC2 Block Diagram Input DiffPair Clock TMM-104-01-G-D-SM 2.5V 1.2V CBC2A LDO BotSensor Top Sensor BOT CLK DCDC P/N HV Bias HV Contact 256 inputs 80um pitch CLK40, CLK160 P/N 4 * FASTCONF SDA, SCLK FTSH-140-01-F-DH-A CBC2B TOP 2 * DATAOUT_T P/N 2 * DATAOUT_T TMM-104-01-G-D-SM Output SE and Diffpair Clock G. Blanchot - Endicott Meeting at CERN

5. CBC2 Flip Chip ASIC FLOORPLAN VIEWPOINT CBC #n-1 Last Pin (771) Previous CBC CBC 2 No Pins Ch#1 TOP Ch#1 BOT SUBSTRATE 4.725 mm TOP1 TOP2 BOT1 BOT2 CBC2 ASIC in foundry, due for beginningnovember. TOP4 BOT3 TOP5 BOT5 BOT4 TOP3 SENSOR SIDE (Wirebonds) READOUTSIDE Bump pitch = 250 μm 771bumps / ASIC CBC #n 11.025 mm TOP115 BOT114 TOP116 BOT116 BOT115 TOP114 TOP118 BOT117 TOP119 BOT119 BOT118 TOP117 3 No Pins TOP121 BOT120 TOP122 BOT122 BOT121 TOP120 TOP124 BOT123 TOP125 BOT125 BOT124 TOP123 NC TOP126 TOP127 BOT126 BOT127 Channels Sequence NC Pin 1 No Pin Next CBC Test bond pad row Pin#1 CBC #n+1 G. Blanchot - Endicott Meeting at CERN

6. 2CBC2 Prototype • Substrate Choice and Surface Finish • CoreEz 1-4-1 with thin LCP core: 4 core layers + 2 build-up layers. • ENEPIG surface finish for compatibility with wirebonding and with flip chip bonding. • Flip Chip bumps: IBM C4 Pb97Sn3. • Design Iteration • Release 38 reviewed by John Barinaat EIT and released for production. • Several issues have been sorted out with the feedback from EIT team. • Purchaseorder has been launchedat CERN and isapproved, shouldshortlyreach EIT. • Draft design • 30 hybrids will be assembled with parts, and will be underfilled. • Some passives will be coated with underfill. • 25 hybrids will be assembled with parts, without underfill. • Full access to passives, bumping cross check. • 5 hybrids will be delivered unmounted. • Mechanical evaluation samples. G. Blanchot - Endicott Meeting at CERN

7. 2CBC2 Prototype • TOP layer: • Diff pairs spacing solved. • Passives close to dice will be covered by underfill. • HV pads clearance complies with IPC-2221A. • Clearance with HV pads and internal power and GND layers is out of spec for IPC2221A, the breakdown voltage curves supplied were taken into account. G. Blanchot - Endicott Meeting at CERN

8. 2CBC2 Prototype • Inner planes: • Venting holes added as requested. • Better adhesion of the laminate layers. • Edge clearances for Power and GND layers fixed. • Area matching: • Copper area coverage matched between top and bottom layers. • Same for soldermask. • Area balance checked, substrate will stay flat. G. Blanchot - Endicott Meeting at CERN

9. Assembly • Bill of materials and placement file delivered. • Some components are not to be mounted by default (red). • Detailedassembly instructions are delivered. • Parts are all supplied by CERN. G. Blanchot - Endicott Meeting at CERN

10. Mechanicalsamples • The properties of the substrate material needs to be evaluated in detail for its integration into modules: • Thermal expansion. • Thermal conductivity. • Flexibility and flatness. • Wire bonding tests. • Assembly properties with glues, compatibility with supporting materials. • Reliability of laminate stack. • We would like to evaluate materials other than CoreEz if available or suitable to our application. • See discussion with Alan Honma about these specific issues. • Low CTE materials • Samples. G. Blanchot - Endicott Meeting at CERN

11. 8 CBC Design CBC CBC HYBRID 2x1016 STRIPS HYBRID COOLING & SUPPORTING STRUCTURE 2x1016 STRIPS Today’s estimation is: 4416 modules for the barrel. 5208 modules for the endcap. 8CBC2 Prototype • Parameters (per side) • Double sided, 50mm strip detector, 1016 strips (127x8), 90u pitch. • 8*254 inputs CBC ASICs on top side of hybrid. • Collects 1016 inputs from top, 1016 inputs from bottom. • 1 Concentrator ASIC • Common blocks • 1 DC-DC converter to power the hybrids. • 1 Charge Pump to power the optical link. • 1 GBT interface. • 1 Optical Link module. G. Blanchot - Endicott Meeting at CERN

12. Procurement Plan • 8 CBC Prototype • Integrated in the CMS Hybridsprocurement plan thatisbeingprepared right now. • Must follow the CERN procurementrules as itisgoing to beexplained by Dante Gregorio. • Start point is a marketsurvey, a technical questionnaire and a qualification criteriaspec. • The 8 CBC design willbe open to severalcompaniescompeting for the best productat best price. • Several prototypes willbebuiltwithdifferentsuppliers. • Mass, CTE, substrateroutingdensity and performance, cost, will all be dominant aspects for the qualification of suppliers. • Rigid and flexible substrate technologies are going to beinvestigated. • Severalrigid and flexible supplier companies have been identified and all are expecting the marketsurvey to bereleased. • Rigidbuild-up substrates and flexible polyimide foils willbeevaluated. Eachprocessinvolvesverydifferent module integration aspects thatwillbestudied. G. Blanchot - Endicott Meeting at CERN