1 / 21

- Vertexing - Tracking - Summary

DESY. SLAC. KEK. CERN. Summary of Tracking Devices For Huge Detector. - Vertexing - Tracking - Summary. Jik Lee(SNU) for Hwanbae Park (KNU) Huge Detector Kickoff Meeting, Nov. 10. m. SC-coil. HCAL (Pb(Fe)/scinti or digital). W/Scinti ECAL. TPC. Si intermedi.-Trk.

ike
Download Presentation

- Vertexing - Tracking - Summary

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. DESY SLAC KEK CERN Summary of Tracking Devices For Huge Detector - Vertexing - Tracking - Summary Jik Lee(SNU) for Hwanbae Park (KNU) Huge Detector Kickoff Meeting, Nov. 10

  2. m SC-coil HCAL (Pb(Fe)/scinti or digital) W/Scinti ECAL TPC Si intermedi.-Trk SiVTX pixel(cold version) ▣Concepts of Huge Detector • Huge Detector: best optimized for “PFA” - excellent momentum resolution - good separation of clusters/tracks maximize BL2

  3. ▣Vertexing Performance Requirements •excellent spacepoint precision < 4 microns • impact parameter resolution ≤ 5µm  10µm/(p sin3/2 ) • minimal multiple scattering  0.1-0.2% X0 or less per layer (transparency) • two track separation, occupancy  20 x 20 µm2 pixel size pixelated type • Charge Coupled Devices (CCD) • Monolithic Active Pixels (MAPs) • DEPleted Field Effect Transistor (DEPFET) • Silicon On Insulator (SOI) • Image Sensor with In-Situ Storage (ISIS)

  4. ▣ Beam Structures • Pileup over bunch train • Or fast timing • bx live: 3 10-5 •  power pulse warm • Fast readouts: OK, no pileup • Digital pipeline • bx live: 5 10-3 cold • readout speed • radiation hardness • occupancy

  5. CP CCD ▣ Vertex Detector: CCD • faster readout needed for cold machine - need to readout every 50 µs (20 times) during a train ~0.5% occupancy - use Column-Parallel CCD with low noise(increase readout speed ~50MHz) separate amplifier and readout for each column LCFI CP CCD 400x750 pixels(20µmx20µm) •cryostat for operation at 200 K - could be unnecessary withfast readout thin and mechanically stable ladder

  6. ▣ Image Sensor with In-situ Storage (ISIS) • •20 readouts/bunch train may be impossible due to beam –related RF pick up • motivates delayed operation of detector for long bunch train: • • charge collection to photogate from 20-30 µm silicon, as in a conventional CCD • • signal charge shifted into storage register every 50 µs, providing required time slicing • • string of signal charges is stored during bunch train in a buried channel, avoiding charge-voltage conversion • • totally noise-free charge storage, ready for readout in 200 ms of calm conditions between trains

  7. ▣ Vertex Detector: MAPS Prototype ▪ standard CMOS sensor technology - readout/sensor on one chip - signal is corrected from epi. layer ▪ pixel size and precision ~ CCD • neutron irradiations - fluencies up to 1012 neutrons/cm2 are acceptable with considering LC requirements which is ~ 109 n/cm2/year • ionizing irradiations - tests up to a few 100kRad - exact sources of performance losses are under investigation (diode size and placements of the transistors are important parameters) 5% drop in charge at 1.5e12 n/cm2

  8. ▣ Vertex Detector: DEPFET Prototype ▪ detector and amplification properties ▪ fully sensitivity over whole bulk ▪ very low noise operation at room temp. • thinning process for sensors established 800x104 mm2 - sensitive area 50µm thinned - fast signal to cope with high rate requirement - resolution of 9.5 μm for single pixel • complete clear  no clear noise - (1 x clear) then sample 500x in 2.5ms - (clear + sample) 500x

  9. ▣Vertex Detector Issue • pair background hit at R=15mm is 1.7 times larger than that of 4T • background hits are decreased significantly at larger R • configuration of R=20mm with silicon thickness < 70 µm satisfies the impact parameter resolution requirement: ≤ 5µm  10µm/(p sin3/2 ) • readout speed and rad. hardness • very thin detector Y. Sugimoto

  10. ▣Tracking Performance Requirements • excellent momentum resolution - dilepton recoil mass for higgstrahlung process - end-point measurement for SUSY chains • excellent pattern recognition and 2 track resolution - high energy, high density jets • tolerant to high machine backgrounds -tracks in central tracker dominated by γγ events gaseous type (readout) • MWPC and pads - limited by positive ion feedback and MWPC response • MPGD’s (Micro Pattern Gas Detectors) - GEM (Gas Electron Multiplier) - MicroMEGAS (Micro Mesh GAS detector)

  11. ▣TPC with GEM • 50 µm Kapton foil for gas amplification • 5 µm copper coated on both sides • 70 µm holes, 140 µm pitch • hexagonally aligned holes • multiple GEM structures - safer operation - more flexibility to optimize charge transfer • GEM voltages up to 500 V yield 104 gas amplification

  12. ▣TPC with GEM • to reduce ion feedback -GEM with Micro Hole Strip Plate (MHSP) • apply negative strip voltage  ions collected on strips, electrons extracted from holes due to diffusion IF is reduced by a factor of 4

  13. S1 S2 ▣TPC with MicromeGAS • a micromesh sustained by 50-100 µm high insulating pillars • multiplication takes place btw anode and mesh • S1/S2 ~ Eamp/Edrift - can choose gap/HV to have gain maximum - ion feedback suppressed by Edrift/Eamp

  14. ▣TPC with MicromeGAS • 50 cm drift, 1024 channels • tested up to 2T at Saclay - no gain drop with 55Fe Field cage Detector pad layout: 1024 pads Readout Berkeley-Orsay-Saclay TPC principle is proven but optimization to be done

  15. ▣ TPC Tracking Issue • small structures (no ExB effects) • fast electron signal • intrinsic ion feedback suppression • optimize novel gas amplification systems • ion feedback suppression • neutron backgrounds • optimize single point and double track resolution • demonstrate large system performance with control of systematics

  16. SET ▣Intermediate and Forward Tracker • improve momentum resolution • improve track finding efficiency • forward tracking • intermediate between vertex and central (IMT, SIT, FTD) • intermediate between central and calorimeters (FCH, SET) • located btw vtx and main tracker (GLC model) - 5 layers at r=9 to 37 cm - angular coverage |cosΘ|<0.9 - spatial resolution σ = 20μm - total amount of Si required: 10 m2 • SIT + TPC + SOT

  17. 64ch 50um pitch sensor 512ch 50um pitch sensor p+ implanted readout strip n+ implanted readout pad in staggering via in hourglass p-stop in atoll guard ring 32ch 50um pitch sensor 1cm PIN Diode 16ch 50um pitch sensor For SDD R&D PIN Diode array Backside of SSD N side P side ▣Intermediate Tracker

  18. ▣Tracking Devices • •Si Vertex Detector • 5 layers, t=70µm, =3µm • cos < 1 (non-realistic) • •Si Inner Tracker • 3 layers (12, 24, 36 cm), • t=300µm, =7 µm, cos<1 (non-realistic) • •TPC • 40cm < R < 200cm, Z<235cm • Ar gas, 220 samples, =150µm • •Si Outer Tracker • R=205cm(barrel)/Z=250cm(EC), • =7µm • detail (realistic) simulation studies are underway Y. Sugimoto ΔPt/pt2 Pt(GeV/c)

  19. ▣Vertexing/Tracking Issues • R&D must be guided by continuing physics and simulation programs which can deliver the accuracy that the LC physics needs -evaluate the tracking performance: backgrounds, occupancy studies, pattern recognition studies • demonstrate performance in large scale prototypes in cosmic ray and test beams studies with the magnetic field • vertex detector, tracker, calorimeters should be integrated for optimal jet reconstruction

  20. Backup Slides

  21. ▣Physics Performance • end-point measurement for SUSY chains GLC project report

More Related