1 / 1

Printing Electronic Circuitry with Copper Solutions

Printing Electronic Circuitry with Copper Solutions . Investigators: C. M. Megaridis , Mechanical and Industrial Engineering; C. Takoudis , Bioengineering; J. Belot , Univ. Nebraska-Lincoln; J. McAndrew , Air Liquide , Inc. Prime Grant Support: Air Liquide.

isaiah
Download Presentation

Printing Electronic Circuitry with Copper Solutions

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Printing Electronic Circuitry with Copper Solutions Investigators: C. M. Megaridis, Mechanical and Industrial Engineering; C. Takoudis, Bioengineering; J. Belot, Univ. Nebraska-Lincoln; J. McAndrew, Air Liquide, Inc. Prime Grant Support: Air Liquide • Patterned metal films are essential to a wide range of applications ranging from printed circuits, to thin-film displays and electrodes in biomedical implants • Inkjet printing has environmental benefits while offering flexibility, cost savings, and scalability to large area substrates • Initial focus on Copper due to its very low resistivity. Future extension to bio-compatible metals • Homogeneous metal inks eliminate obstacles encountered while using nanoparticle ink suspensions • Synthesis of metal compounds as primary ingredients of homogeneous inks • Ink physical and rheological properties (viscosity, surface tension) optimized for printability • Printing tests for optimal line formation; thermal treatment to reduce the deposit to pure metal; final product testing/evaluation • X-ray photoelectron spectroscopy and electron microscopy used to characterize deposit chemical composition and surface quality • Candidate organocopper compounds and solvents have been identified, providing facile decomposition to metallic copper (removal of ligands + reduction of Cu2+to Cu0), and copper content > 10% wt. • Copper lines printed in the laboratory indicate that homogeneous solutions of organocopper compounds can be developed with suitable properties for ink-jet printing • Research has the potential to catapult progress in metal ink fabrication and in-situ formation of metallic lines with feature size in the 10-100 m range

More Related