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High-Speed Optical Computing: Place Your Order Now!

Optimize your computing power with optical interconnections for high speed, unlimited bandwidth, and data rates over 100 Gbps. Learn more about the advantages of optical computers and the types of interconnections available. Find out how optical interconnections can overcome bottlenecks and enable parallel computing, networking, and global routing. Place your order now for an optical computing system with capacity up to 1 Tb and beyond!

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High-Speed Optical Computing: Place Your Order Now!

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  1. Place your order now - speed : more than 1THz - Bandwidth : unlimited - Data Rate over 100 Gbps - Capacity : 1Tb upward More information>

  2. OPTICAL COMPUTERS

  3. What is Optical Computing? • The goal of optical interconnections • to replace either some or all of the metallic traces that provide the electrical connections on the printed-circuit boards by light beams, either in air or optical fibers. • Electrical systems integrated circuits for processing information printed circuit boards for mounting the integrated circuits and providing interconnections between these circuits.

  4. Types of Interconnections • On-chip • Chip-to-chip on a multi chip module ( MCM ) • MCM-to-MCM on a board • Board-to-board

  5. Why Optical Interconnection? • Very High Speed • Higher Bandwidth • Higher Interconnection Densities • Lower Crosstalk • Inherent Parallelism • Immunity for Electromagnetic Interference and Ground Loops • Higher Fan-In/Fan-Out Capability • Lower Attenuation

  6. Is it Possible? • Opto-Electronic (OE) devices have now been developed to a point that they can enable high speed and high-density FSOI (Free Space Optical Interconnection) • Board-to-board interconnect solutions using FSOI are now being evaluated • Development of devices: VCSELS (Vertical Cavity Surface-Emitting LaserS) for data input SLMs (Spatial Light Modulators) such as liquid-crystal and acousto-optic devices) for putting information on the light beams High-speed APDs (Avalanche Photo-Diodes), or so-called Smart Pixel devices, for data output

  7. How? • Optical interconnections require : Transceiver Receiver Propagation medium Packaging architecture Converting electrical signals to optical ones. usually contains VCSELs Convert the optical signals back to electrical ones usually contain p-i-n photodiodes and transimpedance amplifiers Fiber or Free Space Multimode fiber is the most common medium for commercial interconnect products To integrate OE devices and optical components in a way that is fully compatible with conventional electronic multi-chip packages

  8. Optical Interconnection within Computing System • Optics Inside the Box • Optics Outside the Box

  9. Bottlenecks to be Overcome • Height of the Optical Package: micro-optical elements • Signal Integrity and Synchronization Issues • Thermal Stability of the assembly • Effective CAD Tools : capturing both electronic circuits and sub systems as well as optoelectronic and optical components and sub-systems • Ultra Low Voltage Light Modulation • Cost associated with FSOI : manufacturing volume

  10. THANK YOU • Prepared by: B.M.N.Perera T.D.K.Peris

  11. Opto-Electronic Network for Global Routing Back

  12. Optical Transpose Interconnection System • Bi-directional Optical system • Supports Bit-Parallel Communication • Suitable for Multistage Interconnection System Back

  13. Parallel Computing using Optical Interconnection • To achieve teraflops performance, more and more processors are incorporated into a single system :massively parallel processing (MPP) system • VLSI technology is not suitable for interconnecting communication intensive systems ; electrical properties such as resistance, capacitance, and inductance • Optical interconnections can be built at various levels, providing chip-to-chip, module-to-module, board-to-board, and node-to-node communications Back Next

  14. Networking using optical interconnection • Demand for Bandwidth ; growth of data traffic • need for optical interconnection networks for wide-area, metropolitan-area, and even local-area networks • Solution to limited bandwidth, lower data rates, attenuation in the line BackNext

  15. Fully packaged FSOI system • overall packaging consists of the assembly of two different packaging modules: the Opto-electronic module (multi-chip carrier and the OE chips (VCSEL,MSM and silicon chips), and the optics (FSOI)module • 48 optical channels each operating up to 800Mb/s • optical efficiencies exceeding 90% • inter-channel crosstalk less than -20dB • package less than 5x5x7 cm3.

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