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Materials for the 2020 Challenges: The view of industry

Materials for the 2020 Challenges: The view of industry . Carmelo Papa Executive Vice President, Industrial and Multisegment General Manager STMicroelectronics. “Materials for the 2020 Challenges” European Parliament Brussels. July 10 2012. Outline.

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Materials for the 2020 Challenges: The view of industry

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  1. Materials for the 2020 Challenges:The view of industry Carmelo Papa Executive Vice President, Industrial and Multisegment General Manager STMicroelectronics “Materials for the 2020 Challenges” European Parliament Brussels. July 10 2012

  2. Outline • New materials can address societal challenges by: • boosting performances of key enabling technologies • introducing entirely new functions in systems and changing • manufacturing flow • Examples of new materials in semiconductor industry: • SiC and GaN for the new wave of power electronics • Polymers and flexible electronics for healthcare • Keep looking at advanced materials: e.g. graphene • Bridging the gap between material science and market

  3. A long path from materials to applications ….andviceversa: problems from applications leading to applied and fundamental R&D electric/hybrid car From Materials to devices to systems… Applications Device engineering and industrialisation Early device prototypes Fundamental Material studies

  4. Societal challenges calling for better power actuators: energy efficiency and… Kyoto protocol on reducing greenhouse gas emissions 126$ Oil price increase > 85% of produced energy presently derived from hydrocarbons 3

  5. ….people concentration in megacities By 2050, 7 out of 10 people will live in megacities, offering the benefits of concentrated living but also some of the biggest public-works challenges in human history.

  6. Societal Challenges in Healthcare • Healthcare spending is growing fast : currently 15% of GDP for USA, • 8% of GDP for Europe • Global Healthcare spending is more than 5 Trillion Dollars per year • This spending trend is unsustainable for the future economy • To counter this trends, the Healthcare industry must change • A move towards Personal Home Diagnostic Sensors around the body

  7. EmergingApplicationsrequire Smart Integration : Moore’s Law and More than Moore “ More than Moore ” : Diversification HV Sensors Analog/RF Passives Biochips Power Actuators 130nm 130nm Interacting with people and environment 90nm 90nm Baseline CMOS : CPU, Memory, Logic 65nm 65nm Information SoC and SiP mix for Higher Value Systems Processing 45nm 45nm 32nm 32nm “ Moore’s Law ” :Miniaturization 22nm 22nm . . . . . . V V • “Moore” approach: integrate more transistors in a chip • “More than Moore”: integrate functions in a Smart System • Innovation in More than Moore comes in disruptive steps Beyond CMOS: Quantum Computing, Molecular Electronics Spintronics

  8. From Si Power Devices……. The most recent Si MOSFET at ST Microelectronics 60 um Si wafer processing for advanced IGBTs devices 7

  9. ….to SiC and GaN power devices • Better power density • Lower losses • Higher operation temperature • Higher operation frequency Source: YoleDéveloppement,

  10. SiC and GaN power devices Silicon Carbide Gallium Nitride 2015 SiC and GaN power device TAM: $0.5B SiC Program • 1200 V MOSFET (Q4 2012) SiC MOSFET vs. 1200 V IGBT • 64% die size reduction • Much higher switching frequency GaN Program • 650V / 15A HEMT • 650V / 200A HEMT GaN Transistor vs. 650 V IGBT • 40% Power Saving - 64% Silicon Area 1200 V IGBT 1200 V SiC MOSFET Source: YoleDéveloppement, STMicroelectronics

  11. SiC and GaN in Renewable Energy Moving electronics into the Panel for Enhanced Photovoltaic ST Solution Control Unit Power Modules Gate Drivers Rectifiers (SiC, Schottky, Ultrafast) DC-AC conversion and MPPT DC-DC conversion and MPPT Metrology ICs Power Switches (MOSFET, IGBT) Enabling lower losses and higher currents PLM, ZigBee Transceiver Protections (ESD, EOS) High efficiency full solar system Auxiliary Power Supply SCR’s PV Inverter System 2014 TAM: $8.8B, CAGR 2011-2014: 11% 23 Mu, CAGR 2011-2014: 63% Source: iSuppli 10

  12. SiC and GaN in Hybrid & Electric Vehicles ST Solution Control Unit Power Modules Protections Rectifiers PLM Transceiver Power Switches (MOSFET, IGBT) PHEV: Plug-in Hybrid Electric Vehicles RF Transceiver Gate Drivers Smart Power Electronics for a dramatic reduction of C02 emission Auxiliary Power Supply HEV / EV 2014 Semiconductor TAM: $1.9B CAGR 2011-2014: 28% Source: YoleDéveloppement, STMicroelectronics 11

  13. Smart Systems are everywhere and require the introduction of a wealth of new materials

  14. Flexible Electronics: a new material for Smart Systems Ambient Intelligence Security & Safety Portable Consumer Flexible Conformable Self Powered Autonomous Wireless Dislocation Cost Effective Disposable Light Portable Wearable Electronics Gaming & Leisure Human Interface Healthcare & Fitness Automotive & Transportation

  15. ...adding material knowledge for Flexible & Disposable Electronics • Bio-materials • Metal/Non ferrose (Al, Ti, Cu, Ag, Tg, Au, Ni) • Polimers (Non Metal/Organics/Thermoplastic) • Polimmide • PVC • COP • PET • PEN • Ceramics (Non Metal / Inorganics) Polymers • Advantages • tenacity • low specific weight • workability • Disadvantages • low mechanic resistance • degradation over time • deformation over time Ceramics • Advantages • Good biocompatibility • Chemical inert • High resistance to compression • Resistance to corrosion • Disadvantages • Low resistance to traction • High specific weight • Fragility • Low workability Metals • Advantages • mechanical characteristics • higher resistance to the use • ductility • Disadvantages • Low biocompatibility • Rigidity • High specific height • Corrosion in physiological environment

  16. Increasing complexity by multi-foil 3D integration on flexible substrates • The project challenge is the development of interconnection technologies for autonomous, flexible and smart system: • Interconnection technologies between flexible components and flexible foils as well as between functional foils. • Three dimensional functional foil integration to achieve multi-foil based systems, i.e. system-in-foil. Technical Demonstrator Energy autonomous indoor air quality sensing system capable of wireless communication of the measured data. 15

  17. Flexible Electronics at STMicroelectronics Application fields: • Printed sensors / Flexible ICs • Multifunctional systems on foil • Smart disposables for healthcare and ambient intelligence Technologies: • From litho-based on wafer carriers … to printed electronics carrier-less • To Hybrid system integration (e.g. multi-foil) Wireless Strain Gauge Modules for pressure and temperature Sensors around the body • Examples: • Sensors on plastic: strain/pressure, temperature, gas and biosensors • Smart objects with RF harvesting and wireless communication • Transparent and Flexible electronics, incl. printed organics and oxides • Implantable sensors for glucose monitoring • Hybrid Si-Plastic micro-fluidic modules

  18. The complete (Smart) System commercialized by SENSIMED includes: • Contact Lens • External antenna & data-cable • Recorder • Software Example:Contact Lens for Early Diagnosis of Glaucoma • Application: Contact Lens for non-invasive early diagnosis and personalized treatment of Glaucoma (customer: SENSIMED AG) • ST Sensor is a strain gauge & antenna embedded in a silicone contact lens • The Sensor is capable of measuring cornea deformations due to Intra-Ocular-Pressure (IOP) variations • The IOP Sensor is a wireless sensorthat acts as a transducer, antenna and mechanical support for additional read-out electronics ST Wafer containing contact lens sensor Contact lens sensor Into the patient’s eye Intra-Ocular Pressure Disposable Sensor Sensor & antenna embedded in a silicone contact lens Telemetric chip Press release March 24, 2010: ST to develop and supply wireless sensor for Sensimed’s Continuous Eye Pressure Monitor 17

  19. Example:Diabetes Management with implantable biosensors Application: Continuous Glucose Monitoring (CGM) As of 2010 about 285 million people around the world, are affected by Type 2 Diabetes Mellitus disease. Complications arising from diabetes can be both Acute and long term and include hypoglycemia, Ketoacidosis, coma, renal failure, amputations, neuropathy, and retinal damage. In the last decade Glucose sensing technology became the major research focus in diabetes management area, and 80% of biosensor market are the glucose sensors. Source: www.medtronic.com Over the next 10 years the cost of diabetes, heart disease, and stroke will take a tremendous toll on the national incomes of developing world countries. According to WHO, diabetes, heart disease, and stroke together will cost about $555.7 billion in lost national income in China, $303.2 billion in the Russian Fed.; $336.6 billion in India; and $49.2 billion in Brazil. Working Reference Counter http://www.medtronicdiabetes.net/products 18

  20. Example: Biosensors for healthcare & fitness • Amperometric sensors: from Glucose to Lactate monitoring • Lactate levels are related to the • anaerobic metabolism associated • with muscle contraction: • 0.6 ~ 2 millimoles in resting • up to 20 or 30 mM during activity • Athletes have to stop physical activity when they reach their lactate threshold. • Aim: to avoid metabolic disorders and injured tissues during sport activities. • Monitoring of several pathologic conditions, such as the case of patients with cardiac disease and diabetes. • Multisensing of biological functions • Biological chemical sensors associated with other physical and mechanical sensors, such as ECG, accelerometers, gyroscopes, temperature, pressure, light, etc.… • It requires dedicatedelectronics able to acquire the signals from sensor, process them and transmit to a portable remote unit 19

  21. From Healthcare to Ambient Intelligence • Multifunctional systems embedded in everyday objects: a) Wireless sensor networks • Network of sensors embedded with low-cost electronics with RF & analog processing capability • Opportunities: • Multi-sensors integration at each sensor node • Low power (either with battery or battery-less, where possible) b) Smart objects in packaging & textile • High volume (existing market for RFID) • Opportunities: • Electronics on plastics, paper, textile • Gas and chemical sensors in smart objects • Flexible & streatchable electronics associated with other functions and technology drivers: e.g. displays, energy harvesting, ULP radios

  22. Keep watching new materials, e.g. graphene • Thinnest material sheet imaginable…yet the strongest! (5 times stronger than steel and much lighter!) • Graphene is a semimetal: it conducts as good (in fact better!) than the best metals, yet its electrical properties can be modulated (it can be switched ON and “OFF”) • Record electron and hole mobilities (>×100 than Si) • Superb heat conductor (>x40 than Si) • Very high current densities (~4-8 mA/mm, equivalent to 109 A/cm2) Applications: new devices due to ambipolar transport, excellent electrostatic confinement, integration with Si and with flexible/transparent substrates Graphene has the potential to revolutionize numerous fields: Electronics, materials science, chemistry, bio-sensors…

  23. European « three pillars bridge » to pass across the « valley of death » Technological development Pilot deployment Pilot line Globally competitive manufacturingfacilities Production Technology Products Science Product development Technological research Competitive manufacturing Knowledge Market The valley of death 22

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