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Hardware Prototyping Status

Hardware Prototyping Status. Talk Outline. Development plan LVDS data path at 160 MHz Mass Termination Board RDO Motherboard Flex Cable Development Preliminary Design Alternative Approach Infrastructure Test Board Interfaces to STAR Prototype Telescope System in STAR Probe tests

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Hardware Prototyping Status

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  1. Hardware Prototyping Status

  2. Talk Outline • Development plan • LVDS data path at 160 MHz • Mass Termination Board • RDO Motherboard • Flex Cable • Development • Preliminary Design • Alternative Approach • Infrastructure Test Board • Interfaces to STAR • Prototype Telescope System in STAR • Probe tests • Summary

  3. Development Plan PXL RDO Basic Unit 6 m (24 AWG TP) 2 m (42 AWG TP) Mass termination board + latch up protected power daughtercard ← Front Back ↓ 100 m (fiber optic) RDO PC with DDL link to RDO board RDO motherboard + Xilinx Virtex-5 Dev Board • 4 ladders per sector • 1 Mass Termination Board (MTB) per sector • 1 sector per RDO board • 10 RDO boards in the PIXEL system

  4. LVDS Data Path at 160 MHz 42 AWG wires Ladder mock-up with 1-to-4 LVDS fanout buffers Mass termination board + LU monitoring 24 AWG wires 2 ns eye pattern opening for 1 m 42 AWG cables at 200 MHz Virtex-5 based RDO system with DDL link to PC • Status • Data Path Architecture Validated • Measured BER (bit error rate) of < 10-14

  5. Mass Termination Board LU protection PLL LVDS buffers JTAG buffers ADC LU protected power supply VDA,VDD Mass Termination Board LU protected power regulation board • I2C ADC for sensor temperature monitoring • PLL for CLK distribution with 50% duty cycle • JTAG buffers LVDS  LVCMOS • Status • Prototype in hand. • Testing in progress.

  6. Readout Board Xilinx VIRTEX-5 development board DDL • Status • 3 Prototypes in hand. • Firmware, hardware and software are working for individual sensor testing. Custom readout board. SRAM LVDS buffers 50 MHz ADC • fast ADC for sensor testing • DDL for data acquisition • USB for data acquisition / system monitoring USB interface

  7. Flex Cable Development Number of traces and required width to route (without vias) using industry standard 0.005” (125 µm) traces and spaces and with 17.5 µm Cu trace equivalent thickness. Signal Power W = 23.08 mm http://rnc.lbl.gov/hft/hardware/docs/Phase1/cable_power_gnd_trace_optimization.doc 7 7

  8. Flex Cable – Preliminary Design Hybrid Copper / Aluminum conductor flex cable Side view (exaggerated vertical scale) Top View • 2 layer Al conductor cable in low mass region • 0.004” (100 µm) traces and 0.004” (100 µm) spaces • 70% fill factor • Conductor thickness in low mass region is 21 µm (Cu) or 32 µm (Al) • Minimum required conductor trace width 1.325” (33.65 mm) of 46.16 mm available. • Bond wire connection between Al and Cu cable sections. Low mass region calculated X/X0 for Cu conductor = 0.232 % Low mass region calculated X/X0 for Al conductor = 0.073 %

  9. Flex Cable – Preliminary Design (cont.) • Compared to the standard 4 layer Al conductor cable construction; • Advantages • One 2-layer Al conductor cable – less reliance on Al conductor flex PCB fabrication process and less complex Al structure. • Lower radiation length than previous (not as well justified) estimate. • More layers and thus more complex structures in the driver region are possible (this may be needed). • Disadvantages • Wire bonding (or other high density connection technique) required for inter cable connection. • Cable will not be the same thickness everywhere – may complicate fixturing. • Non homogeneous CTE in cable.

  10. Flex Cable – Alternative Approach • Multi-layer single sided with aluminum conductor with cable on top of sensor • addresses aluminum via manufacturing issue • minimizes the cable X width • cable located on the top of the sensors partially obstructs the sensors for both view and touch probe location measurements VDD, VAA, GND, clock, temp, SPEAK (bonded to power) - ΔX not relevant Sensor 120 µm + no stiffener signal outputs, Clock return, marker, start, JTAG, RSTB – ΔX = 0.105” (2.67 mm) X = 3.67 mm – exceeds the existing envelope by 0.77 mm X = 2.88 mm if Clock return and RSTB are neglected (production runs) – within the current mechanical envelope

  11. Aluminum Flex Cable • A single sided test cable design has been produced for fabrication at Datex to assess capability and quality. • Some delay due to material issues. It is difficult to find anyone willing to fabricate kapton/Al. • We have located some 1 mil Al on 1 mil mylar and shipped it to Datex. They are evaluating the suitability. • Datex is about to start first attempt at fabrication. • Other vendors (SE SRTIIE, Kharkov,Ukraine and CERN?) will be contacted. • A detailed description of the challenge is available here http://rnc.lbl.gov/hft/hardware/docs/PXL_RDO_cable_options_1.doc

  12. Flex Cable Status PIXEL Cable development stages: • Infrastructure testing board • Prototype detector cable FR-4 with Cu traces • Prototype detector cable Kapton with Cu traces • Prototype detector cable Kapton with Al traces Infrastructure testing board with extended sensor testing capabilities • Status • Preliminary FR-4 test version in hand • Testing in progress

  13. Infrastructure Test Board • The first test of the complete RDO chain: • 10-sensor ladder • MTB • RDO • long cables Ladder-like layout except for Power and GND • Status • Multidrop clock working • JTAG daisy chain working (with caveats) • Testing in progress Very preliminary results with full thickness Phase-1 prototypes: preliminary • Coupling mechanism is under investigation. • Next board with 50 μm Phase-2 prototypes is being assembled.

  14. Prototype Telescope System in STAR • Status • 3 Sensor (MimoSTAR2) telescope used at STAR in 2007 RHIC run. • Clean noise environment at STAR • Successful tracking • No latch-up events were observed during the run • Interfaces to Trigger and slow controls worked well

  15. Probe Tests • Status • Automated and scripted system for sensor testing is in place. • Vacuum chuck for handling up to twenty 50 μm thick sensors is being tested • Ongoing sensor testing • Sensors designed with dedicated probe pads in the sensor pad ring. • 13 full-thickness, diced sensors probe tested. • Up to 3 probe tests on a sensor. • We will begin testing thinned sensors within the next few days Phase-1 discriminator transfer functions ƒ(threshold voltage) observed on two of the probed sensors : Initial testing with ~75 μm travel past touchdown 30 μm additional lowering of probe pins

  16. Summary RDO basic unit has been prototyped and successfully tested Development of the low mass flex cable has started The first FR4 ladder prototype is under test Interface to the STAR trigger and slow control systems successfully tested Automated probe test setup ready for testing thinned sensors

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