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Peter T. Tang IPU

“MatPack” – deposition, modelling and characterisation of high melting point lead-free micro solders. Peter T. Tang IPU. 3D-modelling of phase formation Prediction of solder properties. Focused Ion Beam preparations SEM imaging and composition analysis

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Peter T. Tang IPU

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  1. “MatPack” – deposition, modelling and characterisation of high melting pointlead-free micro solders Peter T. Tang IPU COST MP0602 meeting, Brno

  2. 3D-modelling of phase formation • Prediction of solder properties • Focused Ion Beam preparations • SEM imaging and composition analysis • Phase quantification by x-ray diffraction • Determination of melting point • Metrology • Life cycle assessment and toxicology • PVD of diffusion barriers • Electroplating of alloys • Deposition of multi-layers MatPack Concept and Subprojects COST MP0602 meeting, Brno

  3. High melting point solder Low melting point solder (SnAgCu, 217 °C) High Melting Point Solder Applications Ref. 04121279 EC exemptions, final report (ERA Technology) High melting point = Low melting point plus 50 °C or more! COST MP0602 meeting, Brno

  4. Solder Deposition COST MP0602 meeting, Brno

  5. Electroplating Processes • The following electroplating processes are established at IPU: • SnZn (9% Zn) Commercial process, SLOTOLOY ZSN • Melting point (eutectic) 198 ºC • SnCu (0.7% Cu) Commercial process, Yuken • Melting point (eutectic) 217 ºC • SnCu (3% Cu) Semi-commercial process, Yuken • Melting range 217-350 ºC • AnSn (20% Sn) Commercial process, Technic AuroStan H • Melting point (eutectic) 278 ºC • Pure Au and Pure Sn Available in several versions COST MP0602 meeting, Brno

  6. ~315°C 183°C Well-known Pb-Sn Solders http://www.metallurgy.nist.gov/phase/solder/solder.html COST MP0602 meeting, Brno

  7. SnCu Phase Diagram COST MP0602 meeting, Brno

  8. Elements that can be deposited COST MP0602 meeting, Brno

  9. Multi-layers or Composition Modulated Alloys COST MP0602 meeting, Brno

  10. Advantages: Mildly alkaline electrolyte (pH=9) compatible with photoresist No “whiskers” tendency due to a silver content of 3.8 At.% No phase transformation at low temperatures (13 °C) Melting point approximately 10 °C lower than pure tin Relatively “safe” bath Tin-silver Alloys for Soldering COST MP0602 meeting, Brno

  11. Phase Diagram of Tin-silver COST MP0602 meeting, Brno

  12. M Tin chloride SnCl2 · 2 H2O 0.1810 Potassium pyrophosphate K2P2O7 0.5000 Silver iodide AgI 0.0026 Potassium iodide KI 1.2000 Triethanolamine C6H15NO3 0.2000 Electrolyte Composition Room temperature pH = 9.3 Triethanolamine COST MP0602 meeting, Brno

  13. Surface Without TEA COST MP0602 meeting, Brno

  14. Rotating Cylinder Electrode COST MP0602 meeting, Brno

  15. Silver Concentration COST MP0602 meeting, Brno

  16. Rotational Speed COST MP0602 meeting, Brno

  17. Bath Temperature COST MP0602 meeting, Brno

  18. Influence of pH 31% Ag 3.8% Ag x2400 x1200 COST MP0602 meeting, Brno

  19. Flip-chip Bonding Components Bumps are pure tin from a neutral electrolyte! COST MP0602 meeting, Brno

  20. Hot-stage Microscope 1. Vacuum system 2. Heating chamber (6x8x6 mm) 3. Imaging system COST MP0602 meeting, Brno

  21. Forming and Remelting c) d) AuSnNi COST MP0602 meeting, Brno

  22. Cross-section (LOM) 144.4 mg of Au and Sn powder – a slightly hypoeutectic composition of 83.1% Au and 16.9% Sn (wt.%) COST MP0602 meeting, Brno

  23. AuSn Phase Diagram Sample composition AuSn Au2Sn Au5Sn COST MP0602 meeting, Brno

  24. Cross-section (SEM) Au5Sn Au80Sn20 (eut.) COST MP0602 meeting, Brno

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