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HINNOTECH Introduction HINNOTECH Culture HINNOTECH Material Introduction Laminate Property Benchmark PCB Process Properties Summary. Contents. HINNOTECH Introduction.
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HINNOTECH Introduction HINNOTECH Culture HINNOTECH Material Introduction Laminate Property Benchmark PCB Process Properties Summary Contents
HINNOTECH Introduction • JIANGMEN HINNO-TECH CO., LTD. is a professional manufacturer of CCL materials and optical materials, and a joint venture established by JIANGMEN YINGJIANG TRADING CO., LTD. and Hong Kong Well Bright International Development Co., Ltd. It owns independent production, marketing and development research. • HINNOTECH Basic Information
HINNOTECH Culture • Corporate culture: • Integrity Management, Pioneer Innovation, ECEP (Energy Conservation • Environmental Protection), People-oriented. • Corporate values: • Sincerity, Cooperation, Innovation, Environmental. • Quality policy: • Create excellent quality, Exceed customer expectations. • Environmental Policy: • Legislation compliance, Environmental protect implemention, Pollution • prevention, Energy efficiency, Waste induction, Continuous improvement. • Vision: • Technology innovation creates good lives.
HINNOTECH Materials Introduction • Product Properties • PCB Application • End-user Application
PCB Application HINNOTECH Products have high performance /cost ratio.
End-user Application Remark: ◎ excellent application, ○ good application.
Laminate Property Benchmark • Lead-free Normal Tg Benchmark • Lead-free Mid Tg Benchmark • Lead-free High Tg Benchmark • Lead-free & Halogen-free Benchmark
Lead-free Normal Tg Benchmark Remark: based on 1.6mm. H-840 has higher Tg, lower CTE and lower moisture absorption, which shows it has better thermal resistance than other similar materials.
Lead-free Mid Tg Benchmark Remark: based on 1.6mm. H-850 has excellent thermal resistance, low CTE, high peel strength and low moisture absorption. Its properties are similar to the others’.
Lead-free High Tg Benchmark Remark: based on 1.6mm. H-880 also has high reliability as same as other high Tg materials.
Lead-free & Halogen-free Benchmark Remark: based on 1.6mm. H-850G also has good thermal resistance, low CTE, high peel strength and low Df properties.
Inner Layer Laminate Drilling Desmear Punch or Routing PCB Process Properties
Inner layer The first boardtest must be taken to find suitable parameter(dimension compensation) before mass production. For Oxide treatment, we prefer to multibond and recommend to use lead free medicament. Recommend to post-oxide baking for at least 40min at 120℃ to remove moisture.
FR4 H-840 H-850 H-880 H-850G EM827 370HR Drilling Remark: 2000hit, 1.6mm 2PNL/stack for Φ0.4mm hole. HINNOTECH products have low drilling loss that is close to traditional FR4
Items FR4 H-840 H-850 H-880 H-850G Desmear Desmear Loss 1 1 0.8 0.5 1 Desmear cycles 1 1 1 2 1 Desmear H-840 and H-850G have good desmear properties as same as traditional FR4. But H-850 and H-880 are a little difficult to be desmeared comparing to traditional FR-4.
Punch or Routing H-840 and H-850G are same as traditional FR4 for punch. • Guideline for punch or routing • Punch ability comparison (FR4、H-840、H-850G) Based on 1.6mm thickness.
HINNOTECH lead-free or/and halogen-free materials have excellent performances such as high thermal resistance, high peel strength, low CTE, and so on. The PCB process properties are quite excellent for HINNOTECH materials. Especially, their drilling loss are lower than similar materials in present market, which can help PCB to achieve cost down. HINNOTECH products have high performance/cost ratio. Based on the above information, it is absolutely optimal choice to use HINNOTECH lead-free or/and halogen-free materials for lead-free assembly application. Summary
UL Certification UL File No. E335867
