Who are Semelab plc ?

1. Who are Semelab plc ? • Based at Lutterworth, Leics. • Privately-Owned UK Company • Established 35 years • Grown year -on- year • Profitable every year • Own diffusion fab – Semefab • Based in Glenrothes, Scotland • Acquired 15 years ago • Key focus – Mixed-signal A.S. I.C.s • MEMS & NanoMems • In house die supply

2. Today solutions:- World wide producers are designing the next generation of commercial airliners Boeing 787 Dream liner and Airbus A380 & A350 Tupolev TU334, Sukholi Superjet 100 Typical these are designed to have a 20 % reduction in fuel consumption and subsequent emissions, while offering exceptional noise reduction while in flight • This is achieved by the extensive use of the following:- • Composite bodies over 50% saving in the use of aluminium • Power electronic cooling system • Electronic braking rather than hydraulic • HID/ LED lighting • Advance Electronic Flight control and wing surfaces All items marked in red supplied by Semelab

3. M.O.E.T More Open Electrical Technology A European commission led program to develop the next generation of electric aircraft • Main partners:- • Airbus • Goodrich • Safran Group • Leibherr • Rolls Royce • Semelab

4. P.O.A E.T.R.A.S Power Optimised Aircraft Electrical reverse thrust actuation system Semelab working with Hispano Suiza, Messier Bugatti and Sagem To develop the next generation of flight control systems “Tomorrows aircraft will based more on electronic systems offering more reliability affordable and cleaner aircraft” Alain Coutrot Vice president Research and technology Safran Group

5. Typical Products being built and supplied now by Semelab PLC for the future aircraft use • Power modules for the following applications:- • Flight surface actuation modules • Rudder control • Slats controllers • Aeriolons controls • Engine reverse thrust module • Advanced de-icing controllers • Wheel antilock braking systems

6. Advanced Flight module A380 Rudder control 3 phase input rectifier

7. A380 I.G.B.T Module For flight actuation systems:- • 300 Amp • 1200 Volts • 3000 temp Cycles –50ºC - 150 ºC

8. Semelab have optimise standard plastic module for aircraft use in order to achieve the following:- • Low weight typical 66% of the weight of conventional modules • Enhanced performance designed to last for a 25 year aircraft life • Typically survives 2500 temperature cycles from -50 C - +150 Deg C

9. Typical constructions consist of:- • Lightweight metal matrix base plate • CTE of 7 p.p.m • A.M.B substrates • CTE of 6 p.p.m • State of the art die • CTE of 4.5 p.p.m • Custom die coats and encapsulates It can be see that our structure as a very closely match vertical C.T.E structure and hence the stress in the module is kept to a minimum.

10. In Flight Comfort State of the art electronics offer better air conditioning approx 20 % improvement on air circulation time While building on Semelab world beating “D” Class Amplifiers, Anti noise system will be developed to ensure a more comfortable and relaxing flight The same technology can also be used provide high efficiency power supplies in aircraft for your laptop Ipod or PDA Please note the anti noise system could also be used in Industrial or office based systems

11. Hermetic packages for the future • Typical module construction for today’s application:- • Copper or copper base plate • Kovar ring frame • ALN substrate • Expensive glass or ceramic - metal seals • Typical application:- • Rocket steering thrust vectors • Oil feed drill steering • Engine vane control

12. Antle Engine Turbine Vane ACTUATOR Designed to increase fuel efficiency by 10%

13. FEATURES : AMB (active metal brazed) Hermetic Substrate Package Copper conductors Si3N4 Insulator No glass/ceramic seals Comparable thermal resistance to AlN SI3N4 Via connectivity “state of the art” packaging • Removal of glass/ceramic seals – Hermeticity • Minimised number of wirebonds – Reliability • Size/Weight reduction – Efficiency

14. Production Alumina DBC (Cu metallization) • 500(max) temp cycles -55°C to 125°C expected before conchoidal fractures appear • (Source: Semelab Plc) • Production AlN AMB (with Al metallization) • 2000 temp cycles passed -55°C to 125°C without fracture or delamination (Source: Semelab Plc) • AMB Silicon Nitride (Cu metallization) • 5000 temp cycles passed -60°C to 175°C without fracture or delamination • 2000 temp cycles passed -65°C to 150°C without hermiticity failure (Source: Kyocera Corp Semelab parts under qualification)

15. Alumina DBC package (no baseplate) • 0.3/0.635/0.3mm Cu/Al2O3/Cu • 1.24 °C/W • AlN AMB package (no baseplate) • 0.3/0.635/0.3mm Al/AlN/Al • 0.42 °C/W • Si3N4 package (integrated baseplate) • 0.3/0.32/0.3/0.3/0.635/0.3mm Cu/Si3N4/Cu/Cu/Si3N4/Cu • 0.76 °C/W

20. Typical use of Si3N4 Packages • Radiation tolerant Mosfet bridge with steering elements • And protection circuitry- • Programs For space Altika and YAHsat satellites • 150 Krad total dose • Good safe operating area up to 59 LET (MeV) • Full radiation specification available on request

21. Si3N4 Substrate combined With Conventional technology • The use of Si3N4 offers:- • Low weight • Thermally efficiency • Increased current density • Vibration resistance Fully authorised Aircraft wheel braking system

22. die die solder solder copper copper Aluminium nitride Aluminium nitride Copper Copper solder Impingement cooler (3) MMC Heat sink (2) - Now NEW DESIGN FOR OPTIMISED THERMAL PERFORMANCE die solder copper Aluminium nitride Copper solder MMC Base plate Heat sink compound Copper or Aluminium Heat sink

23. die solder copper SILICON CARBIDE solder Future Advanced (4) - 3 years

24. DESIGN CONCEPTS TO ACHIEVE THERMAL PERFORMANCE AND RELIABILITY MEDIUM RISK - Impingement cooling

25. Total Pressure drop 13221 Pa (1.92 PSI) • Temperature rise ≤ 3.5 °C

26. Thank You