1 / 71

Electronic Engineering Department King Mongkut’s Institute of Technology Ladkrabang Lecture # I 01044050 MICROELECTRON

Electronic Engineering Department King Mongkut’s Institute of Technology Ladkrabang Lecture # I 01044050 MICROELECTRONICS MANUFACTURING 2 nd Semester 2006 http://www.kmitl.ac.th/~kbittibh/microelect.html http://www.rit.edu/~lffeee/emcr731.htm(Dr . Lynn Lecture Notes) OBJECTIVES

omer
Download Presentation

Electronic Engineering Department King Mongkut’s Institute of Technology Ladkrabang Lecture # I 01044050 MICROELECTRON

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Electronic Engineering Department King Mongkut’s Institute of Technology Ladkrabang Lecture # I 01044050 MICROELECTRONICS MANUFACTURING 2ndSemester 2006

  2. http://www.kmitl.ac.th/~kbittibh/microelect.html http://www.rit.edu/~lffeee/emcr731.htm(Dr. Lynn Lecture Notes)

  3. OBJECTIVES PROVIDE EXPERIENCE FOR STUDENTS IN APPLYING KNOWLEDGE FOR MICROELECTRONICS MANUFACTURING PROVIDE A REAL LIFE WORK IN AN MICROELECTRONICS MANUFACTURING PROVIDE A BASELINE FOR RESEARCH IN MANUFACTURING ALLOWS FOR BETTER CONTROL OF THE LABORATORY PROCESSES, IMPROVES QUALITY, REDUCES MANUFACTURING CYCLE TIME BETTER SATISFY OUR CUSTOMERS

  4. MICROELECTRONICS MANUFACTURING IS DIFFERENT THAN MICROELECTRONICS FABRICATION

  5. MICROELECTRONICS FABRICATION THE DESIGN AND REALIZATION OF A SEMICONDUCTOR DEVICE FOR CIRCUIT. THE GOAL IS ACHIEVED IFONE DEVICE OR CIRCUIT IS MADE TO WORK. RESEARCH IS CENTERED ON NEW TECHNOLOGIESAND MATERIALS, SMALLER AND FASTER DEVICES, NOVEL CIRCUITS, ETC. MICROELECTRONICS MANUFACTURING THE REALIZATION OF LARGE NUMBERS OF SEMICONDUCTOR DEVICES OR CIRCUITS. THE GOAL IS ACHIEVED IF LARGE NUMBERS OF CIRCUITS ARE MADE, AT LOW COST, WITH HIGH YIELD AND QUICK TURN AROUND. RESEARCH IS CENTERED ON MANUFACTURING METHOLOLOGY, OPERATIONS RESEARCH, STATISTIAL PROCESS CONTROL, FACTORY SIMULATION, ETC.

  6. NUMBER OF STUDENTS GRADUATING EACH YEAR WITH EDUCATION IN MICROELECTRONICS MANUFACTURING LESS THAN 100/YEAR AT THE GRADUATE AND UNDERGRADUATE

  7. TYPICAL UNDERGRADUATE MICROELECTRONICS EXPERIENCE MANUFACTURING CONTENT VLSI DESIGN (DIGITAL SYSTEMS) NONE ANALOG I.C. DESIGN(ELECTRONICS) NONE I.C. PROCESSING LECTURE NONE I.C. FABRACATION LABORATORY SMALL DEVICE PHYSICS NONE

  8. MANUFACTURING ENGINEERING CONTENT THAT IS MISSING OPEATIONS RESEARCH: FACTORY FLOOR SIMULATION WORK IN PROGRESS TRACKING TOTAL CYCLE TIME MANAGEMENT MATERIALS RESOURCE PLANNING SCHEDULING PRODUCTIVE MAINTENANCE

  9. STATISTICAL PROCESS CONTROL: DESIGN OF EXPERIMENTS STATISTICAL THINKING TIME SERIES ANALYSIS COMPUTER AUTOMATION: CAD, CAM, CIM SEC I, II ROBOTICS AI, EXPERT SYSTEM OTHER: LITHOGRAPHY

  10. CAD, CAM, CIM IN THE MICROELECTRONICS INDUSTRY THE DESIGN OF THE INTEGRATED CIRCUIT, INCLUDES LAYOUT EDITORS SUCH AS ICE, CHIPRAPH, DESIGN RULE CHECKERS, SWITCH LEVEL SIMULATORS, TIMING VERIFICATION, CIRCUIT SIMULATORS(PSPICE), SHEMATIC CAPTURE, TEST GENERATION ALSO- THE DESIGN OF THE FABRICATION PROCESS, INCLUDES PROCESS SIMULATORS SUCH AS SUPREM ROMANS II, BISIM, SAMPLE, PROLITH, DREAMS, PROSIM, DEPICT 2 etc. CAM – COMPUTER AIDED MANUFACTURING FACTORY SIMULATION, PLANNING AND SCHEDULING OF WORK IN PROCGRESS, THE OPERATION OF THE FABRICATION PROCESS, INCLUDES LOT CONTROL, DATA COLLECTION, STATISTICAL PROCESS CONTROL, DESIGN OF EXPERIMENTS, FACILITIES, MONITORING, RECIPE MODIFICATION AND DOWNLOADING, YIELD MODELING, FLEXABLE MANUFACTURING, ROBOTICS, AI, EXPERT SYSTEMS

  11. CIM – COMPUTER INTEGRATED MANUFACTURING CONCEPT IN WHICH COMPUTERSOFTWARE AND HARDWARE IS INTEGRATED THROUGHOUT A MANUFACTURING FACILITY TO PROVIDE INTEGRATION AMONG FUNCTIONS SUCH AS ENGINEERING AND RESEARCH, PRODUCTION PLANNING, PLANT OPERATIONS, SHIPPING, RECEIVING, BUSINESS MANAGEMENT, MARKETING, EVERYTHING

  12. Work flow through NMOS process, is about 60 steps. This illustrates the manufacturing problem industrial engineering. There is also a yield loss at each step. 2 1 3 4 5 8 6 7 9 10 11 14 17 18 13 12 15 16 19 20 21

  13. Computer automated microelectronics manufacturing Capabillites Control Equipments Access and Monitor Equipment Status Monitor Clean Room Environment Measure Performance Provide a Laboratory to Test Manufacturing Control Equipment(Download Recipes) Collect in-Process Test Data Collect Final Test Data Statistical Process Control Schedule Operations Materials Planning Operator Prompts Control Robotic Systems Manual Input and Auto Input Notebooks

  14. SUMMARY Product Technology - is not the primary factor in competitiveness that it oncewas Manufacturing - is now at least as important The world semiconductor will be won by those who can manufacture

  15. CONCLUSIONS The universities in the United States can be world leaders in Microelectronics manufacturing education and research World leadership in manufacturing research des not guarantee manufacturing competitiveness THE UNIVERSITIES ROLE Give new importance to manufacturing(New courses and new programs) Get manufacturing into the B.S. level programs so that when they become engineers in industry, they are prepared to be world leaders in manufacturing. INDUSTRY ROLE Give new importance to manufacturing engineering(attractive career paths) Need to redefine jobs and retrain employees

  16. MICROELECTRONICS MANUFACTURING INCLUDES SEMICONDUCTOR TECHNOLOGY DEVICE FABRICATION SEMICONDUCTOR MANUFACTURING LITHOGRAPHY MATERIALS SCIENCE

  17. SEMICONDUCTOR TECHNOLOGY OXIDATION/DIFFUSION LPCVD PLASMA ETCH RAPID THERMAL ANNEAL SPUTTERING ION IMPLANT LITHOGRAPHY

  18. DEVICE FABRICATION ELECTRONIC DEVICES MOS STRUCTURES DIODE, RESISTORS TRANSISTORS GATES, RING OSCILLATORS ANALOG OTA’S MICROELECTROMECHANICAL SENSORS, ACTUATORS OTHER

  19. SEMICONDUCTOR MANUFACTURING WIPTRACKING PROCESS ENGINEERING STATISTICAL PROCESS CONTROL CYCLE TIME DEFECT REDUCTION & YIELD ENHANCED TQM, CP, CPK

  20. LITHOGRAPHY EXPOSURE TOOLS COAT AND EEVELOP TOOLS RESIST MATERIALS POSITIVE NOVALAC RESISTS NEG CHEMICALLY AMPLIFIED CONTRAST ENHANCEMENT DYED, ARC MULTILAYER TOP SURFACE IMAGING MODELING PHASE SHIFT DUV

  21. MATERIALS SCIENCE SURFACE ANALYSIS SEM, TEM AUGER, SIMS XPS, ESCA MATERIALS PROCESSING METALS(SPUTTERING) CVD(LPCVD) PLASMA RAPID THERMAL

  22. BASIC EDUCATIONAL FACILITY 3-6 TUBES FURNACE RESIST SPINNER BAKE OVEN OR HOT PLATE CONTACT PRINTERS WET ETCH HOOD EVAPORATIOR OPTICAL MICROSCOPE 4PT PROBE, GROOVE SUPREM II

  23. CMOS CAPABLE EDUCATIONAL FACILITY BASIC FACILITYPLUS ALL BELOW LPCVD POLY AND NITRIDE WAFER COAT//DEVELOP SYSTEM STEPPERS PLASMA ETCHOR RIE SPUTTERING ION IMPLANT SEM, NANOSPEC SUPREM III, IV, PSPICE

  24. A UNIVERSITY MICROELECTRONICS CIM SYSTEM CAPABILITIES CONTROL EQUIPMENT ACCESS MONITOR EQUIPMENT STATUS LOT TRACKING OPERATOR INSTRUCTIONS EQUIPMENT OPERATION MANUALS SCHEDULEING MANUAL INPUT AND AUTO INPUT DATA COLLECTION STATISTICAL PROCESS CONTROL MONITOR CLEANROOM ENVIRONENT MATERIALS PLANNING DOWNLOAD RECIPES TO EQUIPMENT CONTROL ROBOTIC SYSTEMS EXPERT SYSTEMS

  25. MICROELECTRONICS MANUFACTURING PLAN INSTALL HARDWARE AND SOFTWARE FOR RESOURCE PLANNING TO KEEP INVENTORY OF CHEMICALS, WAFERS AND GASES. UNPACK AND PLACE EQUIPMENT PROVIDE ELECTRICITY AND COMMUNICATIONS HOOK UP LAY CABLE TRAYS PURCHASE AND INSTALL CONNECTORS AND CABLE OBTAIN TRAINING FOR SYSTEM OPERATOR SET UP BAR CODE SYSTEM FOR WAFER LOTS SET UP BAR CODE DETAILS FOR PIECES OF EQUIPMENT AND PEOPLE INSTALL ALL SOFTWARE CUSTOMIZE WIPTRACK SOFTWARE INPUT PROCESS SEQUENCE INPUT OPERATOR INSTRUCTIONS INPUT EQUIPMENT OPERATOR MANUALS INTERFACE SYSTEM TO INDIVIDUA PIECES OF EQUIPMENT FOR CONTROL

  26. PROCESS DETAILS PHOTORESIST COAT AND DEVELOP TRACK SYSTEM EXPOSURE TOOL(STEPPER) WITH INTERFACE ION IMPLANTER MASKMAKIN SPUTTERING SYSTEM WAFER CLEANING SYSTEM LPCVD POLY AND NITRIDE FURNACE WITH AUTO LOADING AND SECS INTERFACE

  27. SEMICONDUCTOR INDUSTRY OVERVIEW

  28. HISTORY • VERY PURE SILICON AND GERMANIUM • 1947 PN JUNCTION DIODES INVENTED • 1947 THE JUNCTION TRANSISTOR IS INVENTED AT BELL LABS BY HARDEEN, BRATTIN AND SCHOCKLEY • 1950 SINGLE CRYSTALS BY TEAL AND LITTLE AT BELL LABS • 1954 TEXAS INSTRUMENTS INTRODUCES COMMERCIAL PRODUCTION OF THE TRANSISTOR • 1958 INTEGRATED CIRCUITS INVENTED BY KILBY AT TI • 1960 FIRST PLANER INTEGRATED CIRCUITS INVENTED BY NOYCE AT FAIRCHILD • 1962 FIRST COMMERCIAL INTEGRATED CIRCUITS

  29. WORLDWIDE INDUSTRY RANKINGS PETROLEUM REFINING $ 941,825 MOTOR VEHICLES AND PARTS $ 796,129 ELECTRONICS $ 640,101 FOOD $ 382,422 CHEMICALS $ 374,627 METALS $370,693 INDUSTRIAL AND FARM EQUIPMENT $197,303 COMPUTER(OFFICE EQUIPMENT) $ 179,789 AEROSPACE $ 166,558 FOREST PRODUCTS $ 142, 556 PHARMACEUTICALS $ 116,081 BEVERAGES $ 96, 278 BUILDING MATERIALS $ 93,825 METAL PRODUCTS $ 88,783 BILLIONS

  30. WORLDWIDE ELECTRONICS INDUSTRY CONSUMER ELECTRONICS $ 60.7 ACTIVE COMPONENTS $ 47.6 PASSIVE COMPONENTS $ 48.6 MEASUREMENT EQUIPMENT $ 47.3 PROFESSIONAL ELECTRONICS $ 94.9 TELECOMMUNICATIONS $ 58.0 AUTOMATION $ 46.6 DATA PROCESSING $ 191.5 SOFTWARE $ 123.8 OFFICE AUTOMATION $ 26.0 TOTAL $ 640.1 BILLION

  31. WORLD’S TOP 20 ELECTRONICS COMPANIES COMPANY COUNTRY SALES IBM CORP U.S. $ 62,710 MATSUSHITA JAPAN $ 31,319 NEC CORP JAPAN $ 24,975 TOSHIBA CORP JAPAN $ 22,674 HITACHI CORP JAPAN $ 22,055 PHILIPS NV N’LANDS $ 21,594 SEIMENS AG W. GERMANY $ 19,825 FUJITSU LTD JAPAN $ 18,477 SONY CORP JAPAN $ 16,904 GENERAL MOTORS U.S. $ 16,880 AT&T U.S. $ 16,612 CGE FRANCE $ 13,307

  32. WORLD’S TOP 20 ELECTRONICS COMPANIES COMPANY COUNTRY SALES DIGITAL EQUIPMENT U.S. $ 12,943 GENERAL ELECTRIC U.S. $ 12,369 MITSUBISHI JAPAN $ 11,862 XEROX U.S. $ 11,602 THOMSON CSF FRANCE $ 11,175 UNISYS U.S. $ 10,097 MOTOROLA U.S. $ 9,620 CANON JAPAN $ 9,593

  33. WORLD’S TOP 20 SEMICONDUCTOR MANUFACTURERS COMPANY NIPPON ELECTRIC $ 5,015 TOSHIBA $ 4,930 HITACHI $ 3,974 MOTOROLA $ 2,963 FUJITSU $ 2,787 TEXAS INSTRUMENTS $ 2,579 MITSUBISHI $ 2,430 INTEL $ 1,882 MATSUSHITA $ 1,716 PHILIPS $ 1,618 NATIONAL SEMICONDUCTOR $ 1,365 SANYO $ 1,301 SGS-THOMSON $ 1,260 SAMSUNG $ 1,230 SIEMENS $ 1,194 OKI SEMICONDUCTOR $ 1,154 ADVANCED MICRO DEVICES $ 1,100 SONY $ 1,077 AT&T $ 873 MILLION

  34. TOP 10 EQUIPMENT MAKERS 1988 NIKON $ 520 MILLION TOKYO ELECTRON $ 508 ADVANTEST $ 385 APPLIED MATERIALS $ 381 GENERAL SIGNAL $ 375 CANON $ 290 VARIAN $ 211 PERKIN ELMER $ 205 TERADYNE $ 190 LTX $ 180

  35. MARKET SHARE AND TOTAL SALES 1989 U.S. 43% MARKET SHARE SALE OF $ 28.6 BILLION JAPAN 39% MARKET SHARE SALE OF $ 26 BILLION REST OF WORLD 15% SALE OF $ 12.6 BILLION TOTAL $ 67.2 BILLION

  36. FOREIGN SEMICONDUCTOR FABS IN THE U.S. NEC - ROSEVILLE, CA FUJITSU - GRRECIAN, OR SONY - SAN ANTONIO, TX MITSUBISHI - RESEARCH TRIANGLE, NC MATSUSHITA - PUWALLUP, WA SHARP - SEATTLE, WA TOSHIBA - SUNNYVALE, CA HOYA(MICROMASK) – MOUNTAINVIEW, CA TOPPAN - DALLAS, TX

  37. TECHNOLOGY EVOLUTION INTRO DRAM FEATURE PROCESS DEFECT LITHO YEAR DENSITY SIZE STEPS DENSITY TOOL MBITS MICRONS /CM2 COST MIL $ 1985 1 1.00 230 0.80 0.8 1988 4 0.75 270 0.45 1.0 1991 16 0.50 380 0.32 3.0 1994 64 0.35 490 0.23 5.5 1997 256 0.25 590 0.16 7.0 2000 1000 0.15 700 0.05 10.0

  38. TECHNOLOGY BY 2000 I.C. FACTORY COST $1 BILLION GIGABIT DRAMS 100 MILLION TRANSISTOR I.C.’S LESS THAN 0.15 MICRON FEATURES LESS THAN 0.05 DEFECTS/CM2 250 MZ 2 BILLION INSTRUCTIONS/SEC 3 VOLTS 1 INCH BY 1 INCH CHIPS 400 LEADS 25 WATTS/CHIP 25 WATTS/CHIP

  39. NEW DESIGN TOOLS FOR 1 BILLION TRANSISTOR CIRCUITS NEW STRUCTURES, SUPERLATTICES QUANTUM-COUPLED DEVICES

  40. INTEGRATED CIRCUIT MANUFACTURING A VARIETY OF SEQUENTIAL STEPS WHICH RESULTS IN HUNDREDS OFTHOUSANDS OF TRANSISTORS BEING MADE AT THE SAME TIME ON EACH CHIP STEPS ARE: DEPOSITION - CVD, LPCVD, METALLIZATION SURFACE ALTERING – DIFFUSION, ION IMPLANTATION OXIDATION PHOTOLITOGRAPHY – ETCHING – WET CHEMICAL, PLASMA ETCH CLEANING -

  41. SEMICONDUCTOR MANUFACTURING 1991 PARTIAL CIM CASSETTE TO CASSETTE LIMITED AUTOMATIC MATERIALS MOVERS OUTPUT PARAMETER SPC EXSITU METROLOGY BATCH PROCESSING CLASS 10 TO 1 VLF LIMITED INTEGRATED PROCESS TOOLS 90% FAB YIELD 60% SORT YIELD 40% EQUIPMENT UTILIZATIONS 2X THEORETICAL CYCLE TIME 0.5 DEFECTS PER CM2 AT 1 MICRON 150-200 MM WAFER SIZE

  42. SEMICONDUCTOR MANUFACTURING MICROCONTAMINATION AND DEFECT CONTROL REQUIREMENTS WILL ESCALATE EXPONENTIALLY A 0.3 MICRON CHANNEL IS ONLY 3000 ATOMS LONG A 20 ANGSTROM THICK OXIDE FOR A CAPACITOR IS ONLY 4 MOLECULES THICK iiii A 60 ANGSTROM THICK OXIDE FOR GATE IS ONLY 12 MOLECULES THICK iiii

  43. YIELD = NUMBER OF WORKING CHIPS TOTAL NUMBER OF CHIPS YIELD = NUMBER OF STEPS AVERAGE YIELD/STEP 98% AVERAGE YIELD PER STEP AND 100 STEPS GIVES 13% OVERALL YIELD

  44. SEMICONDUCTOR MANUFACTURING AT A COST OF $1 BILLION FOR NEW FABS ASSET UTILIZATION WILL BE THE KEY TO COMPETITIVE MANUFACTURING EQUIPMENT RELIABILITY/UPTIME MUST BE MAXIMIZED, 100% TOTAL PREVENTATIVE MAINTANENCE INTER-BAYAND INTRA-BAY AUTOMATION WILL BE NEEDED ADVANCED WIP TRACKING TO ELIMINATE QUEUES AUTOMATED TOOLS AND RECIPE HANDILING EXTEND THE USEFUL LIFE OF TOOLS HUG THE 100% LOADING CAPACITY

  45. INTEGRATED CIRCUIT DESIGN 1 MICRON LINE REPRESENTED BY TWO PENCIL MARKS 1/10 INCH APART THIS IS 2500 TIMES ACTUAL SIZE THUS A 1/2 x ½ INCH CHIP DRAWN 2500 TIMES ACTUAL SIZE WILL BE MORE THAN 100 FEET BY 100 FEET COMPUTER AIDED DESIGN STATIONS(CAD)

  46. TESTING 6 INCH DIAMETER WAFER HAS A SURFACE AREA OF PI r2 = Pi X 9 OR ABOUT 30 SQ. IN. EACH .1 BY .1 INCH CHIP HAS AREA OF 0.01 THUS 3000 CHIPS PER WAFER TO TEST INDUSTRY STARTS TYPICALLY 5000 WAFERS PER WEEK THUS THERE ARE 15,000 CHIPS TO TEST PER WEEK IF WE TEST EACH CHIP IN 1 SECOND ITWOULD TAKE 4200 HOURS TO TEST ALL THE CHIPS MADE IN ONE WEEK(OR 100 TESTERS)

  47. EXTERNAL FACTORS TARIFFS, TRADE AGREEMENTS TAXES, GOVERNMENT INCENTIVES RESTRICTIONS/CONTROL/GOVERNMENT REPORTING CAPITAL AVAILABILITY AND COST ENVIRONMENTAL CONCERNS

  48. 200 mm FABS FOR THE 90’S DIE/WAFER FOR BIG CHIP SIZE 25 mm BY 25 mm DIE GIVES 25 DIE ON 200 mm WAFER GIVES 13 DIE ON 150 mm WAFER INTEL AMD MOTOROLA IBM DEC

  49. 200 mm FABS FOR THE 90’S ECONOMIC FACTORS 5000 WAFERS/WEEK 10 mm BY 10 mm Die $ 50/CHIP REVENUE/YEAR 200 mm FAB GIVES 324X5000X50X$50 = $4.05 BILLION/YEAR

  50. 200 mm FABS FOR THE 90’S ECONOMIC FACTORS WORLD SEMICONDUCTOR SALES $ 80 BILLION/YEAR $80 B/ $4 B = 20 FABS IN THE WORLD

More Related