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Shop Floor Manager (OSFM) and Business to Business (B2B) Tips and Fabless Semiconductor Implementation Example

Shop Floor Manager (OSFM) and Business to Business (B2B) Tips and Fabless Semiconductor Implementation Example. Jerry Edwards. Definitions: Shop Floor Manager (OSFM): Lot centric and lot/serial number centric manufacturing product

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Shop Floor Manager (OSFM) and Business to Business (B2B) Tips and Fabless Semiconductor Implementation Example

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  1. Shop Floor Manager (OSFM) and Business to Business (B2B) Tips and Fabless Semiconductor Implementation Example Jerry Edwards

  2. Definitions: • Shop Floor Manager (OSFM): Lot centric and lot/serial number centric manufacturing product • Stage: Product physical state and unit of measure. Semiconductor stages include: • FAB, BUMP, SORT, DIE, ASSEMBLY, TEST, FGI • Flow: Product stage sequence / consistent network routings in each stage • Binning: Process that results in multiple output parts based on process results (usually test)

  3. Definitions: …continued • Event: Action affecting a product lot that vendor must report (Receipt, Start, Move, Completion, Ship, etc.) • Data element: specific data column required in an event. Events have multiple data elements. • Business to Business Communications (B2B): Subcontractor manufacturing event communication and processing into Oracle applications. • Rosettanet 7B1 PIP: Process information protocol for manufacturing events. • Adaptor: Custom software to generate Oracle application transactions based on vendor reported events

  4. Presentation Scope: • OSFM Best Practices • Product structure • Network routing scope • OSFM Tips and tricks Mapping subcontractors into OSFM • Single inventory organization for all vendors • Vendor specific inventory organizations • B2B Process Outline • Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • B2B Process Outline Details

  5. OSFM Product Structure Suggestions • Define separate part numbers for each stagewherelots will flow in and out of stock (subinventories) and where wafers are converted to unassembled die (physically on the wafer but counted in dies) • Typical stages: FAB / BUMP / SORT / DIE/ASSEMBLED DIE / TESTED DIE / FINISHED DIE • Network routing scope: • Start and complete work orders at the same subcon for a single part number (stage) • Move from stockroom to stockroom between subcons • Keep routings simple: add operations to track lot progress, separate scrap transactions by value adding operation, separate operation yields, and to separate pay points. • Define alternate paths if required

  6. OSFM TIPS & TRICKS • Co-Products: Use co-product %’s to enter test binning expected results to drive over-planning by ASCP. • Note: user must enter primary bill via co-products form to use this feature. User cannot enter bill via bill of material form and then add co-product %’s in co-products form. • WIP Lot Bonus: • Starting job value is based on previous operation • Start network routings with dummy IN operation and use WIP Lot Bonus at subsequent operations only. Do not use WIP Lot Bonus into the first operation as component value is excluded resulting in inaccurate job costs. Each network routing requires minimum 3 operations other than wafer-to-die conversion.

  7. OSFM TIPS & TRICKS • Binning Process Options: • During Work Order: Perform WIP Split and update assembly (resulting part number) for each bin. Note: Update assembly treats update as a move so do not use update assembly at queue intra-operation step of an operation with OSP resource or you will duplicate purchasing activity. Work around: Move lot out of queue intra-operation step to prevent duplicate purchasing activity. • Post Work order: Complete work order, then perform Inventory lot split and Inventory lot translate for each bin to change the part numbers. • OSP Receiving: • Assign OSP resources so that quantity moved in will be correct OSP requisition quantity. For example: assembly charges for good quantity only. Assign OSP to operation after assembly. • Automate OSP receipts based on blanket releases.

  8. OSFM TIPS & TRICKS • Supervisor Workbench versus Move form • Viewing many job versus playing transactions for specific jobs

  9. OSFM TIPS & TRICKS • Supervisor Workbench versus Move form • Move form faster for playing specific job moves.

  10. OSFM TIPS & TRICKS • Partial Move Behavior • Move quantity retains mother lot name (not updateable) instead of a default child lot name. This is mismatch to real world lot naming as move quantity is usually the child lot.

  11. OSFM TIPS & TRICKS • Lot Create Work Order default lot name • Default lot name assumes a split. If using full lot drop the suffix.

  12. OSFM TIPS & TRICKS Problem with Combine move and scrap at an operation where outside processing resource is linked. OSP requisition is incorrectly the post (after) scrap quantity instead of the correct pre-scrap quantity. 12

  13. OSFM TIPS & TRICKS • Recommended Custom Reports: • Work Order Location (current operation) for all released jobs • Actual yield versus estimated yield by job and part number based on user entered date range. • Columns include quantity and value actual versus expected • Individual lot based job rows with subtotals by part number • For Automated B2B include a form to perform: • Query errored events • Correct event errors by changing column data • Change event status to trigger event validation re-processing.

  14. Suggested Enhancements • Sub-lots: Use for die parts • Enables user to track good die by wafer in die bank. Each wafer is a die sub-lot. User selects sub-lots when selecting lots and lot create form accumulates quantities into the child lot. Today user cannot track good die by wafer unless treating each wafer as a separate lot (not feasible). • Co-products • Enable user to enter co-products and expected binning %’s for parent (resulting) parts where bills of material already exist that were NOT created via the co-products form. • Lot Create: • Default mother lot number into resulting lot field. • Add default split lot extension if user enters a quantity less than full lot (add extension when user tabs from quantity field)

  15. Suggested Enhancements • Genealogy network (source and where used) • Explode with single select in the top row • Control with profile option

  16. Vendor mapping to OSFM Options • Single inventory organization for all vendors • One Inventory organization per vendor • Hybrid: • Separate inventory organizations for major vendors • Single inventory organization for smaller volume vendors • Note: This requires a dual design for B2B automation to support both mapping designs simultaneously

  17. Mapping subcontractors to OSFM • Single inventory organization for all vendors • Represent vendors via subinventory names to represent vendor / product stage • Setup an intransit subinventory to track lots moving between vendors • + for monthly close • One inventory organization to close • Note: Organization Hierarchies are available in HR to automatically close all inventory organizations in a hierarchy • - (negative) For Advance Supply Chain Planning • Sourcing rules apply to inventory organizations so ASCP cannot recommend vendors via sourcing rules • Excludes product transit time among vendors • Prevents easy-to-use subcon specific resource capacity planning in network routings

  18. Mapping subcontractors to OSFM • Separate inventory organizations for each vendor • Subinventories represent product stage at each subcon • - for product costs (more complex) • Mitigate by maintaining costs in the item master organization and using copy cost to pull costs into each subcon inventory organization • Supply chain cost rollup is available when sourcing chains are complete • - for monthly close (multiple organizations to close). Mitigate by setting up organization hierarchies in HR so user can close a hierarchy (one transaction) • + for Advanced supply chain planning • Sourcing rules for vendor inventory organization • Explicit transit times • Facilitates subcon specific resource capacity planning

  19. Mapping subcontractors to OSFM Separate inventory organizations for each vendor + for customer required subcon specific supply chains Enter a customer specific orderable part Enter supply chain specific sub-assemblies Enable supply chain specific parts in correct subcons (only) 19

  20. B2B Process Outline • Collecting subcon event data • Staging tables database • Subcon event processing • Subcon B2B performance measurement • Backup Processes • Subcon bring-up for manual and automated reporting • B2B Project suggestions

  21. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example Fabless Semiconductor Business process Scope: • Subcontractor manufacturing event communication • Staging Table scope, event validation, error correction, generating and sequencing lot based Oracle application transactions • Oracle transaction upload via application program interfaces into Oracle purchasing, inventory, and OSFM application modules

  22. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Business Process Overview • Staging Tables Scope • Manufacturing Event 7B1 Process Flow • Process Flow Details • B2B Event Handler Process • Execute preceding events filter process • Reported stage/event • Allowed preceding event • Lot last successful event • Perform Level 2 Content Validation • Oracle Transactions Logic for each Stage/Event • Automated Purchase Order Receiving for Outside processing services

  23. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Business Process Overview • Subcontractor event reporting and collection as per industry standard format 7B1. • Perform format (level 1) validation • Report level 1 errors to subcontractors • Stage level 1 pass events in a new database • Track event status • Perform event matrix test: • Content check for valid stage and event • Filter events prior to data content validation (level 2) based on predecessor event maps • Place events that fail predecessor event check into pending status • Queue passing events for level 2 (further content validation)

  24. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Business Process Overview • Perform data content validation (level 2) on events that pass predecessor event check • For level 2 pass events: For events that pass level 2 validation: Change transaction status code to indicate PASS (VA in example) • Sequence events • Sort events by event_id within lot number within part number (requires securing an event id from subcontractors that is easily sorted) • For each event generate appropriate Oracle transactions (map events to required Oracle transactions) • Upload transactions to application program interfaces • Track interface results • Update event status • Track event success history • Maintain event error history

  25. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Business Process Overview • Provide subcontractor event quality reports • B2B Management Workbench • Subcon setup • Error correction • Reset event status to force level 2 validation • Pending Event handler. • Maintain Lookup tables. • Logic requirements for B2B Error Handler • Update event status to error • Generate user friendly error explanations • Provide user access to correct errors and resubmit events for level 2 validation by changing data and event status code

  26. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Staging TablesScope • Dynamic data • Subcontractor Reported events • Subcontractor events as reported • Subcontractor event errors • Subcontractor event current data content and status • Subcontractor events successfully interfaced into Oracle applications (history table) • Static (Setup Data) • Event Filtering matrices: For each stage (FAB, SORT, etc.) and event (RECEIPT, etc.) • Allowed Preceding Events (Predecessor) by flow/stage/event • Level 2 (Content) Error codes and messages • Subcon site data • Subcon mapping to inventory organization. Each subcon is represented as a separate inventory organization: Site DUNS # is tied to the vendor (subcon) site setup which, in turn, identifies the inventory organization.

  27. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Staging TablesScope: example of as reported event columns

  28. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Staging TablesScope…continued • Flow/stage/event allowed predecessor events • Last successful event by lot • Events with errors (history for quality reporting) • Other look up tables where look up is 100% consistent

  29. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Manufacturing Event 7B1 Process Flow (Client example)

  30. Fabless Semiconductor (B2B) Functional Spec Application Server Integration

  31. Fabless Semiconductor (B2B) Functional Spec BPEL Transformation / Populate Staging tables

  32. Fabless Semiconductor (B2B) Functional Spec BPEL Transformation / Populate Staging tables

  33. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Process Flow Details • Subcontractor event reporting and collection as per industry standard format 7B1. • Perform format (level 1) validation available from standard B2B software • Expected File format • File Parsing Error • Zero Byte check • Mandatory Fields as per 7B1 RosettaNet standards requirement (we are optional rows to meet business requirement which we will verify in level 2 content validation/check)

  34. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Process Flow Details • BPEL Transformation and population of the staging table : • Transport to message queue successful • Check for staging db available • if it is up then insert into staging • If the staging db is not up then BPEL will wait for some time and sending an email • Successful load to B2B tables (Pass messages) • Incorrect File according per DSPG requirements • Future enhancement #1: Check for daily transmission from subcon to validate communications even if subcon has no events to report. • Communicate level 1(format) errors to subcontractors

  35. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • Process Flow Details • Insert level 1 pass events in a new database (staging tables) • Track event status: Proposed statuses • NE = new Loaded into staging tables • QU = Passed event matrix test: Ready for level 2 validation Passed event matrix check • PE = Pending, Failed filter process due to incompatible last successful event (for the event lot) • VA = Validated: ready for sequencing and submitting to Oracle application interfaces • ER = Error (content) • IN = Sequenced (event id within lot number for each part number) and submitted to application interfaces (API’s) • FA = Failed Oracle interface • SU = Successfully processed into Oracle applications • ME = Manual entry , not further action required . • NA = As we got from the sub contactor we nothing to do with it. • None; Applicable to internal build event where we search for work order requirement from Build request file and none exists.

  36. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • B2B Event Handler Process • Filter events prior to data content validation (level 2) based on predecessor event maps • Setup, for each stage (FAB, SORT, ASSY, FG, PRE-ASSEMBLY) and event (RECEIVE, START, MOVE, etc.) combination generate a look up table (matrix) containing allowed predecessor stage/events for the reported stage/event combination.

  37. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • B2B Event Handler Process • Filter events prior to data content validation (level 2) based on predecessor event maps • Setup, for each stage (FAB, SORT, ASSY, FG, PRE-ASSEMBLY) and event (RECEIVE, START, MOVE, etc.) combination generate a look up table (matrix) containing allowed predecessor stage/events for the reported stage/event combination. • Perform Level 2 data content validation • Global (all events) validation logic and Event Specific validation logic

  38. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example • B2B Event Handler Process • For validated events generate required Oracle transactions • Receipt event: Generate appropriate receipt • Start event: Generate lot based job • Etc. • Automated Purchase Order Receiving for Outside processing (OSP) services • Generate automated blanket releases for OSP via standard blanket release, sourcing rule, and sourcing assignment setups) • Generate outside processing blanket release receipts as soon as the blanket release occurs

  39. Fabless Semiconductor (B2B) Functional Specifications and Solution Design Example (last example slide) • B2B Event Handler Process: Error Correction HTML form

  40. B2B Process Outline…Best Practice • Collecting subcon event data • Staging tables database • Subcon event processing • Subcon B2B performance measurement • Backup Processes • Subcon bring-up for manual and automated reporting • B2B Project suggestions

  41. B2B Process Outline… Collecting vendor event data… Define stages and events within each stage by product line Define product lines: Product line scope: same stage sequence same events within each stage products with the same stage sequence and events constitute a product flow Define stage and event matrix Define valid predecessor events for each stage/event Define event data elements Oracle transaction data elements B2B data elements 41

  42. B2B Process Outline… • Collecting vendor event data…continued Sample Stage and Event Matrix

  43. B2B Process Outline… • Collecting vendor event data…continued • Define data elements for each stage and event combination

  44. B2B Process Outline… • Collecting vendor event data… Stage and event example: SHIP at FAB EVENT CODE SHIP Vendor ID This field represents the Partner’s DUNS number and needs to be reported by every partner. Vendor Location ID This field represents the Location DUNS number for Vendor Site location at which the respective manufacturing stage is being processed. To Vendor ID This field represents the ship-to vendor’s Location DUNS number.

  45. B2B Process Outline… • Collecting vendor event data… continued SHIP at FAB: Stage and event Example continued… Transaction ID Vendors need to report a transaction identifier that will be unique for all the events that are being reported by the vendor. This field eliminates confusion between user and vendor when errors occur with a transaction. Transaction Date and Time Vendors need to report all the transactions in GMT time and in 24 hr format. Code the value as per xml format ‘YYYYMMDDThhmmssZ’. Part Number This field represents a user part number being purchased as per PO line provided to the FAB vendor . Manufacturer Part Number: This field represents the FAB part number assigned by the Wafer Foundry that cross references to the user part number.

  46. B2B Process Outline… • Collecting vendor event data… continued SHIP at FAB: Stage and event Example continued… Lot Stage Identifier This field represents physical location of the lot in the manufacturing cycle. This is a hardcoded field and needs to be reported as “FAB” all the time for all transactions being reported as shipment from the FAB vendors. Lot Type Classification This field represents the classification of the Lot and has two possible choices, Engineering Production This is needed if vendors cannot omit engineering lots from reporting. Lot Number This field represents the FAB assigned lot number to the lot that is being shipped by the FAB vendor. Each event requires a unique lot number. Do not report the same part number, lot number for multiple shipments.

  47. B2B Process Outline… • Collecting vendor event data…continued SHIP at FAB: Stage and event Example continued… Lot Quantity This field represents the full lot quantity being shipped for the purchased part number PO Number This field represents the NetLogic PO number for the purchased wafer. and lot PO Line Number (optional) This field represents the NetLogic assigned PO Line number for the purchased part number and lot. Note: automation will be easier if the FAB vendor can supply the PO line number in addition to the PO number. REPEAT FOR ALL PRODUCT LINE STAGE/EVENTS

  48. B2B Process Outline… • Collecting vendor event data…continued • Generate vendor reporting requirements document to include: • Reporting rules by stage • Stage and event data elements with explicit definitions • Provide spreadsheet event samples

  49. B2B Process Outline… • Collecting vendor event data… • Generate Network Routing Flow document • Routing flow for each product line, stage, and flow • Enables vendors to map their routings to OSFM network routings • Multiple vendor operations may occur for each OSFM operation • OSFM operations are based on tracking locations, operation yields, scrap locations, operation lead times, and manufacturing service pay points.

  50. B2B Process Outline… • Collecting vendor event data… • Generate vendor communications bring up document: • Manual reporting • Automated reporting

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