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8 吋高密度電漿輔助化學氣相沉積系統 (HDPCVD) 簡介

8 吋高密度電漿輔助化學氣相沉積系統 (HDPCVD) 簡介. System Configuration. 1. System Maker : Applied Materials.Inc 2. System Model : Centura 5200 3. Serial Number : 35605-03 4. Mainframe : Ultima HDP MF w/Multi-Slot 5. Load Lock : Nerrow Body 6. Wafer Size : 200mm SNNF

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8 吋高密度電漿輔助化學氣相沉積系統 (HDPCVD) 簡介

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  1. 8吋高密度電漿輔助化學氣相沉積系統(HDPCVD)簡介8吋高密度電漿輔助化學氣相沉積系統(HDPCVD)簡介

  2. System Configuration • 1. System Maker : Applied Materials.Inc • 2. System Model : Centura 5200 • 3. Serial Number : 35605-03 • 4. Mainframe : Ultima HDP MF w/Multi-Slot • 5. Load Lock :Nerrow Body • 6. Wafer Size : 200mm SNNF • 7. Chamber Type & Quantity : Chamber : A =Ultima Plus • Chamber : D = DxZ • 8. Other Chambers :Ch#E (MSCD) Ch#F Orienter • 9. RF Generator : ETO Generator, RFG-2000-2V • 10. RPC :MKS - AX7670 • 11. Robot Type : HP Robot • 12. Turbo Pump : EBARA – ET1600W

  3. PROCESS DATA Chamber “A” HDP (HDP 1.0K), Temperature < 400℃ Depo Rate

  4. PROCESS DATA Chamber “D” DxZ (PE-SiO2 1.0K) Depo Rate Chamber “D” DXZ ( PE-OX-1.0K )

  5. PROCESS DATA Chamber “D” DxZ (PE-SiN 1.0K) Depo Rate Chamber “D” DXZ ( PE-NIT-1.0K-R )

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