'3d ic' presentation slideshows

Wafer Cut and Rotation to Improve the Compound yield for 3D Wafer-on-Wafer Stacking Bei Zhang

Wafer Cut and Rotation to Improve the Compound yield for 3D Wafer-on-Wafer Stacking Bei Zhang. Thesis Advisor: Dr . Vishwani D. Agrawal Thesis Committee : Dr. Victor Nelson Dr . Adit Singh Dr. Charles Stroud. Department of Electrical and Computer Engineering

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Conceptual design of a Pick and Place machine for 3D-IC

Conceptual design of a Pick and Place machine for 3D-IC. Jasper Winters, Mechatronic System Design. A TNO initiative. Contents. Introduction: Introduction to electronics Introduction: What is 3D-IC? Analysis: Pick and Place limits Design: Machine concepts

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Low-Latency Wireless 3D NoCs via Randomized Shortcut Chips

Low-Latency Wireless 3D NoCs via Randomized Shortcut Chips. Outline: Random chip for 3D WiNoCs. 3D Wireless NoCs (3D WiNoCs ) [ 7 min] Wireless 3D IC technology 3D WiNoC design example (65nm) Adding random NoC chip for 3D WiNoCs [8min]

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Low-Latency Wireless 3D NoCs via Randomized Shortcut Chips

Low-Latency Wireless 3D NoCs via Randomized Shortcut Chips. Outline: Random chip for 3D WiNoCs. 3D Wireless NoCs (3D WiNoCs ) [ 7 min] Wireless 3D IC technology 3D WiNoC design example (65nm) Adding random NoC chip for 3D WiNoCs [8min]

627 views • 33 slides

A Vertical Bubble Flow Network using Inductive-Coupling for 3D CMPs

A Vertical Bubble Flow Network using Inductive-Coupling for 3D CMPs. Hiroki Matsutani 1 , Yasuhiro Take 2 , Daisuke Sasaki 2 , Masayuki Kimura 2 , Yuki Ono 2 , Yukinori Nishiyama 2 , Michihiro Koibuchi 3 , Tadahiro Kuroda 2 , Hideharu Amano 2.

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Introduction to 3D?

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What every Architect should know about Technology, Sani R. Nassif,

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3-D IC Fabrication and Devices

Abstract : 3-D integrated circuits utilize z-axis allowing unique fabrications designs. This utilization allows cheaper, more compact, and efficient integrated circuits. 3-D IC Fabrication and Devices. Thong Moua Monday April 11 th 2016. Outline. Background information

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Global 3D IC Market 2014- 2018

To Get details: http://www.bigmarketresearch.com/global-3d-ic-2014-2018-market "Global 3D IC Market Size, Trend, Analysis, Report, Research, Technology, Opportunity and Forecast 2014-2018" A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment. The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems.

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WP4 Working Session

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Global 3D IC Market Trends, Competitive Landscape Analysis and Key Companies Forecast Report 2015

For more info@https://goo.gl/vIbMhM Synopsis The Global 3D IC Industry 2015 Market Research Report is a professional and in-depth study on the current state of the 3D IC industry. The report provides a basic overview of the industry including definitions, classifications, applications and industry chain structure.The 3D IC market analysis is provided for the international markets including development trends, competitive landscape analysis, and key regions development status.

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3D Standards

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Global 3D IC and 2.5D IC Packaging Market Report, Industry Analysis, Size, Share, Trends, Segment and Forecasts to 2025

InForGrowth market research report presents the worldwide 3D IC and 2.5D IC Packaging market size (value, production and consumption), splits the breakdown (data standing 2013-2018 and forecast to 2025), by makers, region, sort and application. This study additionally analyses the market standing, market share, rate of growth, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's 5 Forces Analysis.

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Global Flip Chip Market

Global Flip Chip Market was valued US$ 22.91 Bn in 2017 and is expected to reach US$ 39.85Bn by 2026 at a CAGR of 7.16 % during the forecast period.

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Flip Chip Market

Global Flip Chip Market was valued US$ 22.91 Bn in 2017 and is expected to reach US$ 39.85Bn by 2026 at a CAGR of 7.16 % during the forecast period.

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3D IC Market and Major Supply Chain Players in Taiwan Industry Insights and Growth Prospects Report

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New Study on 3D IC and 2.5D IC Packaging Market Analysis Report by Key Players, Type and Regions to 2025

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New Study on 3D IC and 2.5D IC Packaging Market Analysis Report by Key Players, Type and Regions to 2025

25 views • 2 slides