'Dq forecast bare' presentation slideshows

Flip Chip and Wafer Level Packaging Technology at Hong Kong University of Science and Technology ????????????????????

Flip Chip and Wafer Level Packaging Technology at Hong Kong University of Science and Technology ????????????????????. Why Flip Chip?. Better manufacturing yield than wirebond for high pin-count chips. ??????????????????? Faster manufacturing through-put than wirebond for high pin-count chips.

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