'Power ground' presentation slideshows

EE573 VLSI ?????

EE573 VLSI ?????. 2004 ?? ? ?? ? ??. ?? ??. ?? ; ??? ?? ( ??? ?? , know-what ? ??? ?? ??? , ???? ???? ??? ? ?? ) SoC ???? ??? ? . ?? ; LG MM-> ????? 201 ? (?) ?? ; ??? , ???

1.11k views • 77 slides

EE573 VLSI ?????

EE573 VLSI ?????. 2004 ?? ? ?? ? ??. ?? ??. ?? ; ??? ?? ( ??? ?? , know-what ? ??? ?? ??? , ???? ???? ??? ? ?? ) SoC ???? ??? ? . ?? ; LG MM-> ????? 201 ? (?) ?? ; ??? , ???

1.13k views • 77 slides

The Design-Manufacturing Roadmap Andrew B. Kahng UC San Diego CSE & ECE Departments vlsicad.ucsd

The Design-Manufacturing Roadmap Andrew B. Kahng UC San Diego CSE & ECE Departments http://vlsicad.ucsd.edu. Outline. The Design Roadmap DFM: Symptoms, Problem, Solution DFM Futures: Some Examples. Big Picture. Message: Cost of Design threatens continuation of the semiconductor roadmap

909 views • 58 slides

Future Prospect of IC Technology (ITRS)

Future Prospect of IC Technology (ITRS). 2002. 9.9. Contents. Introduction ITRS Overall Roadmap Product Generation Lithography Package Power Cost Design Technology Challenges Introduction Complexity, Methodology Design Technology Challenges. 1992 NTRS. 2001 ITRS. 2000 update.

832 views • 56 slides

Power Integrity and Ground Bounce Simulation of High Speed PCBs

Power Integrity and Ground Bounce Simulation of High Speed PCBs. Agenda. Power Integrity Design Flow for xDSM Board for Fiber Optic/Broadband Wireless Network - Resonance on Power/Ground planes cavity - Concept of Target Impedance

814 views • 52 slides

EECS 373

753 views • 51 slides

EECS 373

582 views • 46 slides

Data Quality and Grounding Considerations in a Mixed-Use Facility

Data Quality and Grounding Considerations in a Mixed-Use Facility. Marcus O Durham, PhD, PE THEWAY Corp / U Tulsa Tulsa, OK. Robert A Durham, PE D 2 Tech Solutions, Inc. Tulsa, OK. Abstract. Facilities: depend heavily on networks Problems: signal quality & noise

428 views • 32 slides

Probe card preparation

Probe card preparation. Y. Kwon (Yonsei Univ.) for EQENG, Notice, & Yonsei . Contents. PIN layout & pad definition from CERN Probe pin layout plan Schematics for probe card circuit Transparent chuck under consideration. PAD layout. Total 103 pads to make contact. PAD size.

281 views • 15 slides

Digital Real-Time Networked Kegerator

Digital Real-Time Networked Kegerator. Schematic Rabbit Module Solenoids and Flowmeters Optical Encoder Power Serial Devices Temperature Sensors and Compressor Control Future Expansion PCB Layout Schematic and PCB Design Considerations. PCB Layout. 130 mm by 235 mm. PCB Layout.

121 views • 11 slides