'Wafer level packaging wlp' presentation slideshows

Wafer Level Packaging: recommendations for industrialization

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Wafer Level Packaging Market to Reach $7.8 Billion, Globally, by 2022

A new report published by Allied Market Research, titled, Wafer Level Packaging Market, Opportunities and Forecast, 20142022, the global wafer level packaging market is expected to garner $7.8 billion by 2022, growing at a CAGR of 21.5% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global market and contributed over half of the market share owing to improved electronics industry infrastructure and increasing demand of electronic products such as smartphones, handheld devices, PCs and laptops among others. Wafer level packaging is growing with a notable rate owing to its competitive advantages over other conventional packaging technologies namely wire bonding and flip chip such as compact package footprints, increased functionality, improved thermal performance, and finer pitch interconnection to the printed circuit board. Wafer level packaging (WLP) can be categorized on the basis of integration type and packaging technology used in them.

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