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The Conventional BGA Rework Problems to Avoid

BGA rework technique

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The Conventional BGA Rework Problems to Avoid

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  1. The Conventional BGA Rework Problems to Avoid

  2. Ball Grid Array is referred to as BGA. BGA is becoming more popular in the PCB industry due to its high-density capabilities. The BGA rework also addresses the popularity of BGA. By connecting the ICs packages on the underside, the BGA technique reduces the density and makes the IC connection complete. The PCB layout becomes simpler as a result. Despite the simplified outcome, the design process necessitates a high level of technical expertise.PCB parts must be removed or replaced in response to unusual circumstances. These might need to be removed, reinstalled, and then soldered again. In this case, Surface Mount Devices packages require BGA rework technique for service rework. Benefits Of BGA Rework: Based on the prior statement, you would believe that BGA rework is only employed when it is necessary to replace faulty components. BGA rework, however, has further uses. They are listed below. Replacement of Faulty Components: The primary use of BGA rework is the replacement of faulty components. Receiving defective parts on PCBs is a typical occurrence in electronics. Therefore, you must use the BGA rework service. Upgrades: Upgrades are still another important factor. Sometimes, a necessary upgrade may be required.

  3. AssemblyError: Unwanted defects could develop during PCB assembly. For instance, you can assemble the components incorrectly or sustain harm. In this instance, reassembling calls for BGA rework. The Conventional BGA ReworkProblemsto Avoid: Due to the extreme attention and advanced expertise required for BGA rework, the following faults occasionally occur. These should be avoided as they are concerned for BGA to rework. Technician TrainingImpairments: The rework station’s operator must have the necessary training. He should be easily controlled with plenty of practical experience using the BGA rework station. Without sufficient practical understanding, the technician could cause the PCBs to be destroyed during the entire BGA rework process. The technician must understand how to measure the process of de-soldering, component replacement, and re-soldering. Many operators might lack the necessary training. For the correct rework process, this should be avoided. InadequatePlanning:

  4. No matter what kind of rework a specific SMD PCB requires, it can be done. Before starting the rework process, there are several things to prepare. The technician must undergo extensive training. You cannot finish the entire rework process without careful planning, as we have already discussed the steps of the BGA rework procedure. The component’s flaws would not all be identical. Before beginning the rework process, the technician should do an extensive investigation into the specific issue with the SMD component. You need to ensure you have the appropriate measurement of solder balls because the ball grid array is a little complicated. The operator can immediately choose the rework after conducting an adequate study. However, many operators would forego conducting such in-depth research, which could cause another flaw in the rework process. Incorrect equipmentchoice: The choice of equipment is also another critical element in BGA rework. The need for the rework may not be met by improper or ineffective equipment. In addition to being dependable and able to complete the task only once, the equipment must also be able to resist repeated use. The machinery needs to be able to deliver the right heat and regulate them. Your chosen equipment must provide control over the entire rework process.

  5. By selecting the appropriate tools, you can prevent some mistakes from occurring throughout the rework process. Picking the incorrect materials, such as using the wrong solder paste, could result in loss and damageto the solder joint. WeakBGA profile: It would help if you created an appropriate thermal profile for each component you plan to replace with the defective PCB.BGA rework necessitates repetition; without a good thermal shape, the parts will be susceptible to damage.

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