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Memory Modules Overview Spring, 2004 Bill Gervasi Senior Technologist, Netlist Chairman, JEDEC Small Modules & DRAM

Memory Modules Overview Spring, 2004 Bill Gervasi Senior Technologist, Netlist Chairman, JEDEC Small Modules & DRAM Packaging Committees. Many Applications, Many Configurations. DDR1 Unbuffered DIMM Registered DIMM SO-DIMM Micro-DIMM New: 32b-DIMM In development: 4 Rank RDIMM. DDR2

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Memory Modules Overview Spring, 2004 Bill Gervasi Senior Technologist, Netlist Chairman, JEDEC Small Modules & DRAM

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  1. Memory Modules OverviewSpring, 2004Bill GervasiSenior Technologist, NetlistChairman, JEDEC Small Modules& DRAM Packaging Committees

  2. Many Applications, Many Configurations

  3. DDR1 Unbuffered DIMM Registered DIMM SO-DIMM Micro-DIMM New: 32b-DIMM In development: 4 Rank RDIMM DDR2 Unbuffered DIMM Registered DIMM SO-DIMM Micro-DIMM In development: Mini-RDIMM 4 Rank RDIMM 4 Rank SO-DIMM 4 Rank Micro-DIMM Fully Buffered DIMM DDR3 modules Module Configurations All JEDEC modules include Serial Presence Detect (SPD) EEPROM for boot time detection of capabilities

  4. DDR2 Speed Grading Committee approved standard speed grades: Data Rate Clock Speed Chip Bin Module Bin 400 MT/s 200 MHz DDR2-400 PC2-3200 533 MT/s 266 MHz DDR2-533 PC2-4200 667 MT/s 333 MHz DDR2-667 PC2-5300 800 MT/s 400 MHz DDR2-800 PC2-6400 X64/x72 bit data bus * chip speed

  5. DDR2 Unbuffered DIMM • Same physical size as DDR1: 133 mm (5.25”) • New socket • More pins… 184  240 pins • Tighter pin pitch… 1.27  1.0 mm • “Same plane referencing” pinout • Target markets unchanged • Workstations • Desktop PC • Status: APPROVED • 1 Rank x8, 2 Ranks x8, 1 Rank x16

  6. DDR2 Registered DIMM • Target markets unchanged • Servers • High-end Workstations • New feature: Address Parity • Checks integrity of everyaddress and commandsent • Status: APPROVED • 1 Rank x8, 2 Rank x8, 1 Rank x4, 2 Rank x4 • With or without address parity

  7. DDR2 SO-DIMM • Same width, shorter than DDR1: 67.6 x 30 mm • Same 200 pin socket as DDR1 • Uses 1.8V key position • No longer supports x72 (ECC) or registered • Target markets change from DDR1 to DDR2: • DDR1: Mobile, blade server • DDR2: Does not support blade server • Status: APPROVED • 2 Rank x16, 1 Rank x8, 1 Rank x16, 2 Rank x8

  8. DDR2 Micro-DIMM • Larger module, same footprint as DDR1: 52 x 30 mm • New connector • High pin count mezzanine connector • Two part: half on motherboard, half on module • 0.4 mm pitch • Status: APPROVED • 1 Rank x16, 2 Rank x16

  9. DDR1 32b-DIMM • New to DDR1… noDDR2 version yet • X32 only, 90.18 mm wide • Ultra low cost • New connector • 100 pins, 1.27 mm pin pitch • Target market: peripherals, e.g. printers • Status: APPROVED • 1 Rank x16, 2 Rank x8, 1 Rank x8, 2 Rank x16

  10. What is On the Horizon? • DDR2 Mini-RDIMM • 4 Rank DDR1 RDIMM • 4 Rank DDR2 RDIMM, SO-DIMM, & Micro-DIMM • Fully Buffered DIMM • DDR3 modules

  11. DDR2 Mini-RDIMM • New to DDR2… no DDR1 equivalent • Supports x72 (ECC) and registered • Larger than SO-DIMM: 82 mm • New socket required • 244 pins, 0.6 mm pin pitch • Target market: blade server

  12. 4 Rank DDR1 RDIMM • Doubles per-slot memory capacity to 4GB! • Takes advantage of existing chip selects • Requires additional signals routed on motherboard • PC-3200 with a single slot MemoryController MemoryController CS0# CS0# CS1# CS1# CS2# CS2# CS3# CS3#

  13. 4 Rank DDR2 RDIMM • Similar to DDR1 4 Rank • Supports address parity • Requires additional signals routed on motherboard • PC2-4200 with a single slot… headroom to PC2-5300? PC2-6400? MemoryController MemoryController Ad. Parity Ad. Parity CS0# CS0# CS1# CS1# CS2# CS2# CS3# CS3#

  14. 4 Rank DDR2 SO-DIMM, Micro-DIMM • Highest capacity modules with 4 ranks of x8 • 1GB using 256Mb (32 DRAMs) • 2GB using 512Mb • 4GB using 1Gb • Lowest power modules with 4 ranks of x16 • 512MB using 256Mb (16 DRAMs) • 1GB using 512Mb • 2GB using 1Gb • Estimated 20-25% reduction in power over x8 • Higher performance • Twice as many open pages possible • Cost protection during density crossovers(like 512Mb1Gb)

  15. Fully Buffered DIMM DIMM DIMM DIMM DIMM Processor Problem - Stub Bus • Each single sided DDR2-800 DIMM capable of 6.4 GB/s • Four DIMMs capable of over 25 GB/s • Bus Topology can not deliver the bandwidth to the application • Stub bus only able to deliver the bandwidth of one DIMM • Need headroom to support DDR3

  16. FB-DIMM High Speed Channel

  17. DDR3 Modules • Active development has begun • Performance to 1.6Gbps per pin • Point to point, point to 2 points • Fly-by buses with controller de-skew DRAM DRAM Data, Strobes Address, Command, Clocks Controller

  18. Keeping Them Straight New label: 1GB 2Rx8 PC2-5300U-44411-A1 1GB = Total module capacity 2Rx8 = Number of ranks of memory & chip width PC2-5300 = Speed grade in MB/s across DIMM U = Module type (unbuffered, registered, etc.) 444 = CAS latency–tRCD–tRP performance grade 11 = SPD revision (encoding + additions) A1 = Standard board layout and revision

  19. 2004 Modules Summary • DDR1 development continues • PC-3200 speed bumps, 32b DIMM, 4 Rank RDIMM • DDR2 modules ready to roll out • UDIMM, RDIMM, SO-DIMM, Micro-DIMM • DDR2 Speed Grades finalized • PC2-3200, PC2-4200, PC2-5300, PC2-6400 • New DDR2 modules in development • Mini-RDIMM, 4 rank R-/SO-/Micro-DIMM, FB-DIMM • DDR3 modules development begun • New DIMM labels assist user identification

  20. Thank You___Q & A

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