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Figure 3.1 Digital logic technologies .

Figure 3.1 Digital logic technologies. Figure 3.2 Digital logic technology tradeoffs. Figure 3.3 Using a PLA to implement a Sum of Products equation. Figure 3.4 Examples of FPLDs and advanced high pin count package types. Figure 3.5 MAX 7000 macrocell.

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Figure 3.1 Digital logic technologies .

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