Project Assignment

1. Project Assignment • Chris Allen (callen@eecs.ku.edu) • Course website URL people.eecs.ku.edu/~callen/713/EECS713.htm

2. Project purpose and scope • Purpose • Demonstrate a working knowledge of high-speed digital design • Individual work • This work is to be performed by each individual student • Issues to be addressed may include • circuit schematic definition, detailed timing analysis, component placement, transmission line design and routing, thermal management, board stack design, crosstalk, EMI reduction, timing skew, clock generation and distribution, device characterization, the effect of packaging on electrical performance, decoupling and bypass capacitor selection and placement, differing termination options, cables and connectors, and return signal current • Deliverables may include • Circuit schematic, timing diagrams, simulations, layout artwork, test procedures, project write-up

3. Project purpose and scope • Topic approval • Project selection, scope, and deliverables must be approved by the instructor prior to the initiation of the work • Presentation schedule and evaluation • During the last few scheduled days for this class, each student shall deliver a 10-minute (max) presentation to the class on the project objectives, its treatment (design, analysis, findings, etc.) and conclusions. • Completed project deliverables should be electronically submitted no later than 5 pm Saturday Dec 14. • Project scores will be based on the presentation quality and content (20%), project complexity (30%), and the quality and completeness of the report (50%). • Presentation quality and content will be assessed by the instructor.

4. Project report • Report includes: • Cover page (1 pg)includes title, author’s name, abstract • Report body (10 pgs max)introduction clearly outlines project’s scope and relevance to high-speed digital • description of research process, findings, and analysisconclusions • References (2 pgs max)cite references properly to avoid plagiarism • Appendices (if needed)data, graphs, program code, minimal text • Format: All margins 1”, 11-pt Arial font, line spacing of 1.5 • Due on 14 Dec 2019 at 5 pm • Electronic submission, pdf format • Evaluation based on technical content, writing, format, etc

5. Project topic suggestions (1 of 2) • Project selection is the responsibility of the student and projects must be approved by the instructor. Suggested projects are listed below. Projects can be completely paper design or it may have both a paper design and a hardware component (this will be one factor in determining the complexity). • Work / research related project involving the design of a high-speed digital circuit. (Student’s responsibility to not disclose proprietary info) • Challenging, general-purpose high-speed digital designs such as: • high-speed data acquisition system (A/D, memory with memory controller) • high-speed arbitrary waveform generator (D/A, memory with memory controller) • direct digital waveform synthesis (DDS, D/A with control logic) • Design two classroom demonstrations which demonstrate concepts and/or principles related to high-speed digital design. You may use the examples given in the text as guide, however do not simply duplicate these for this project. Any custom test fixtures must also be designed and detailed as part of this project.

6. Project topic suggestions (2 of 2) • Design one laboratory exercise for students enrolled in a future laboratory that would accompany this class. The lab exercise should state its objective, the student’s pre-lab preparation, the equipment required, the steps to be followed, the questions to be answered, data analysis and write-up. Any custom test fixtures must also be designed and detailed as part of this project. • Literature review of a high-speed digital circuit related topic that was not thoroughly covered in class.Find two or three published research papers that report on a central topic and provide an overview, background, interpretation, and conclusion.Suggested sources are listed on the following slide. • Hardware-oriented projects must demonstrate the concept, i.e., laboratory measurements must be made using instruments available in the EECS teaching laboratories.

7. Literature resources for project (1 of 2) • IEEE Transactions on Advanced Packagingfocus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability • Electrical Design of Advanced Packaging and Systems Symposium, EDAPS2008, 2009 • International Symposium on Advanced Packaging Materials1997 – 2007 • IEE Colloquium on Advances in Interconnection Technology1991 • International Symposium for Design and Technology of Electronics Packages (SIITME)2009 • IEE Colloquium on Diamond in Electronics and Optics1993

8. Literature resources for project (2 of 2) • IEEE Multi-Chip Module Conference1992-1997 • International Conference on Multichip Modules and High Density Packaging1998 • International Conference on Thermal Issues in Emerging Technologies: Theory and Application, THETA, 2007-2008 • International Conference on Wafer Scale Integration1989-1995 • IEEE Transactions on Components and Packaging Technologies1999-2010 • IEEE Topical Meeting on Electrical Performance of Electronic Packaging1992-2009

9. Sample topics of previous projects (1 of 5) • Advanced High Density Interconnect materials and techniques • Designing a custom DDS board • Lab exercise on mismatched impedance in transmission lines • ADC - FPGA (FIR filtering) – DAC • Hardware Trojan (HT) detection in 3-D IC • Coupling and cross-talk simulation analysis • Signal integrity of high speed digital PCB designs • Ball grid arrays • D-flip flop (IC) design and characterization • Clock jitter effects on DDS waveforms • Ultra high speed digital circuits • Radiation hardening • Arbitrary waveform generator design • 3 GSa/s acquisition system • Reflection suppression methods

10. Sample topics of previous projects (2 of 5) • PCB design for test • Study of crosstalk mitigation techniques • Investigation of termination schemes • Neurons modeled as digital circuits • Optical interconnects • Coplanar waveguide transmission lines • Investigate how trace curves & corners affect propagation delay • Comparing active and home-built probes • Parity generator & checker • Defected ground structures (DGS) for harmonic suppresson • Flip chip technology -- advantages/disadvantages • Graphene transistors • Asynchronous logic lit review • Knee frequency research • Demonstrate the method of meas reactance in HS ckts

11. Sample topics of previous projects (3 of 5) • A high speed analog to LVDS serializer • Bob Smith termination technique • Capacitor selection • FPGAs and clock skew • 3-D integrated circuits: silicon vias and substrate coupling • Standalone USB3.0 hub • Literature review of superconducting logic • A study of cooling technologies for electronic devices • Electromagnetic interference (EMI) of system-on-package (SOP) • High-speed design in power over ethernet • GRAPHENE FEVER: A study of a pure carbon material and its impact on high speed design • Optimization of piezoelectric oscillating fan for electronics cooling • CVD diamond substrate: the semiconductor for the future • Transmission line caches

12. Sample topics of previous projects (4 of 5) • Designing to avoid crosstalk -- understanding circuit performance at the boundaries of our guidelines • Design of segmental transmission line for high speed digital signals • Pipelining: an application in direct digital synthesis • Key issues in system-in-package (SIP) design • Thermal issues and management in microprocessors • Gigabit ethernet controller design • Ribbon cables in high speed design • Fine-resolution clock synthesis board with TTL- and ECL-compatible outputs • Radiated emissions in high-speed digital design • Clock signal generation • Shielding effectiveness of enclosures with aperatures • Thermoelectric coolers and applications utilizing quasicrystals • Thermal management of IBM processors

13. Sample topics of previous projects (5 of 5) • EMI from PCB and Chassis • Thermal fatigue of solder joint in power devices using coupled electrical-thermal-mechanical analysis • The thermal management of PCB board - story of real world • Microstrip performance in non-ideal conditions • Data acquisition design • Diamond materials used in electronics • Hi-Z and FSS for HSD ground planes • Flip Chip BGA packages • EMI shielding techniques • HS networking issues for micro-controllers, FPGAs, Ethernet, etc. • Design, trouble-shooting, & optimization of HS USB diff pair PCB routing • HS architecture and its application to processor design • PCB design with HDMI, ethernet, diff signals • High speed video encoder circuit design

14. Preliminary presentation schedule • Thursday December 5 • Ailon • Dutta • Gannon • Henry • Tuesday December 10 • Kaundinya • Mahmud • Turner • Woodruff