Microelectronics Activities at CERN

1. MicroelectronicsActivities at CERN CERN, PH department, ESE group 1211 Geneva 23, Switzerland

2. Overview • Organization chart • Microelectronics at CERN and in HEP • Current Technologies • Typical design projects • Current projects • Future projects

3. CMS in 2007

4. Organization CERN FI HR PH AB AT …….. departments groups TH ESE DT1 DT2 …… ~80-100 people sections FE ME BE ~25 people

5. Physics at the LHC accelerator • 7+7 TeV protons • 5.6 MJ stored in beam • Beam size at IP: 17 mm • DC current: 9 mA • Particles per bunch: 1.6*1011 • N bunches: 2800

6. CMS Tracker read-out in detail • ~ 120,000 FE chips with 128 channels each • Total Power budget: 3 mW/channel • ~40,000 analog optical links • Synchronous 40 MHz clock distribution to all channels with 1 ns skew adjustment • External digitization, after zero suppression data flow needs ~500 digital links @ 4 Gb/sec • Control system includes ~20,000 special purpose ASICs organized in token-ring like architecture • All ASICs designed with 0.25 mm CMOS

7. Front-end design examples • APV25:128 channels, • low noise • 8 bit dyn range • 192 deep analog memory • serial analog read-out • ~120,000 chips in CMS Tracker • 0.25 mm CMOS, 1P, 3M • “Special” design rules APV25-S1

8. Front end design examples: Calo preshower • PACE 32 channels • low noise • 12 bit dynamic range • 192 deep analog memory • serial analog read-out

9. ASIC for LHC timing distribution • TTCrx: 40 MHz opto-receiver for high precision clock distribution • 1 to 30,000 optical fan-out • 100 ps resolution • low jitter • DMILL technology • rad-hard • 0.8 mm BiCMOS • ~ 5x5 mm2

10. High Speed Serializer • Gigabit Optical Link (GOL) • 0.8 and 1.60 Gb/s optical link • Unidirectional • < 300 mW • G-Link and Gigabit Ethernet protocol • Redundant logic

11. Medipix • Photon counting readout chip used for medical, biological and physics applications. • The chip is consists in an active matrix of 256x256 photon counting pixels. • > 10 million transistors, 8K cells 50x400mm

12. Medipix2 on a 300mm Si sensor

13. Design examples: HPTDC • Time-to-Digital Converter • 0.25 mm CMOS • Semi-Custom • PLL @ 320 MHz • 4 Memory blocks • DLL and Hit registers • 32 channels, 25 and 100 ps resolution • 3.3 V I/O, 2.5V core • 5.5x5.5 mm2 • Used also in industry outside HEP

14. 12 Bit 40 Ms/s Converter • 4 channels, 12 bit 40 MS/s Analog to Digital Converter • < 500 mW • several modes of operation • 4xADC @ 12 bit • 1xADC @ 14 bit • Rad-tolerant • 4x4 mm2

15. Fondry Service • Organization of MPW for High Energy Physics community • European and US Institutes, ~20 Design Groups • 15 MPW and 25 production runs in 5 years • Handling of contracts for large orders • Some commercial applications: • TDC • Instrumentation commercial vendor • automobile industry etc. • Medipixel • medical instrumentation

16. Some typical volumes

17. New projects • R&D activities for LHC upgrades (sLHC) • Power distribution in the detectors • DC-DC step-down converter • Optical link for trigger, timing and data transmission at 5Gbit/s • Chipset for the communication channel: TIA, LD, Ser-Des (CDR, encoder/decoder, serializer, …) • Technology and IP blocks • Foundry support in chosen qualified technology • Development of IP blocks (pads, DACs, ADCs, OpAmps, fuses, dedicated rad-hard layouts, …)