1 / 17

Subsystem Integration of Bioaerosol Sampling and Collection Electronics

Subsystem Integration of Bioaerosol Sampling and Collection Electronics. Ivan Caceres, University of Texas at Austin Thomas Kiehne, Ph.D., Jeffrey Michalski Space and Geophysics Laboratory, Applied Research Laboratories. System Overview.

wyanet
Download Presentation

Subsystem Integration of Bioaerosol Sampling and Collection Electronics

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Subsystem Integration of Bioaerosol Sampling and Collection Electronics Ivan Caceres, University of Texas at Austin Thomas Kiehne, Ph.D., Jeffrey Michalski Space and Geophysics Laboratory, Applied Research Laboratories

  2. System Overview • CSVI samples and concentrates desired particles by filtering air • AHTS transfers particles to concentrated liquid suspension • Biological detectors typically require103-104 particles for detection

  3. Circumferential-Slot Virtual Impactor (CSVI) • Increases concentration of desired course particles by filtering fine particles • Low pressure drop increases power efficiency • Exhaust air flows must be equal for particles to filter through virtual impactor properly

  4. CSVI Concept

  5. CSVI Block Diagram

  6. Aerosol to Hydrosol Transfer Stage (AHTS) • Injects desired particles into liquid by accelerating and colliding them upon a thin liquid film • Works at high efficiencies with a particle cutoff of 0.8-10µm • Operating temperature range of -40˚C to120˚C

  7. The AHTS Concept

  8. AHTS Block Diagram

  9. Common Circuit Architecture

  10. Integration Goals • Common electronics in subsystems designed for general purpose applications • Standardize stack-through form factor for printed circuit boards used in subsystems • Upgrade Basic stamp controller to Freescale HCS12 microcontroller • Operate on battery, DC or AC power • Add device networking interface

  11. Integration Circuit Boards

  12. Power Management Board

  13. MC9S12 Processor Board • 8 channel 10-bit ADC • 6 channel 8-bit PWM • 8 channel timer • SPI/SCI serial interface • 52 I/O pins • 2k bytes of RAM • 32k bytes flash • 24MHz bus speed

  14. Network Communications Board Lantronix XPort Technological Arts Adapt9S12NE x86 DSTni-EX Digi Connect ME NET+ARM NetSilicon NS7520 Freescale MC9S12NE

  15. Serial Communications Integration Board • Universal Asynchronous Receiver/Transmitter • Board will be used to connect to serial communication devices for data logging or control

  16. Motor/Blower Controller Integration Board

  17. Pressure Sensor Integration Board

More Related