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Stud Pull Adhesion

Stud Pull Adhesion. Jeff Fournier Ovonyx Technologies Inc. RH Process Team June 2008. Stud Pull. Stud Pull with Quad Group Romulus Mechanical Tester Studs attached to film stack with epoxy Film stacks generally not patterned Quantitative adhesion numbers

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Stud Pull Adhesion

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  1. Stud Pull Adhesion Jeff Fournier Ovonyx Technologies Inc. RH Process Team June 2008

  2. Stud Pull • Stud Pull with Quad Group Romulus Mechanical Tester • Studs attached to film stack with epoxy • Film stacks generally not patterned • Quantitative adhesion numbers • As deposited stacks and post anneal

  3. Quad Group Romulus

  4. Stud Pull • Wafers are diced into approximately 20 1 cm2 pieces • Manufacturer supplied epoxy coated studs are applied to pieces and cured at 150C for ~1hour • Samples then mounted in tool and pulled until failure  oxide epoxy fails at pressures ~11K psi • Oxide calibration taken before and after stack test • Some failure analysis can be done with optical microscope, profilometer, x-section SEM

  5. Stud Baking Fixture • 1 cm2 piece is mounted on baking fixture with epoxy stud • Epoxy is cured in oven at 150C for 60 min.

  6. Sample with stud attached and cured

  7. Sample is mounted in tool fixture for stud pull

  8. Example of Stud Pull Data

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