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Global 3D IC Market 2014- 2018

To Get details: http://www.bigmarketresearch.com/global-3d-ic-2014-2018-market "Global 3D IC Market Size, Trend, Analysis, Report, Research, Technology, Opportunity and Forecast 2014-2018" A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment. The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems.

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Global 3D IC Market 2014- 2018

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  1. Global 3D IC Market Size, Trend, Analysis, Report, Research, Technology, Opportunity and Forecast 2014-2018

  2. Report Description About 3D IC A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment. The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems. To Get details: http://www.bigmarketresearch.com/global-3d-ic-2014-2018-market TechNavio's analysts forecast the Global 3D IC market to grow at a CAGR of 18.4 percent over the period 2013-2018.

  3. Report Description Covered in this Report This report covers the present scenario and the growth prospects of the Global 3D IC market for the period 2014-2018. The report includes the overall revenue generated from the sales of 3D ICs. The 3D ICs that are discussed in this report are developed by using through-silicon via (TSV) interconnect technology. The report also presents the vendor landscape and a corresponding detailed analysis of the top four vendors in the Global 3D IC market. In addition, the report discusses the major drivers that influence the growth of the Global 3D IC market. It also outlines the challenges faced by the vendors and the market at large, as well as the key trends that are emerging in the market. Key Regions• Americas• APAC• EMEA

  4. Report Description Key Vendors• Advanced Semiconductor Engineering• Samsung Electronics• STMicroelectronics • Taiwan Semiconductor Manufacturing Other Prominent Vendors• 3M Company • IBM • Micron Technology• STATS ChipPAC• United Microelectronics• Xilinx Market Driver• Huge Demand for Memory-enhanced Applications• For a full, detailed list, view our report

  5. Report Description Market Challenge• Thermal Conductivity Issues • For a full, detailed list, view our reportMarket Trend• Multi-chip Packaging • For a full, detailed list, view our report Key Questions Answered in this Report• What will the market size be in 2018 and what will the growth rate be?• What are the key market trends?• What is driving this market?• What are the challenges to market growth?• Who are the key vendors in this market space?• What are the market opportunities and threats faced by the key vendors?• What are the strengths and weaknesses of the key vendors? For More Details: http://www.bigmarketresearch.com/global-3d-ic-2014-2018-market

  6. Table Of Content 01. Executive Summary02. List of Abbreviations03. Scope of the Report03.1 Market Overview03.2 Product Offerings04. Market Research Methodology04.1 Market Research Process 04.2 Research Methodology05. Introduction06. Market Landscape06.1 Industry Overview06.2 Technology Landscape06.2.1 Monolithic06.2.2 Wafer-on-wafer06.2.3 Die-on-Wafer06.2.4 Die-on-die06.3 Market Size and Forecast 06.4 Five Forces Analysis

  7. Table Of Content 07. Market Segmentation by Product07.1 Global 3D IC Market by Product 2013-201808. Market Segmentation by End-users08.1 Global 3D IC Market by End-users 201309. Geographical Segmentation09.1 Global 3D IC Market by Geographical Segmentation 2013-201809.2 Global 3D IC Market by Geographical Segmentation 2013-201809.3 3D IC Market in the APAC Region09.3.1 Market Size and Forecast09.4 3D IC in the Americas09.4.1 Market Size and Forecast09.5 3D IC Market in the EMEA Region09.5.1 Market Size and Forecast10. Key Leading Countries10.1 US10.2 China10.3 South Korea11. Buying Criteria

  8. Table Of Content 11.1.1 Consumer Electronics Sector11.1.2 ICT Sector11.1.3 Military, Aerospace, and Defense Sector11.1.4 Automotive Sector11.1.5 Others12. Market Growth Drivers13. Drivers and their Impact14. Market Challenges15. Impact of Drivers and Challenges16. Market Trends 17. Trends and their Impact18. Vendor Landscape18.1 Discussion about Key Vendors18.1.1 Taiwan Semiconductor Manufacturing Co. Ltd.18.1.2 Advanced Semiconductor Engineering18.1.3 Samsung Electronics18.1.4 STMicroelectronics18.2 Other Prominent Vendors

  9. Table Of Content 18.2.1 Micron Technology18.2.2 Xilinx18.2.3 3M Company18.2.4 STATS ChipPAC18.2.5 United Microelectronics18.2.6 IBM19. Key Vendor Analysis19.1 Advanced Semiconductor Engineering19.1.1 Key Facts19.1.2 Business Overview19.1.3 Business Segmentation by Revenue 201319.1.4 Business Segmentation by Revenue 2012 and 201319.1.5 Geographical Segmentation by Revenue 201319.1.6 Business Strategy19.1.7 Recent Developments19.1.8 SWOT Analysis19.2 Samsung19.2.1 Key Facts

  10. Table Of Content 19.2.2 Business Overview19.2.3 Business Segmentation by Revenue 201319.2.4 Business Segmentation by Revenue 2012 and 201319.2.5 Geographical Segmentation by Revenue 201319.2.6 Business Strategy19.2.7 Recent Developments19.2.8 SWOT Analysis19.3 STMicroelectronics19.3.1 Key Facts19.3.2 Business Overview19.3.3 Product Segmentation by Revenue 201319.3.4 Product Segmentation by Revenue 2012 and 201319.3.5 Geographical Segmentation by Revenue 2013 19.3.6 Business Strategy19.3.7 Recent Developments19.3.8 SWOT Analysis19.4 Taiwan Semiconductor Manufacturing Company19.4.1 Key Facts

  11. Table Of Content 19.4.2 Business Overview19.4.3 Business Segmentation by Revenue 201319.4.4 Geographical Segmentation by Revenue 201319.4.5 SWOT Analysis20. Market Summary21. Other Reports in this Series To Get Complete TOC Mail @ sales@bigmarketresearch.com For Purchase Enquiry:http://www.bigmarketresearch.com/report-enquiry/132603

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