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3. Provides better mechanical strength at connector sites and in PTH holes.
4. It contains great materials to work even in high temperature without causing circuit failure.
5. It can reduce the product’s size by incorporating multiple copper weights on the same layer of circuitry.
6. The heavy copper plated device carries higher current through the board and helps to transfer heat to an external heatsink.
7. On-board heatsinks are directly plated onto the board surface using up to 120-oz copper planes.
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