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ABF 介紹 _ 前言

ABF 介紹 _ 前言. ABF 介紹 _ 構造. Preparation of innerlayer . circuit board. Preparation of role film. Temp: Cold -> R.T. Predrying of boards. (Remove water absorption). o. 130 . C. x30min. Opening role. Lamination (temporal). (place films onto patterns). Using auto-cut laminator for DFR.

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ABF 介紹 _ 前言

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  1. ABF介紹_前言

  2. ABF介紹_構造

  3. Preparation of innerlayer circuit board Preparation of role film Temp: Cold -> R.T. Predrying of boards (Remove water absorption) o 130 C x30min. Opening role Lamination (temporal) (place films onto patterns) Using auto-cut laminator for DFR Using vacuum applicator Vacuum Lamination (Nichigo-Morton 、 MEIKI) o Mechanical d rilling or laser Via formation 100-110 C , 30s Vacuum, 30s Press, +(0.5-0.7) MPa Hot press o to flatten surface 100-110 C , 60s Press, 2-6kgf/cm2 Desmear Treatment with permanganate Removing of PET film Remove when cooled down to room temperature after lamination Electroless copper plating Copper plating Electo copper plating Hot air oven SH , G ; 170degCx30min GX：(90-120degCx30min)+(150-170degCx30min) SH-9K：170degCx30min C ure Subtractive method Pattern formation Semi-additive method RCC;120degCx30min+170degCx30min Repeat for multilayered types Annealing Hot air oven (Post-cure) For RCC, Two step cure is necessary for resin curing without voids or wrinkles. o 170 C x 30-60min. Coating solder mask ABF介紹_製程

  4. ABF介紹_數據 Curing condition; 170degCx90min : SH-9K, GX, GX-10, GX-11, 180degCx90min : GX-35, GX-13, GX-TH3

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