Molded Interconnect Devices (MID) Market Size worth USD 629.5 Million by 2023: Global Market Insights, Inc.

1. Molded Interconnect Devices (MID) 2016 – 2023

2. Global Market Scenario of Molded Interconnect Devices (MID) • Moldedinterconnect devices (MID) market size was valued at over USD 225 million in 2015, with 13.8% CAGR growth forecast from 2016 to 2023. Higher function density and design flexibility is anticipated to propel industry demand. • Moldedinterconnect devices enable integration of mechanical and electronic components and circuits directly on 3D (three-dimensional) plastic components. • This helps in integrating chips elegantly with their assemblies, and also allows the antennae in smartphones or notebooks to be installed directly within the housing. This in turn facilitates in saving a great amount of space and miniaturization. • These products offer high level of design freedom and also exhibit less assembly steps when compared to conventional printed circuit boards (PCB). • https://www.gminsights.com/industry-analysis/molded-interconnect-devices-MID-market

3. Continue..... • Furthermore, integration of functions and sensors aids in reducing assembly times as well as number of production steps. This is expected to optimize the supplementary costs and also facilitate in manufacturing high quality components. • Technique such as direct bare chip assembly on substrates is anticipated to further fuel industry demand over the forecast period.  • Selective metallization offered by these products is expected to drive MID market size over the next seven years. • High reliability as a result of low failure ratio can be attributed to low degree of complexity of the systems due to existence of very less number of auxiliary components. They also have superior environmental benefits as it uses thermoplastic materials with minimal additives. • https://www.gminsights.com/industry-analysis/molded-interconnect-devices-MID-market

4. China molded interconnect device market size, by application, 2012-2023 (USD Million) https://www.gminsights.com/industry-analysis/molded-interconnect-devices-MID-market

5. 360° Analysis • Application Analysis • Telecommunication application accounted for more than 60% of the global revenue in 2015, and is poised to grow at 13.6% CAGR from 2016 to 2023. The growth can be primarily attributed to increasing usage in antennas. Automotive is forecast to witness the fastest growth in the coming years at 14.8% CAGR, owing to increasing product adoption in brake-light fixtures. • Regional Analysis • Asia Pacific molded interconnect devices market size was valued at over USD 175 million in 2015. Growth across the region can be mainly credited to availability of low priced components in China. • Europe MID market share is expected to exhibit potential growth owing presence of large number of automotive industries across the region. • Competitive Market Share • Key industry participants accumulating major molded interconnect device market share include Molex, TE Connectivity and Harting Technology Group. Other notable players are MacDermid Incorporated, LPKF Laser & Electronics, SelectConnect Technologies, and RTP Company.

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