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<br>The global substrate-like PCB market is estimated to witness a CAGR of 27.94% to reach US$6,622.320 million in 2024 from US$1,509.983 million in 2018. Printed circuit boards (PCB) are to support mechanically and electrically connect the electronic components in order to be used in electronic products.
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Substrate-Like PCB Market Forecasts From 2019 To 2024
DESCRIPTION Global susbtrate-like PCB (SLP) market is estimated to witness a CAGR of 27.94% to reach US$6,622.320 million in 2024 from US$1,509.983 million in 2018. Substrate like PCB is high-end PCB that has a higher interconnect density per unit area as compared to the traditional HDI PCB. The demand for substrate like PCB is growing on account of its ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product. Moreover, the rising trend of miniaturization of electronic devices coupled with the rising demand for electronic products like smartphones, tablets across the globe along with the growing electronics industry are some other key factors propelling the demand for PCBs which is expected to drive the substrate like PCB market over the coming years.
Key Questions Answered By The Report • What will Substrate-Like PCB Marketfrom 2019 to 2024? • How are the major drivers and restraints affecting the Substrate-Like PCB Market. • growth and the opportunities which exist for key vendors? • Which segment and region will drive or lead the market growth and why? • A comprehensive analysis of competitive landscape and key market participant’s behavior • Key strategies being adopted by vendors, with in-depth analysis along with their impact on competition and market growth
Geography • North America • USA • Canada • Mexico • South America • Brazil • Argentina • Others
Geography • Europe • Germany • France • United Kingdom • Spain • Others • Middle East and Africa • Saudi Arabia • Israel • Others
Geography • Asia Pacific • China • Japan • South Korea • India • Others
Segments Covered Under Global Storage Market: • By Line/Space • 25/25µm and 30/30µm • Less Than 25/25 µm • By Technology • Laser Direct Imaging • Automated Optical Inspection • Automated Optical Shaping • By Industry Vertical • Consumer Electronics • Communication and technology • Automotive • Military, Defense & Aerospace • Healthcare • Industrial
COMPANY PROFILES • AT&S • Zhen Ding Technology • TTM Technologies, Inc. • Samsung Electro-Mechanics • Unimicron Corporation • Korea Circuit • Ibiden Ltd. • Daeduck Gds Co Ltd. • Kinsus Interconnect Technology Corporation • Compeq Co. Ltd.
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