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MENU PRO ELECTRONIC'S BLOG First choice for the Quick Updates PCB ASSEMBLY Which PCB Substrate Material Is Right for Your PCB Assembly? Posted on 14 Sep 2018 In the world of electronics, the printed circuit board is the essential part and the abbreviation alternately also account for printed wiring cards as well as boards. For electrical necessities of a given piece of equipment PCB Assembly material selection should be undertaken with care and knowledge due to the crucial role of these boards in everything right from computers to Privacy & Cookies: This site uses cookies. By continuing to use this website, you agree to their use. To ?nd out more, including how to control cookies, see here: Cookie Policy Close and accept calculators.
Earlier the materials of circuit board mostly covered by nests of entangled, overlapping wires could easily fail at certain junctures. This medium experienced before the development of the PCB Assembly. Due to entangled and overlapping cables, resulting in the short circuit wire crack or outdated wires. Moreover, the manual process taken place into the wiring of these early boards was confusing and painstaking. Follow The race was on to develop more straightforward, more compact alternatives with riding variety of standard electronic components that began to rely on circuit boards. As a result, it led to the development of the PCB assembly material, through which circuits can route between a host of different components. Solder which also serves a dual purpose with its adhesive qualities is a metal that facilitates the transfer of current between the board and any attached components. To improve the performance of your printed circuit boards, you will ?rst have to optimize the performance of the substrate material, as the fundamental attributes of PCBs (Printed Circuit Boards) depend on this material. To meet the requirement compatible with new technologies and market trend, numerous new types of materials are so far being developed and coming into applications. The printed circuit board market has witnessed a transformation in recent years with its focus from traditional hardware products like desktop PCs to wireless communications such as mobile terminal and server. Mobile communication devices represented by smartphones drive the progress of PCBs towards high density, lightness and multiple functions. Printed circuit technology is not possible to achieve without substrate material whose technological requirement closely related with the performance of PCB. Thus, substrate material selection plays a crucial role in contributing to the quality and reliability of PCBs, their end products. Catering to High Density and Fine Lines With the application of a thin copper foil substrate, the traditional method of circuit pattern formation lies in the process of imaging and etching, resulting in which the lowest value of L and S reaches 30μm. Many PCB manufacturers end to use etching minus copper foil method instead with copper foil thickness set to be 18μm, as the features of thin copper foil CCL is quite expensive and also stacks with many defects.
As the method contains too many procedures with thickness dif?cultly controlled and also leads to higher cost, is not much recommended. As a result, a thin copper foil is better. Moreover, when the value of L and S of the board is less than 20μm standard copper foil does not work. Lastly, the ultra-thin copper foil is advised due to its copper thickness regulated within the range from 3μm to 5μm. Further, in lamination dielectric material lies the critical points of SAP, to meet the requirement of high-density ?ne circuits. Whereas, few elements of lamination material have to be brought about including dielectric performance, insulation, anti-heat capacity, and bonding, coupled with technological adaptation compatible with HDI PCB. How to determine substrate materials for your PCBs Assembly? In modern electronic time, miniature and thinness of electronic devices lead to the necessary advent of rigid PCBs and ?ex. If this is the case then what type of substrate material is suitable for them? Regarding performance, growing application ?eld of rigid PCBs and ?ex bring about the new requirement. For instance, Polyimide ?lm can be classi?ed into multiple categories including transparent, white, black and yellow with high heat resistance. Also, to be applied in different situations low coef?cient of thermal expansion can be included. Likewise, PCB market will accept mylar substrate with high-cost effectiveness as well owing to its advantages that consist of high elasticity, size stability, ?lm surface quality, photoelectric coupling, and environmental resistance to meet the changeable requirement of users. PCC PCC an end to end Electronic Manufacturing Services (EMS) provider company offers customer-centric, tailor-made EMS services that seamlessly integrate with their supply chain requirements. We specialize in rapid PCB assembly & system manufacturing services providing PCB Assembly Services for low and medium volume, high mix products, to diverse customer markets globally. Right from multi-layered to ?exible PCBs, we have expertise in each aspect of Printed Circuit Board Assembly and manufacturing services. We support simple, small boards to multiple HDI boards in volume or prototypes.
Advertisements Report this ad Report this ad Share this: Twitter Facebook Google Like Be the first to like this. Related Factors Determining the Layer Distribution and Number of Layers in PCB Board Assembly In "PCB Assembly" Cable Wire Harness Assembly Used in a Wide Range of Industries How Reverse Engineering Helps PCB Designers to Keep Up with Increasing Complexity? In "PCB Assembly" Author: Prachi Shah Robert Josh is the head marketing at Printed Circuits Corp. (PCC Services), serving the industry for many years as a leading PCB assembly services and EMS provider Company. He is well-versed about PCC design and manufacturing of Printed Circuit Boards. VIEW ALL POSTS TAGGED: Electronic Manufacturing Services, PCB, PCB Assembly, Printed circuit board
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