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Company Presentation

Company Presentation. Orient Semiconductor Electronics, Ltd. Business Overview. Established in 1971 and listed on the Taiwan Stock Exchange in 1994 Positions as an electronics manufacturing service provider

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Company Presentation

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  1. Company Presentation Orient Semiconductor Electronics, Ltd.

  2. Business Overview • Established in 1971 and listed on the Taiwan Stock Exchange in 1994 • Positions as an electronics manufacturing service provider • Provides a wide range of IC packaging and testing as well as contract manufacturing services • Offers customer-focused production and logistics solutions to achieve time-to-market and time-to-volume

  3. IC Packaging & Testing Services Semiconductor Group – Products & Services IC Package Design Process Development Material Management Wafer Probing Wafer Grinding IC Packaging Services PDIP/PLCC/SO/SSOP/TSOP/ TSSOP/QFP/LQFP/TQFP/MLP PBGA/EBGA/TEBGA/LFBGA FTFBGA/MCM/FC IC Test Program Development IC Testing Services Logic/Memory RF/Mixed Signal Distribution Support

  4. Electronics Manufacturing Services Finished Products Group – Products & Services Circuit Layout DFM/DFT Review Prototype IC Packaging Design Part Selection Material Procurement Material Management PCB Assembly Back-plane Assembly Final Systems Build In-Circuit Test Functional Test Reliability Test Distribution Support Repair & Upgrade

  5. Global Manufacturing Facilities *OSE USA formerly called IPAC

  6. Orient Semiconductor Electronics, Ltd. Semiconductor Group OSE Taiwan OSE Philippines OSE USA Semiconductor Group site strategy • Sales & marketing • Packaging technology development for quick build requirement • Quick turn and Low volume service • Marketing contact from qual lot at OSEU and mass production at OSET/OSEP • Packaging technology research & development center • Focus on high pin count ; value added packaging and mass production • Transfer low pin count packaging to OSEP • Focus on high volume; low pin count and low cost packaging

  7. Global Sales & Support Offices

  8. Statistics on Human Resources (Worldwide) 5617/1783//7400/4353/1114

  9. Percentage of Sales By Region Remark : Data shown based on FY 2000 both IC & FP

  10. Percentage of Sales By Market Segment

  11. 1995 – 2000 Sales Revenue Remark : Data shown OSET IC packaging & Finished product sales revenue; OSEP & OSEU not included.

  12. Research & Development Capabilities • Custom package & module design • Substrate layout design for SCM, MCM, LFBGA, and FCBGA • Material and process development • Thermal and electrical analysis • Mechanical simulation • Mold flow simulation • Quick mold chase and T/F tooling for prototype • Package technology development

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