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Power Distribution and Cooling Solutions for AMBFTK Board

This report discusses the power distribution challenges and thermal dissipation issues faced in the AMBFTK design. It explores options for power conversion and distribution, placement of DC-DC converters, and different strategies for bringing power to the AMBFTK board. The report also considers the cooling requirements for each board and suggests possible solutions.

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Power Distribution and Cooling Solutions for AMBFTK Board

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  1. AMBFTK Report 01.06.2010

  2. AMBFTK: problems to solve • Power distribution: Crates – compatibility with CDF crates? • Thermal dissipation: Cooling • Signals I/O: high input/output traffic and frequency (connectors) Marco Piendibene

  3. Power (1) • For the actual AMchip is estimated (but we need a better measure) a power consumption of 1,8W (1 A @ 1,8V) • For the new AMchip (under design) a similar power is estimated • In the first version of the AMBFTK we are going to use the actual AMchip • Actual AMchip: 1 A @ 1,8 V • LAMB (Local Associative Memory Board) • 32 AMchip • AMBFTK: 4 LAMBS • => 128 AMchip => 128 A @ 1,8 V ! • new AMchip: 230 A @ 1V !!! Marco Piendibene

  4. Power (2) First version of AMBFTK (with actual AMchips): • 128 A @ 1,8V only for the AMchips ! • We think that the real consumption is less (100 A ?) • We are going to make some measure soon Marco Piendibene

  5. Power (3) • Problem: how we can obtain the current we need? • Up to now, we found that the better solution ( in terms of efficiency and physical space on the AMBFTK board for the DC-DC converter) is to obtain the current we need starting from 12 V • 24 A @ 12 V is the power that we have estimated we need for the entire AMBFTK board (AMchips plus other logic) Marco Piendibene

  6. Power (4) • Example of the DC-DC converter to obtatin 1,8V (AMchip core voltage) starting from 12V DC-DC converter 12V  1,8V • Delivers up to 30A of output current • High efficiency: 92.9% @ 3.3V full load (V IN=12Vdc) • Input voltage range from 6 to 14Vdc • Output voltage programmable from 0.8 to 3.63Vdc • - Small size and low profile: 33.0 mm x 13.46 mm x 10.00 mm (1.30 in. x 0.53 in. x 0.39 in.) • We need 4 of this DC-DC coverter to obtain the current we need for the AMchip (100 A or more) Marco Piendibene

  7. Power (5) • It is not simple to find the right placement on the board for these DC-DC converters • 2 options: • Using a custom AMBFTK layout (is it possible? problems?) • Using a standard AMBFTK layout maybe with compact connector to make space. But we are not sure we have the space we need for all the components. Marco Piendibene

  8. = DC-DC converter = other components Front panel Front panel Backplane side Backplane side Option 1 Option 2 P1 P1 lamb lamb lamb lamb P1 P1 lamb lamb lamb lamb P3 P3 Enough space for DC-DC converter Very difficult to find space for DC-DC converter Is it possible? Problems? Marco Piendibene

  9. Option 1: custom layout – IS IT POSSIBLE? Front side Backplane side Dc-dc 1,8V Dc-dc 1,8 V 1 3 other dc-dc (1,2V) 4 2 Lamb power connector Lamb signal connector Little “balcony” Marco Piendibene Fifos (spartan6) serdes

  10. Option 1: example of current distribution on a board plane 12V 12V dc-dc dc-dc 1,8V 1,8V 1,8V 1,8V dc-dc dc-dc Lamb power connector 12V Little “balcony”

  11. Option 2: standard layout Front side Backplane side Dc-dc 1,8V 1 Do we have space for this configuration? 2 other dc-dc (1,2V) 3 Lamb power connector Dc-dc 1,8V 4 Lamb signal connector “short” P3 Marco Piendibene Fifos (spartan6) serdes

  12. Option 2: example of current distribution on a board plane Too high current? Actual AMchip: 128 A (100 A) New AMchip: 230 A ? dc-dc 1,8V dc-dc 1,8V 1,8V 1,8V 1,8V dc-dc dc-dc 1,8V dc-dc Too far from the source? 12V Marco Piendibene

  13. Power (6) • Problem: how to bring 24 A @ 12 V to each AMboard? • We don’t want to use the J0 connector because we need that space (see slide 9 and 11). • OPTIONS: • 1 - Bring power direct to the AMBFTK (see slide 14) • 2 - Bring power through the AuxBoard (see slide 15) • 3 - Bring power through backplane (standard J1 – J2 connector) (see slide 16) Marco Piendibene

  14. Option 1 - Bring power direct to the AMBFTK Front panel AMBFTK AUX card P1 P2 P3 12V cable Power connector Mechanical problems? Unfriendly to plug/unplug ? Marco Piendibene

  15. Option 2 - Bring power through the AuxBoard Front panel AMBFTK AUX card P1 Power connector 12V cable P2 No problem to plug/unplug the cable P3 This option is possible because we have a lot of pin available on P2 connector (see P2 connector on slide 19) Marco Piendibene

  16. Option 3 - Bring power through the CDF backplane Questions… Could we use all the power lines available in CDF in J1 and J2 (see next slides)? Can everything be generated, including 3,3 V, starting from 12 Volts , to reduce the Ampere we need to transfer? Do we need a mix of these strategies (cable + J1 – J2)? Could be enough to bring 25 A to each AMboard and AUX board without needing cables? Looking at the next slide, we see that just 3.3 V + V1,V2, +12V, -12V can deliver 350 Amps (for all the slots) Could be enough (and is it possible?) to power all the slots in this way? Can we understand which is the probability we get 5 crates from CDF for start of FTK run in 2013? Marco Piendibene

  17. Marco Piendibene

  18. Marco Piendibene

  19. P2 pin assignment in CDF crates Marco Piendibene

  20. Thermal dissipation: cooling Each board will need to be cooled to bring away 300 W. The 300 W are distributed on 128 chips so the exchange air-chip surface should be enough, even if the air is not cooled. We want to start with AMboards that do not occupy all the slots. We can do this at the beginning (2013). Tall connectors between the motherboard and the LAMBS will increase the distance between them. We will study in the future the possibility to put the AMboards in all the slots. We can use metals touching the chips as shown in the figure on the right to increase the exchange of heat between air and chips. We will need thin packages for the AMchips. Now they are not thin (3 mm) but we can use 1 mm thick packages. WE HAVE TO STUDY THE PROBLEM CAREFULLY

  21. I/O: P3 + LVDS • 2 Options: • Thinner but taller. Good if we can put 2 DC – DC connectors in front of the board. • 5 columns connectors, 50 rows – • 2x25 rows connectors. • Larger but shorter. • if we are not allowed to use DC-DC conv. In front of the board we gain space with this connector. • 25 rows + 11 rows.

  22. Type E - 25 rows + Type F - 1 1 rows 2mm Hard Metric - 8 columns PCB Mount Connectors (Z-PACK 2mm HM) FOR THIS OPTION THE LVDS SER/DESER NEED A SMALLER PACKAGE! Option 2 SN65LVDS93A 8.1mm × 14mm TSSOP 1.2 thick Road-Lamb3-1 (21b+7b) Road-Lamb2-2 (21b+7b) Road-Lamb2-1 (21b+7b) 3ctrl x 4 = 12 3ctrl x 4 + 8 Hold-Hits=20 Road-Lamb1-1 (21b+7b) Road-Lamb0-2 (21b+7b) Road-Lamb0-1 (21b+7b) 34-36 rows Pix1(14b) + Pix2(14b) Pix0(14b) + Pix0d(14b) 2ctrl x 8 + 1b x 4 buses (2 Pix+2ExtSCT) + 8 Hold roads SCT2 (14b) - SCT3 (14b) SCT0 (14b) - SCT1 (14b) XC6SLX16 CPG196 8x8 mm2 1,2 thick

  23. AMBFTK Lamb Space between pcb lamb and pcb motherboard P1 2,2cm 0,8 cm 3,5cm 3,9cm 2,2cm 5,5cm (no amchip) P2 Lamb 3,3cm (with actual long P3) P3

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