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Alloy Thin Films By: Nelson Voldeng Advisor: Dr. King

Alloy Thin Films By: Nelson Voldeng Advisor: Dr. King. Thin Film Applications. •Semiconductor processing for integrated electronic components and sensors •Super conductor materials for tomorrow’s new technologies •Anti-reflective (AR) optical films for better light transmission and clarity

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Alloy Thin Films By: Nelson Voldeng Advisor: Dr. King

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  1. Alloy Thin FilmsBy: Nelson VoldengAdvisor: Dr. King

  2. Thin Film Applications • •Semiconductor processing for integrated electronic components and sensors • •Super conductor materials for tomorrow’s new technologies • •Anti-reflective (AR) optical films for better light transmission and clarity • •Clear conductive films used in touch-screen and plasma flat panel display technologies • •Hard film wear-ability coatings for tool steel and internal combustion engine components • •Reflective coatings for media storage like CD’s, DVD’s, and tape • •Conductive coatings for miniature medical probes and sensors • •Flexible and bendable lenses for X-ray wave length telescopes for space exploration • •Thin film coatings on Mylar, poly-carbine, and other substances for protective and/or decorative applications • Etc…

  3. Overview of Research -Goals -Sputtered films/sectioned films -Taking data (largest hurdle) -Results -Future research

  4. Goals • Research electronic applications (as well as others) for alloy thin films. • Have alloy film with columnar single crystals from top the film to bottom.

  5. Phase Diagram Cu-Ag

  6. Sputtering Mechanism and Film

  7. Physics

  8. Physics Continued. • Em=0.4E*(M1+M2)/(M1+M2)^2 • E=Kinetic energy of incoming particle. • M1=Mass of incoming particle. • M2=Mass of target particle. • If Em>bond energy there’s a chance you can remove a target particle.

  9. Hurdles with taking data • ZIESS and Profilometer microscope failed. AFM failed at first due to 150µm maximum scanning parameter. Succeeded by measuring cracks and scratches on films

  10. Measuring the films at first • Not easy, time consuming, and poor data.

  11. More bad data

  12. Good results

  13. Gap picture

  14. Results Overview • Height graphs for Ag and Cu • Approximate Deposition rates for Ag and Cu • Composition charts for CuAg film

  15. Height graphs Ag

  16. Deposition rates for Ag

  17. Unusable height graph for Cu -Diamond scribe unreliable for scratching films. -Cuts into substrate and shatters film.

  18. Most Recent Breakthrough! -Previously we thought Profilometry gave unusable results. -However, the once deemed useless profilometer is much quicker at measuring films. 1hr40mins per film (profilometer) vs. 5hrs per film (AFM)

  19. Sputtering rates

  20. Concentration and Mole Wt Graphs for AgCu Alloy

  21. For Future research • Film measurement  Profilometer • Film sputtering  scotch tape method, or lithography • Composition control  Use targets with unequal element areas. Use target that is an alloy • Need more accurate results  More data points for film thickness.

  22. Thanks • Dr. King and the Materials Department. • Grad. Students and Kei.

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