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6 Special Methods. 6.1 Microwave Techniques 6.2 Dielectric Measurements 6.3 Thermoelectric Measurements. 6.1 Microwave Techniques. Frequency [Hz]. 4. 6. 8. 10. 12. 14. 16. 18. 20. 22. 24. 10. 10. 10. 10. 10. 10. 10. 10. 10. 10. 10. Wavelength [m]. 4. 2. 0. -2.
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6 Special Methods 6.1 Microwave Techniques 6.2 Dielectric Measurements 6.3 Thermoelectric Measurements
Frequency [Hz] 4 6 8 10 12 14 16 18 20 22 24 10 10 10 10 10 10 10 10 10 10 10 Wavelength [m] 4 2 0 -2 -4 -6 -8 -10 -12 -14 -16 10 10 10 10 10 10 10 10 10 10 10 typical lattice constant Energy [eV] -10 -8 -6 -4 -2 0 2 4 6 8 10 10 10 10 10 10 10 10 10 10 10 10 g rays cosmic rays visible microwave light IR light UV light X-rays radio frequency Electromagnetic Spectrum
Plane waves: Electromagnetic Waves in dielectrics: in conductors:
y Reflection/Transmission between Dielectrics I dielectric II dielectric incident x reflected transmitted strong penetration perceivable reflection
y Reflection from Conductors I dielectric II conductor incident x transmitted “diffuse” wave reflected negligible penetration almost perfect reflection with phase reversal
circulator detector detector detector oscillator isolator detector horn antenna specimen oscillator isolator horn antenna specimen reflection (monostatic radar, pulse-echo) Far-Field Measurement Configurations transmission (bistatic radar, pitch-catch) scattering (bistatic radar, pitch-catch) oscillator isolator horn antenna specimen
circulator oscillator isolator detector open-ended waveguide specimen stand-off distance coating foam core adhesive substrate corrosion damage skin laminate air backing Near-Field Inspection
[mm] 60 40 20 0 0 20 40 60 [mm] Microwave Image of Rust Under Paint (Qaddoumi et al., 1997) 40 mm 40 mm area of rust on a steel plate 24 GHz, 12.5 mm standoff distance, 0.267 mm of paint
circulator oscillator isolator detector modulator open-ended waveguide specimen stand-off distance infrared camera lock-in amplifier glass fiber-reinforced polymer plates (50 75 mm2) (Diener, 1995) Lock-in Thermography microwave raster scan lock-in thermography (phase image) bonding defects 150-µm-thick delamination
E electric field H magnetic field D electric flux density B magnetic flux density J electric current density σ electric conductivity ε electric permittivity µ magnetic permeability complex electric permittivity ω angular frequency t time Maxwell's Equations: Fundamentals Harmonic solution:
+Q +Q -Q -Q E E Fe Fe Electric Polarization dipole formation dipole rotation P electric polarization pe electric dipole moment V volume χeelectric susceptibility ε0 permittivity of free space
I Q A E l Capacitance conducting dielectric lossy dielectric ideal dielectric
ionic + dipolar atomic resonance electronic resonance ε’ Electric Permittivity [a. u.] ε’’ 103 106 109 1012 1015 1018 frequency [Hz] + + + _ _ _ _ Complex Electric Permittivity
basic sensor Rg buffer Rg Im Im 1 Vm Vm Vg Vm parallel plate electrodes Capacitive Probes sensor with guard electrodes Vg stray field electrodes
Auto-Balancing Bridge device under test H L Rref Rg Im Im “virtual” ground _ + Vg high-gain operational amplifier vector voltmeter vector voltmeter
uncoated uncoated 10 40 coated coated . 30 1 . Capacitance [pF] Conductance [μS] 0.1 20 0.01 10 0.001 0 0.1 1 10 100 0.1 1 10 100 Frequency [kHz] Frequency [kHz] conductive cloth for electric shielding Woven Composite
50 103 2.5 2.5 102 2.0 2.0 40 1.5 30 101 1.5 Water Uptake [%] Thickness Variation [%] 20 100 1.0 1.0 0.5 10-1 0.5 10 0.0 10-2 0 0.0 0 10 20 30 40 50 60 70 80 0 0.5 1.0 1.5 2.0 2.5 Time1/2 [hr1/2] Water Uptake [%] 5,350 hr 5,350 hr 1,590 hr 1,590 hr 1,007 hr 1,007 hr 580 hr 580 hr 122 hr 122 hr Relative Permittivity Dielectric Loss intact intact 10-1 10-1 100 100 101 101 102 102 103 103 104 104 105 105 106 106 107 107 108 108 109 109 Frequency [Hz] Frequency [Hz] Pethrick et al., 2002 Adhesively Bonded Composite
A JA I T2 T1 JB B hB open-circuit Seebeck effect: JA = 0 A hA VS T2 T1 JB = 0 B T0 T0 hB _ V + Seebeck, Peltier, and Thomson effect: coupled electric and thermal flux Thermoelectric Effect J electric current density h thermal flux density σ electric conductivity (T = 0) κ thermal conductivity (V = 0) V voltage T temperature S thermoelectric power closed-circuit Seebeck effect: hA
30 W (tungsten) 20 Mo (molybdenum) 10 Ag (silver) 0 Cu (copper) Thermoelectric Power [µV/K] -10 Au (gold) -20 Pt (platinum) -30 Pd (palladium) -40 0 500 1000 1500 Temperature [K] Absolute Thermoelectric Power
_ + V reference electrodes (B) electrical heating ~ ~ “cold” junction “hot” junction specimen (A) open-circuit Seebeck effect Contact Thermoelectric Tester Primary Effect: chemical composition Secondary Effects: anisotropy, texture fatigue, cold work, plasticity, residual stress, etc.
273 K 293 K 83 K 4.2 K 20 0 Thermoelectric Power [µV/K] -20 50 Electric Resistivity [µΩ cm] 40 -40 30 -60 20 Ag Content [%] 10 Ag Content [%] 0 0 0 20 20 40 40 60 60 80 80 100 100 palladium-silver binary alloy (Rudnitskii, 1956) TEP versus Chemical Composition
hexagonal single crystal Zinc, relative to basal plane (Rowe and Schroeder, 1970) 3 perpendicular 2 1 Thermoelectric Power [µV/K] 0 parallel -1 -2 -3 0 50 100 150 200 250 300 Temperature [K] TEP Anisotropy
-4.8 20 before annealing gold tip reference copper tip reference -4.9 15 Thermoelectric Power [µV/°C] 10 Difference in TEP [%] -5.0 5 after annealing -5.1 0 0 30 60 90 120 150 180 80 60 40 80 60 40 Azimuthal Angle [deg] Cold-rolling reduction [%] before annealing after annealing 50 µm cold-worked polycrystalline material Ti-6Al-4V, relative to cold work direction (Carreon and Medina, 2006) TEP versus Texture
magnetometer specimen heat thermoelectric current closed-circuit Seebeck effect Noncontacting Thermoelectric Tester • relative to surrounding intact material • no artificial interface • penetrating (with substantial depth) • noncontact (with substantial lift-off)
milled pressed plastic zone before annealing after annealing TEP is independent of size and shape Material Effects versus Geometry C11000 copper diameter 0.375” T 0.5 C/cm 2 mm lift-off distance 3” 3” scanning dimension 18 nT peak magnetic flux
25 before relaxation relaxation at 235 ºC relaxation at 275 ºC 20 relaxation at 315 °C 2nd relaxation at 315 °C 3rd relaxation at 460 °C 15 recrystallization at 600 °C Magnetic Signature [nT] 10 5 0 0 2A 4A 6A 8A 10A 12A 14A 16A Almen Peening Intensity shot-peened C11000 copper Residual Stress Characterization