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Smart Products re Design

Smart Products re Design. Mark Cutkosky for Ed Carryer. A 40-year history of design project courses at Stanford. Product Design Program (w/ Fine Arts Dept.). Robotics. Team-based design with industrial projects. Smart Product Design Course. SIMA MSE program. MEMS and Mechatronics. RPL.

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Smart Products re Design

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  1. Smart Products reDesign Mark CutkoskyforEd Carryer 4-6-2004 AIM IAC

  2. A 40-year history of design project coursesat Stanford Product Design Program (w/ Fine Arts Dept.) Robotics Team-based design with industrial projects Smart Product Design Course SIMA MSE program MEMS and Mechatronics RPL Bio 1960 1970 1980 1990 2000 4-6-2004 AIM IAC

  3. Smart Product Design then and now Intel 8086 PIC16F88 with “nanowatt” tech. 4-6-2004 AIM IAC

  4. A brief history of Smart Product Design at Stanford 1978: Smart Product Design launched by Larry Leifer 1980: Expanded to 2-quarter sequence with extendedprojects 1987: Major revision to accommodate new microprocessorand software development technologies; extended to 3 quarters 1994: 218d added (corporate-sponsored projects for218abc alumni) 1994: 1-quarter “mezzanine” version created 2001: EE/CS version created and taught for first time 2004: Ground-up redesign (from “smart products” toubiquitous intelligence?) -- thanks to AIM! 4-6-2004 AIM IAC

  5. Toward ubiquitous, wireless, low-cost and low-powered computing RiSE project (CMU/Michigan/Stanford) 3mm sq, Silicon Labs 4-6-2004 AIM IAC

  6. 218 Technology: What’s hot, What’s not. . .

  7. and what staysthe same. . . Creative, exciting trade-offs among ME/EE/CS solutions! 4-6-2004 AIM IAC

  8. ME218a ME218b ME218c ME218d The Evolution of the ME218 Series sync. Comm. circuits user I/O PCB Layout interrupts semiconductors async. comm. HC12 Timer Real Time OS (RTOS) op-amps Current A/D, D/A. DC motors digital logic design stepper Motors Industrial Project forth PIC 16F84. state machines comparators choosing a micro sensors event driven prog. signal conditioning Microcontroller inro. PCB manufacturing. modular prog. noise The Next Generation New Material ? RF communications New Processor New Processor New Processor StateCharts IR communications PID Control Low Power Design

  9. Status (Spring ‘04) Extensive meetings among 218 staff and “advisory board” (mostly alumni in industry). 218a extensively overhauled: new platform, content, schedule 218bc overhauls in process (218c distance taught from Berlin) 4-6-2004 AIM IAC

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