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Bump-bonding : Invitation to tender

Bump-bonding : Invitation to tender. Technical specification doc has been prepared : Ferdinand, myself , with the help of Alex, Petra and Massimiliano It has been checked by the Laszlo Abel and Dante Gregorio of Contracts and IT Supplies Section (FP-PI-CO)

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Bump-bonding : Invitation to tender

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  1. Bump-bonding: Invitationto tender • Technicalspecification doc hasbeenprepared: Ferdinand, myself, with the help of Alex, Petra and Massimiliano • Ithasbeencheckedby the Laszlo Abel and Dante Gregorio ofContracts and IT Supplies Section (FP-PI-CO) • Tender formhasbeenpreparedbyLaszlo Abel • Ithasbeen sent to IZM and VTT F. Marchetto INFN-Torino

  2. In the TechnicalSpecification are definedtwophases: Development or pre-series (sixmonths) withdummycomponentsreplacingbothsensors and chips Equal production seriessplit in two, eachlastingonethreemonths

  3. Toallow a plan B, in case the developmentfails: no success in the bump-bondingof the thinned-chips (to 100 mm), anOptionsectionhasbeenintroduced Contactpersons:

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