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Module Thermal Analysis. Chiho Wang Duke University. Module Thermal Analysis. Motivation: To study how electronics affect module temperature. Previous study - BNL calculations : T coolant ~ 0.5 - 1 ºC T module ~ 9 ºC. Duke Model. Duke calculation: ANSYS 5.5.1 3D model, half module
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Module Thermal Analysis Chiho Wang Duke University
Module Thermal Analysis • Motivation: • To study how electronics affect module temperature. • Previous study - BNL calculations : • Tcoolant ~ 0.5 - 1 ºC • Tmodule ~ 9 ºC
Duke Model • Duke calculation: • ANSYS 5.5.1 • 3D model, half module • Simulated elements: • shell • Kxyz=55 (W/mºC) • radiator + straw assembly • Kxy=0.05, Kz=0.122 • HV plate • Kxy=6.3, Kz=0.265 • tension plate • Kxy=6.3, Kz=0.265 • gas volume between tension plate and HV plate • Kxy=0.009, Kz=0.242
Duke Model • Simplified geometry • Cooling tubes simulated by temperature assignments along the edges of shell • Ignore curvatures at corners of module, etc..
Case 1 • Module without electronics • Tcoolant = 20ºC • No heat on tension plate • Tmodule ~ 9 ºC consistent with BNL results.
Case 2 • Module with electronics • Tcoolant = 15ºC (module first, then electronics) • Ttension plate = 30 ºC • Tmodule ~ 15 ºC
Case 3 • Module with electronics • Tcoolant = 20ºC (electronics first, then module) • Ttension plate = 30 ºC • Tmodule ~ 11 ºC
Case 4 - “on” side • Module with electronics, one side turned off • Tcoolant = 20ºC one tube, 15ºC other tube • Ttension plate = 30ºC • Tmodule ~ 15ºC
Case 4 - “off” side • Module with electronics, one side turned off • Tcoolant = 20ºC one tube, 15ºC other tube • Ttension plate = 15ºC • Tmodule ~ 12ºC
Summary • Tmodule ~ 9ºC without electronics • With coolant flowing through module first before going through electronics: • Tmodule ~ 15ºC with electronics • With coolant flowing through electronics before going into the module: • Tmodule ~ 11ºC with electronics • Tmodule ~ 15ºC with electronics but one side turned off.