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A new report published by Allied Market Research, titled, "Flip Chip Market - Global Opportunity Analysis and Industry Forecast, 2014 - 2022", the flip chip market is expected to garner $46 billion by 2022, growing at a CAGR of 9% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global flip chip market and contributed over half of the market share owing to thriving market for semiconductors and electronic devices.
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Flip Chip Market Opportunities and Forecasts, 2014 – 2022 Publish Date : Aug 2016 No of Pages: 204
Flip Chip Market - Introduction A new report published by Allied Market Research, titled, "Flip Chip Market - Global Opportunity Analysis and Industry Forecast, 2014 - 2022", the flip chip market is expected to garner $46 billion by 2022, growing at a CAGR of 9% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global flip chip market and contributed over half of the market share owing to thriving market for semiconductors and electronic devices. Flip chips majorly differ from each other on the basis of bumping technology used in them. Currently, copper bumping is extensively used in market owing to its advantages such as considerably low cost than other methods, high efficiency and compatibility with bond pads. Furthermore, impending need of circuit miniaturization, thriving portable devices industry and technological superiority over wire bond connections are major factors expected to propel the growth in global flip chip market. However, availability of less customization options as well as high capital investment requirements for setting up a new plant are the limitations that restrict the market growth. 2.5D IC packaging technology dominated the overall market in 2015 owing to its several advantages such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption. 3D IC is expected to register highest CAGR as it is equipped with all the advantages of 2.5D IC as well as some additional advantages. Read more details of the report at: https://www.alliedmarketresearch.com/flip-chip-market
Flip Chip Market - Key Benefits In 2015, copper pillar led the overall flip chip market revenue, and is projected to grow at a CAGR of 9.8% during the forecast period. Tin-lead eutectic solder is expected to witness low growth rate due to government initiatives to ban toxic substances that have impacted its market heavily. Electronics industry constituted significant share in the overall flip chip market in the year 2015 due to imminent need of size reduction in electronics devices, requirement of higher data transmission speed and improvement in efficiency. In packaging technology of flip chips, 2.5D IC packaging dominated the market in 2015. Asia-Pacific dominated the market in the year 2015 by accounting over 50% of the total market revenue.
Flip Chip Market - Table of Contents 1. INTRODUCTION 2. EXECUTIVE SUMMARY 3. MARKET OVERVIEW 4. FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY 5. FLIP CHIP MARKET, BY INDUSTRY 6. FLIP CHIP MARKET, BY BUMPING TECHNOLOGY 7. FLIP CHIP MARKET BY GEOGRAPHY 8. COMPANY PROFILES
Flip Chip Market - Overview 1. Market Definition and Scope 2. Key findings 3. Porters five force analysis 4. Value chain analysis 5. Market share analysis 6. Drivers 7. Restraints 8. Opportunities
Flip Chip Market - By Packaging Technology 3D IC 5D IC 2D IC Overview Flip Chip Market By Packaging Technology
Flip Chip Market - By Industry Industrial Aerospace & Defense Electronics Flip Chip Market By Industry Automotive & Transport IT & Telecommunication Healthcare
Flip Chip Market - By Bumping Technology Overview Flip Chip Market, By Bumping Technology Copper pillar Others Gold bumping Solder bumping
Flip Chip Market, By Geography North America, Europe, Asia Pacific, LAMEA
Company Profiles 1. International Business Machines Corporation (IBM) 2. 3M 3. Texas Instruments, Inc. 4. Taiwan Semiconductor Manufacturing Company Ltd. 5. Apple Inc. 6. Fujitsu 7. Intel Corporation 8. Advanced Micro Devices, Inc. 9. Amkor Technology, Inc. 10. Samsung Electronics Co. Ltd.
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