ECEN 4004/5004 Fall 2008 Fundamentals of Microsystems Packaging

1. ECEN 4004/5004Fall 2008Fundamentals of Microsystems Packaging Instructor: Melinda Piket-May mjp@colorado.edu Time: 5:30 – 8 PM Monday Location: ITLL1B50 Text: McGraw–Hill, Tummala, Fundamentals of Microsystems Packaging ISBN:0071371699 For a review of the book you can go here: http://www.ewh.ieee.org/soc/cpmt/newsletter/200203/book.html You can also view the table of contents on amazon Prerequisite: Graduate, Senior or BS/MS in EE, ECE, or ME Microsystem packaging is a $125 billion dollar worldwide industry, employing more than a million people. The amazing micro embedded systems being designed have to be packaged! This course includes packaging related to microelectronics, photonics, analog, digital, MEMS, and RF. We will deal with the packaging requirements of these technologies at a fundamental level – defining, illustrating the key concepts, and introducing the critical nomenclature of each topic. After general introductory material, specific higher level topics in the course will be selected based on class interest. The course will be taught in seminar style with the students as active participants in the class. Students will be evaluated using homework, quizzes, and presentations. Possible topics include: packaging in microsystems, electrical package design, design for reliability, thermal management, single chip packaging, multichip packaging, IC assembly, wafer level packaging, optoelectronics, RF packaging, MEMS, Printed Wiring Board, board assembly and packaging of passive devices, to name just a few. This is not a lab class. It is an interactive seminar class that familiarizes you with the concepts and vocabulary being used in micropackaging industry today.