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Contents. Capability-PCB Capability-FPC and RFPC Capability-Aluminum PCB Capability-PCBA. Number of Layer: 2-28 Layer Maximum processing area: 680 x 1000 mm Min board Thickness: 2 Layer 0.3mm(12mil) ； 4 Layer 0.4mm(16mil) ；

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  1. Contents • Capability-PCB • Capability-FPC and RFPC • Capability-Aluminum PCB • Capability-PCBA Wonderful PCB

  2. Number of Layer: 2-28Layer Maximum processing area: 680 x 1000 mm Min board Thickness: 2 Layer 0.3mm(12mil)； 4 Layer 0.4mm(16mil)； 6 Layer 0.8mm(32mil)； 8 Layer 1.0mm(40mil)； 10 Layer 1.1mm(44mil)； 12 Layer 1.3mm(52mil)； 14 Layer 1.5mm(59mil)； 16 Layer 1.6mm(63mil)； 18 Layer 1.8mm(71mil)； Finished board thickness tolerance: Thickness＜0.8mm，Tolerance:+/-0.08mm； 0.8mm≤Thickness≤6.5mm，Tolerance+/-10% Capability –PCB General Capability Wonderful PCB

  3. Capability -- PCB General Capability • Twisting and bending ：≤0.75%，Min0.5%。 • Range of TG：130-215℃ • Impedance tolerance+/-10%，Min+/-5%。 • Hi-Pot Test: Max4000V/10MA/60S • Surface treatment: HASL With Lead HASL Free Lead Flash Gold Immersion Gold Immersion Silver Immersion Tin Gold Finger Osp Wonderful PCB

  4. Capability -- PCB Pattern limit Wonderful PCB

  5. Capability -- PCB Holes processing Wonderful PCB

  6. Capability -- PCB Cu thickness +plating (1) • Cu thickness Out layer Cu thickness:1-6OZ Inner layer Cu thickness:0.5-4OZ Cu thickness of PTH: average>=20um,Min.>=18um • HASL with lead: Tin 63% Lead37% • HASL free lead: surface thickness>=0075um Thickness in the hole>=5um • Flash Gold Ni thickness:3-5um (120u"-160u") Gold thickness:0.025-0.075um （1u"-3u"） Wonderful PCB

  7. Capability -- PCB Cu thickness +plating (2) • Immersion Gold Ni thickness:3-5um (120u"-160u") Gold thickness:0.025-0.15um （1u"-6u"） • Immersion Tin Tin thickness:0.8-1.2um （32u"-48u"） • Immersion silver Ag thickness:0.15um-0.75um (6u"-30u") • Gold Finger Ni thickness:3-5um （120u"-160u"） Gold thickness:0.025-1.51um （1u"-60u"） Wonderful PCB

  8. Capability -- PCB Cover thickness (1) • Solder mask Color: green, matte green,yellow,blue,red,black,matte black Solder mask thickness: Surface line≥10um， surface line corner≥6um surface board 10-25um Solder mask bridge width: HOZ≥0.1mm IOZ≥0.12mm • Legend Color: White, yellow, black Min height of legend 0.70mm (28mil)； Min width of legend 0.15mm (6 mil) Wonderful PCB

  9. Capability -- PCB Cover thickness (2) • Blue Gel thickness:0.2-1.5mm tolerance+/-0.15mm • Carbon print: Thickness:5-25um Min space：0.25mm impedance:200Ω Wonderful PCB

  10. Capability -FPC • FPCLayers 1-8 layers • Board Thickness 0.05-0.5mm • Min.line width/space 0.04/0.04mm • in.Through Hole Size 0.2mm • PTH Hole Dia.Tolerance ∮≤0.1mm 0.05mm ∮≥0.1mm ±0.075mm • Solder Mask Registration Tolerance ±0.05mmMin.Routing Dimension Tolerance ±0.05mm • Hole to edge（Hard tool/Die Cut) ±0.1/±0.2mm • Eege to Edge（Hard tool/Die Cut) ±0.05/±0.2mm • Circuit to edge（Hard tool/Die Cut) ±0.07/±0.2mm Wonderful PCB

  11. Capability-Flex Rigid PCB • 4L1R+2F+1R • 6L2R+2F+2R • 1+HDI 6L1+1R+2F+1R+1 • 2+HDI 6L1+1F+2F+1F+1 • 2+HDI 8L • Thin 4L R-F（1+HDI ） Wonderful PCB

  12. Capability—FPC and RFPC Material-1 1. Base Material 1.1 FCCL ( Flexible Copper Clad laminate) Polyimide: Kapton (12.5 m/20 m/25 m/50 m/75 m High flex life, good thermal management, high moisture absorption and good tear resistant Polyester (25 m/50 m/75 m) Most cost effective, good flex life, low thermal resistivity, low moisture absorption and tear resistant 1.2 Dielectric Substrates：PI, PET. Wonderful PCB

  13. Capability—FPC and RFPC Material 2. Coverlay 2.1 Cover Layer from ½ mil to 5 mils (12.7 to 127µm) Polyimide: (12.5 m/15 m/25m/50m/75m/125m) High flex life, high thermal resistivity. 2.2 Flexible Solder Mask Most cost effective, lower flex life, better for registration ) 2.3 PIC—photo imaging covercoat Lower flex life, better for registration Wonderful PCB

  14. Capability—FPC and RFPC Material • 3. Adhesive Sheet • 4. Conductive Layer • 4.1 Rolled Annealed Copper (9 m/12 m/17.5 m/35 m/70 m) • High flex life, good forming characteristics. • 4.2 Electrodeposited Copper (17.5 m/35 m/70 m) • More cost effective • 4.3 Silver Ink • Most cost effective, poor electrical characteristics. Most often used as shielding or to make connections between copper layers • SF-PC5000 and SF-PC1000protection film Wonderful PCB

  15. Capability—FPC and RFPC Material 6.Additional Material & Stiffeners FR4——Epoxy Pressure Sensitive Adhesive (PSA) Steel, Aluminum stiffeners 7. No / Low Flow PP Applied in Lamination 106(2mil) 1080(3.0mil / 3.5mil) 2116(5.6mil) w/o micro-via Brand: TUC, Panasonic, Arlon, Hitachi, Doosan Wonderful PCB

  16. Capability –Aluminum PCB Wonderful PCB

  17. Capability- PCB Assembly 1.  PCBA, PCB assembly: SMT & PTH & BGA 1.1.SMD :160K points/hour. operation rate :70%( 8 working hours per day, 20 set equipments) 1.2.DIP: 75K points/hour. operation rate :80% ( 8 working hours per day, 250persons for DIP) 2.  PCBA and enclosure design 3.  Components sourcing and purchasing 4.  Quick prototyping 5.  Final assembly 6.  Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) 7.  Custom clearance for material importing and product exporting Wonderful PCB

  18. Capability –Profiling for all • cnc : tolerance+/-0.1mm line to cnc ≥0.20mm hole to cnc ≥0.30mm gold finger to cnc ≥0.20mm • Punching: Hole size diameter +/-0.10mm Punching diameter +/-0.15mm • v-cut: corner：30℃、45℃、60℃ corner tolerance：+/-5° v-cut deepness：0.6-1.6mm deepness tolerance：+/-0.10mm Wonderful PCB

  19. Capability –Test for all • Equipment: Universal Tester Flying Probe Open/Short Tester High power Microscope Solderability Testing Kit Peel Strength tester High Volt Open & Short tester Cross Section Molding Kit With Polisher Wonderful PCB

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