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CIS Testing Technology

CIS Testing Technology. 思衛科技 Jemmy Mobil Phone:0917866007 E-mail:jemmy_chen@jetek.com.tw. Basic Introduction CIS Function CIS Test Item CIS Test System Production Issue. Contents. -What is CIS -CIS Application -CIS Market. Basic Introduction. Digital camera. Digital camera. CCD.

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CIS Testing Technology

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  1. CIS Testing Technology 思衛科技 Jemmy Mobil Phone:0917866007 E-mail:jemmy_chen@jetek.com.tw

  2. Basic Introduction CIS Function CIS Test Item CIS Test System Production Issue Contents

  3. -What is CIS -CIS Application -CIS Market Basic Introduction

  4. Digital camera Digital camera CCD CIS CCD CCD What is CIS CIS(CMOS Image Sensor)

  5. Note PC PDA Mobile Phone Wristwatch Camera Digital Camera In-vehicle Camera CCD / CMOS Image Sensor Video Camera Security Camera Fingerprint/Pupil User Authentication Copy Machine Facsimile/Scanner CIS Application

  6. CIS Market

  7. CIS Market

  8. -System Block CIS Function

  9. System Block NTSC/PAL DSP Video Encoder CDS ADC AGC CMOS Image Sensor DVP (Digital Video Port) Interface Timing Generator Memory MIPI (Mobile Industry Processor Interface)

  10. Image Sensor Structure

  11. Passive Sensor: Advantage: Simple circuit(one transistor) Large sensor area Disadvantage: Loading is higher  Random noise is big Active Sensor: Advantage: Electron convert voltage directly in each pixel Reduce radon noise Disadvantage: Small sensor area Amplifier character is different in each pixel Fixed pattern noise

  12. Digital Control Logic • Timing generator • I2C Interface • Exposure control • Frame Rate control • Gain control • Image size control • Multi port output • --------

  13. CDS CDS(Correlated Double Sampling) +  _ Vout Vin Delay T

  14. About Multi Port Output : Clk limit solution for big area sensor

  15. 1 Hsync 1 Hsync EnCoder Monochrome: Sync Color: Chroma Burst

  16. DVP Waveform Diagram FEN: VSync LEN: HSync

  17. MIPI Waveform Diagram

  18. Output Image:

  19. Response Pixels • Output Signal(Internal ADC) :

  20. DC/Function Test ADC Test Image Test(Dark,Standard Light,Saturation,Color) Image Processor Library CIS Test Item

  21. Continuity Leakage Power Consumption DC Test CIS Test Item ADC Test • Offset • Gain • INL / DNL • THD • S / N Function Test • I2C Write/Read • DSP Pattern

  22. Dark Mean/Std. Dark Row/Column Variation Dark uniformity DSNU(Dark Signal non-uniformity) Dark Defect Pixel Dark Cluster Dark Current Dark Test

  23. Dark Current (Dark_level1-dark_level2)/(0.255-0.02) Dark_level1 : Exposure:255ms Dark_level2 : Exposure:20ms Response 20 255 Exposure Time(ms)

  24. Defect Pixel Test Adjacent Defect Pixel Test Defect Test Wound Pixel Dead Pixel

  25. Adjacent Defect(Cluster) Region Define

  26. Build Convolution Filter Build Bed Pixel Map Cluster Judge Method Cluster Test Algorithm

  27. Cluster Judge Method : CMOS Imager ΣXi Mean X 1/N N Frames Bad Pixel Map ConvolutionFilter Count Judge

  28. Build Bed Pixel Map : _

  29. Judge Method 1: For 3 * 3: * You can judge the relation of bed pixels by value Ex: 274

  30. Judge Method 2: For 3 * 3: * If the value >10 , There are 3 bad pixels in the 3*3 area (don’t care relation of bad pixels)

  31. Mean Level ( Light, R, G, B ) Std. ( Overall, R, G, B ) S/N ( Overall, R, G, B ) -FPN(Fixed Pattern Noise) -Random Noise Row/Column Variation (R, G, B ) Uniformity (R, G, B ) PRNU(Photon Response non-uniformity) Defect Pixel (Overall):Defect judge by R, G, B independently Cluster Ps1: G1, G2 maybe need to be separated Standard Light Test

  32. Saturation Mean Level (Overall, R, G, B ) Dynamic range (R, G, B) 20 * log( V_sat / V_noise) Saturation Test

  33. R (G, B)Mean Value in R(G, B) Light R (G, B)Std. in R(G, B) Light Prime Response in R(G, B) Light Cross Response in R(G, B) Light Color Frame Test

  34. Prime Response in R Light (Light R Mean – Dark R Mean) / (Light Overall Mean – Dark Overall Mean) Cross Response in R Light ((Light G(B) Mean – Dark G(B) Mean) / (Light R Mean – Dark R Mean)

  35. Micro Lens

  36. Micro-Lens On-chip Micro Lens Color Filter Photo Shielding Film Sensor Die

  37. Normalize Micro Lens Shift By low pass filter:

  38. Solution1 for Micro Lens Shift By HW(Pupil Lens)

  39. Solution2 for Micro Lens Shift By SW Image Uniformize × ÷ ÷

  40. System Structure IP Module Illuminator(Light Source) Main System Analog Module(option) Debug Tool CIS Test System

  41. Main System Sync Control & Result Control Signal Sync IP Module (Frame Grabber included) Sync DUT Data Bus Light Source Data Analog Module Analog Waveform Prober / Handler System Structure

  42. Docking method: Light source connect with testhead directly

  43. AC Power Docking with Prober (Cable system) Testhead Cable system Top View PIB (Prober Interface Board) illuminator Prober

  44. Docking with Handler (Cable system) Side View Cable system DIB (Device Interface Board Handler Testhead illuminator

  45. Test Head IP Module 32 pins IP Cabinet Digital max. Image Frame Grabber Board IP Data I/F CRT & Keyboard IP Controller 5pins: Timing Control & Setup Tester Cabinet CRT & Keyboard DC Test Functions Master Clocks Digital Pins Digital Test Functions DC Pins DUT LF/HF/VHF Pins Analog Test Functions UIP TC Time Measurement Light Source Controller IP Module

  46. Illuminator Light Source Structure AGC

  47. Lamp AGC

  48. Illuminator Specification • Multi Sites (CP: Depend on Illuminator Area Size • FT: Depend on Illuminator multi sites Design) • Area: Area Sensor >25*25 mm Line Sensor > 100*100 mm • LUX: W > 1000 LUX • Uniformity: < 3% For Blue Light

  49. R/G/B/W Light (option) • Pattern Turret (option) • Shutter Turret • F-number • Calibration Table • External / Internal Type

  50. (Lx max - Lx min) ((Lx max + Lx min)/2) / 2 Uniformity (+/- %) = *100 Light Source Uniformity Measure Method :

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